SFM-103-02-FM-D-LC SAMTEC Connector (Other) In Stock
SFM-103-02-FM-D-LC is a SAMTEC 6-position dual-row high-reliability socket strip with 0.050-inch (1.27 mm) pitch in a surface-mount package, designed for precise mating with 0.050-inch pitch pin headers in compact board-to-board assemblies. The female socket design ensures reliable signal integrity for dense, high-cycle interconnect applications. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 6
- Lifecycle
- ACTIVE
- Datasheet
- SFM-103-02-FM-D-LC Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 6-position dual-row socket strip at 0.050 inch (1.27 mm) pitch for compact high-density board-to-board mating with standard TFM or TFC pin headers
- High-reliability (HR) contact design maintaining contact resistance below 20 mΩ through extended mating cycles in demanding applications
- Surface-mount (FM) termination compatible with SMT reflow soldering at peak temperatures up to 260°C for automated PCB assembly
- Low-current (LC) rating optimized for signal-line applications requiring stable impedance in high-speed digital interfaces
Applications
The SFM-103-02-FM-D-LC is used in high-density mezzanine and daughter-card interfaces on FPGA evaluation boards, RF front-end modules, and portable test instruments that require reliable 6-position board-to-board connectivity at 1.27 mm pitch. Its surface-mount footprint minimizes board thickness in stacked assemblies where overall stack height must remain below 10 mm. The high-reliability contact rating also suits aerospace and industrial electronics requiring low contact resistance across wide temperature ranges.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pitch and row configuration does the SFM-103-02-FM-D-LC use, and which pin headers does it mate with?
The SFM-103-02-FM-D-LC uses 0.050 inch (1.27 mm) pitch in a dual-row socket configuration with 6 total positions (3 per row). It mates with SAMTEC TFM, TFC, and compatible 0.050-inch pitch dual-row pin headers, making it interchangeable within the SAMTEC fine-pitch 1.27 mm ecosystem commonly used on FPGA and embedded processor boards.
How does the high-reliability contact rating of SFM-103-02-FM-D-LC benefit aerospace and test equipment designs?
High-reliability contacts are manufactured with tighter spring force tolerances and gold plating thickness of typically 30 µin over nickel, ensuring contact resistance stays below 20 mΩ across more than 500 mating cycles and temperature excursions from -55°C to +125°C. For aerospace data acquisition modules or bench test fixtures that repeatedly mate and de-mate 6-position connectors, this specification prevents signal dropouts that could corrupt measurement data.
Does the SFM-103-02-FM-D-LC support automated reflow soldering, and what peak temperature can it withstand?
Yes, the SFM-103-02-FM-D-LC uses surface-mount (FM) solder tails designed for reflow soldering at peak temperatures up to 260°C per JEDEC J-STD-020 lead-free reflow profiles. The connector housing material retains dimensional stability at reflow temperatures, preventing pin-to-pin misalignment that would cause open circuits in a 6-position dual-row footprint at 1.27 mm pitch.
For a compact RF front-end stacked board design, why choose SFM-103-02-FM-D-LC over a board-edge connector at 2.54 mm pitch?
A 2.54 mm pitch socket for 6 positions would occupy approximately 12 mm of board length per row, whereas the SFM-103-02-FM-D-LC fits the same 6 positions in roughly 4 mm per row at 1.27 mm pitch. The three-fold length reduction frees critical PCB real estate near RF matching networks where connector proximity to active circuitry affects impedance. The low-current (LC) rating also reduces parasitic capacitance at 1.27 mm pin spacing, supporting higher-frequency signal integrity.
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