SEM-115-02-03.0-H-D SAMTEC Connector (Other) In Stock

SAMTEC SEM-115-02-03.0-H-D is a 30-position, 0.80 mm pitch Micro Tiger Eye socket strip with dual-row board stacking design, beryllium copper contacts with 30 micro-inch gold plating, and enhanced-wipe ELP technology for reliable, low-resistance mating in high-density applications.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
SEM-115-02-03.0-H-DOther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
30
Lifecycle
ACTIVE
Category
Connector
Price
From $3.3290(MOQ 1)
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

What are the key features of SEM-115-02-03.0-H-D?

  • 30 positions in dual-row configuration at 0.80 mm pitch for high-density board stacking
  • Tiger Eye contact technology with Enhanced Length of Probe (E.L.P.) for superior wipe and reliability
  • Beryllium copper contacts with 30 micro-inch gold over 50 micro-inch nickel mating finish
  • Female socket strip designed for board-to-board stacking connector applications
  • Gold flash termination with nickel barrier for robust soldering and long-term conductivity
  • RoHS-compliant, lead-free construction supporting green manufacturing requirements

What is SEM-115-02-03.0-H-D used for?

The SEM-115-02-03.0-H-D is designed for high-density board-to-board stacking applications in compact embedded systems, communications modules, and portable medical devices where a 0.80 mm pitch connector with reliable gold-plated contacts is essential. Its Tiger Eye socket technology and ELP feature ensure consistent low-resistance mating cycles, making it ideal for applications that require repeated mating or are subject to vibration and thermal cycling.

What are the specifications of SEM-115-02-03.0-H-D?

Pbfree CodeYes
Factory Lead Time9 Weeks, 6 Days
YTEOL8.68
Additional FeatureE.L.P.,TIGER EYE
Body/Shell StyleSOCKET
Connector TypeBOARD STACKING CONNECTOR
Contact Finish MatingGOLD (30) OVER NICKEL (50)
Contact Finish TerminationGold Flash (Au) - with Nickel (Ni) barrier
Contact GenderFEMALE
Contact MaterialBERYLLIUM COPPER
DIN ConformanceNO
Filter FeatureNO
IEC ConformanceNO
JESD-609 Codee4
MIL ConformanceNO
Mating InformationMULTIPLE MATING PARTS AVAILABLE
Mixed ContactsNO
Mounting StyleSTRAIGHT
Mounting TypeBOARD
Number Of ConnectorsONE
Number of Rows Loaded2
OptionGENERAL PURPOSE
Terminal Pitch0.8mm
Termination TypeSURFACE MOUNT
Total Number of Contacts30
PackageOther

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
ECCNEAR99
HTS Code8536.69.40.40
Country of OriginCosta Rica, Mainland China

Where can I find the SEM-115-02-03.0-H-D datasheet?

SEM-115-02-03.0-H-D Datasheet Download

Official datasheet from SAMTEC

What are equivalent replacements for SEM-115-02-03.0-H-D?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What contact material and plating specification does the SEM-115-02-03.0-H-D use, and why does it matter for signal reliability?

The SEM-115-02-03.0-H-D uses beryllium copper contacts with 30 micro-inch gold over 50 micro-inch nickel on the mating surface and a gold flash with nickel barrier on the termination side. This plating stack delivers low contact resistance and excellent corrosion resistance across 30 positions, supporting long mating life in high-reliability board stacking designs.

How does the Tiger Eye E.L.P. technology in the SEM-115-02-03.0-H-D improve connector performance versus standard socket strips?

The Enhanced Length of Probe (E.L.P.) feature extends the contact wipe distance during mating, which removes surface oxides and debris across all 30 contacts at 0.80 mm pitch. This design reduces insertion resistance variation and improves reliability over many mating cycles compared to conventional socket strips without extended wipe.

Which board-to-board stack heights and PCB assembly orientations is the SEM-115-02-03.0-H-D intended to support?

The SEM-115-02-03.0-H-D is specified with a 3.0 mm stack height (as indicated in the MPN suffix) and is configured for horizontal dual-row (H-D) board stacking, providing a controlled 3.0 mm board separation across 30 positions at 0.80 mm pitch for compact embedded PCB assemblies.

Is the SEM-115-02-03.0-H-D compliant with RoHS regulations, and what is the typical lead time buyers should plan for?

Yes, the SEM-115-02-03.0-H-D is lead-free and RoHS-compliant per SAMTEC's Pbfree Code specification. Procurement teams should note that the factory lead time is approximately 9 weeks and 6 days, so sourcing through authorized distributors with buffer stock is advisable for production schedules requiring shorter delivery windows.

In which industries and applications is a 0.80 mm pitch, 30-position socket strip like the SEM-115-02-03.0-H-D most commonly specified?

The SEM-115-02-03.0-H-D's 0.80 mm pitch and 30-position dual-row format are commonly specified in portable medical instrumentation, wireless communication modules, and compact industrial computing boards where board real estate is limited. The Tiger Eye socket provides the mating reliability needed in applications with expected 50 or more mating cycles and vibration exposure.

Why Buy from FindMyChip

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Verified supply chain with full traceability & inspection
Competitive Pricing
Factory-direct from China distributors, low MOQ
Fast Shipping
DHL Express 3–5 days · FedEx/UPS 5–7 days worldwide
Quality Guaranteed
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About SAMTEC

SAMTEC is a leading electronic component manufacturer. FindMyChip sources SAMTEC ICs directly from authorized China distributors, offering competitive pricing and reliable stock.

AvailabilityIn Stock
Reference Price (USD)
From $3.3290
Buy from 1pc · Factory-direct pricing
Qty.Unit PriceExt. Price
1+$7.8600$7.86
77+$7.6500$589.05
102+$7.5000$765.00
408+$5.5560$2266.85
918+$4.4420$4077.76
2958+$3.3290$9847.18
pcs
Unit price: $7.8600 · Total: $7.86

In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

Their engineering team helped us find a pin-compatible alternative when our original MCU went EOL.

MR
Marco Rossi
CTO, AutoDrive Systems, Italy