SEAM-50-02.0-L-08-2-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC SEAM-50-02.0-L-08-2-A-K-TR is a 100-position dual-row board stacking edge mount connector with 2.00 mm pitch and 8 mm stack height. Gold-over-nickel contacts and RoHS-compliant construction ensure reliable high-density interconnects. From $5.50, in stock worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 400
- Lifecycle
- ACTIVE
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 100-position dual-row board stacking connector at 2.00 mm pitch with 8 mm configurable stack height for precise board separation
- Gold (10 µin) over nickel (50 µin) contact finish delivers low contact resistance and durability across repeated mating cycles
- ELP and SAMARRAY edge linking features enable modular array configurations for scalable high-density interconnect systems
Applications
The SEAM-50-02.0-L-08-2-A-K-TR is designed for board stacking applications in high-performance computing modules, FPGA carrier boards, and data acquisition systems where 100-pin dual-row connectivity at 2.00 mm pitch is required. Its 8 mm stack height provides controlled board-to-board spacing, suitable for server blade modules and industrial computing platforms. The peg board mounting option combined with tape-and-reel packaging supports accurate placement and reliable retention during automated SMT assembly.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 1Week |
| YTEOL | 8.75 |
| Additional Feature | ELP; FINAL INCH; SAMARRAY; SEARRAY |
| Board Mounting Option | PEG |
| Body Breadth | 0.478inch |
| Body Depth | 0.221inch |
| Body Length | 2.696inch |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Mating | GOLD (10) OVER NICKEL (50) |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | COPPER ALLOY |
| Contact Pattern | RECTANGULAR |
| Contact Style | CENTRONIC |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulator Color | BLACK |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.05inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 8 |
| Number of Rows Loaded | 8 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 1.27mm |
| Plating Thickness | 10u inch |
| Rated Current (Signal) | 2.7A |
| Terminal Pitch | 1.27mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 400 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Costa Rica, USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What stack height and pin count does the SEAM-50-02.0-L-08-2-A-K-TR provide for board stacking designs?
The SEAM-50-02.0-L-08-2-A-K-TR provides 100 positions in a dual-row layout with a 2.00 mm pitch and an 8 mm board-to-board stack height, making it suitable for high-density stacked PCB assemblies in computing and instrumentation applications.
How do the ELP and SAMARRAY features of the SEAM-50-02.0-L-08-2-A-K-TR benefit large-scale interconnect designs?
The ELP (Edge Linking Pin) and SAMARRAY features allow multiple SEAM connectors to be mechanically linked end-to-end, creating scalable arrays that can exceed 100 positions per axis, enabling very high density board stacking for server blade and FPGA system interconnects.
What contact finish does the SEAM-50-02.0-L-08-2-A-K-TR use and how does it affect long-term reliability?
The connector uses 10 µin gold over 50 µin nickel contact plating on mating surfaces, providing excellent corrosion resistance and supporting more than 200 mating cycles without significant contact resistance increase, suitable for serviceable boards requiring periodic removal.
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