SEAM-20-03.5-S-06-2-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC SEAM-20-03.5-S-06-2-A-K-TR is a 20-position single-row board stacking connector with 3.5 mm stacking height, gold 30 micro-inch over nickel contacts, and peg mounting for secure PCB alignment. RoHS-compliant, tape-and-reel, available worldwide.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 120
- Lifecycle
- ACTIVE
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 20-position single-row board stacking at 3.5 mm height with 30 micro-inch gold over nickel contacts for reliable mating
- Peg mounting option providing mechanical stability and accurate board-to-board alignment during assembly
- Tape-and-reel packaging with SAMARRAY and SEARRAY features supporting high-volume automated SMT production
Applications
The SEAM-20-03.5-S-06-2-A-K-TR is designed for board stacking applications in compact embedded modules, wireless communication cards, and industrial computing platforms requiring a 3.5 mm stack height. Its 20-position gold-plated contacts support high-speed signal and power routing between stacked boards in server blades, FPGA mezzanine cards, and IoT gateway modules.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 1Week |
| YTEOL | 8.75 |
| Additional Feature | ELP; FINAL INCH; SAMARRAY; SEARRAY |
| Board Mounting Option | PEG |
| Body Breadth | 0.378inch |
| Body Depth | 0.28inch |
| Body Length | 1.196inch |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Mating | GOLD (30) OVER NICKEL (50) |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | COPPER ALLOY |
| Contact Pattern | RECTANGULAR |
| Contact Style | CENTRONIC |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulator Color | BLACK |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.05inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 6 |
| Number of Rows Loaded | 6 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 1.27mm |
| Plating Thickness | 30u inch |
| Rated Current (Signal) | 2.7A |
| Terminal Pitch | 1.27mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 120 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Costa Rica, USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What stacking height and contact finish does the SEAM-20-03.5-S-06-2-A-K-TR provide?
The SEAM-20-03.5-S-06-2-A-K-TR provides a 3.5 mm board stacking height with contacts finished in 30 micro-inch gold over 50 micro-inch nickel. The gold finish ensures low contact resistance and excellent corrosion resistance, supporting reliable electrical performance across multiple mating cycles in board stacking applications with tight height constraints.
How does the peg mounting feature of SEAM-20-03.5-S-06-2-A-K-TR improve assembly quality?
The peg board mounting option mechanically anchors the SEAM-20-03.5-S-06-2-A-K-TR to the PCB through alignment pegs that fit into corresponding holes on the board. This prevents connector movement during reflow soldering, ensuring all 20 contacts maintain proper pad registration and eliminating misalignment defects in high-volume automated assembly operations.
For which system types is the SEAM-20-03.5-S-06-2-A-K-TR a preferred stacking interconnect choice?
The SEAM-20-03.5-S-06-2-A-K-TR is preferred for board stacking in compact embedded computing modules, mezzanine add-in cards, and wireless communication modules where a 3.5 mm stack height and 20-position signal capacity are required. Its SAMARRAY and ELP features also make it compatible with SAMTEC high-density array connector ecosystems used in telecom blades and FPGA evaluation kits.
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