SEAF-40-06.0-S-06-2-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC SEAF-40-06.0-S-06-2-A-K-TR is a 240-position SEARAY high-speed, high-density open-pin-field array socket with .050" pitch and 6.0 mm stacking height for board-to-board applications. Gold-plated contacts over nickel ensure reliable signal integrity at high data rates. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 240
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 240-position open-pin-field array with .050" (1.27 mm) pitch enabling maximum routing flexibility for high-density board stacking
- 30 µin gold over 50 µin nickel contact finish delivering low contact resistance and superior corrosion resistance for high-reliability applications
- 6.0 mm board-stacking height with female socket design supporting SEARAY mating system for high-speed differential signal transmission
Applications
The SEAF-40-06.0-S-06-2-A-K-TR is designed for high-speed, high-density board-to-board stacking applications in FPGA development boards, server backplanes, and advanced communications equipment. Its 240-position open-pin-field layout allows designers to assign signal, power, and ground pins freely, optimizing impedance control for multi-gigabit SerDes interfaces. The 6.0 mm stack height accommodates component clearance requirements in compact multi-board system architectures.
Specifications
| Pbfree Code | Yes |
| YTEOL | 8.75 |
| Body/Shell Style | SOCKET |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Mating | GOLD (30) OVER NICKEL (50) |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | FEMALE |
| Contact Material | COPPER ALLOY |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number of Rows Loaded | 6 |
| Option | GENERAL PURPOSE |
| Terminal Pitch | 1.27mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 240 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Malaysia, USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and what pitch does the SEAF-40-06.0-S-06-2-A-K-TR provide for board-to-board connections?
The SEAF-40-06.0-S-06-2-A-K-TR provides 240 positions arranged on a .050" (1.27 mm) pitch open-pin-field array. This high-density configuration supports routing of differential pairs, single-ended signals, and power pins across a compact board stacking interface at a 6.0 mm stacking height.
What contact finish does SEAF-40-06.0-S-06-2-A-K-TR use, and how does it affect signal reliability?
The mating contacts of SEAF-40-06.0-S-06-2-A-K-TR are finished with 30 µin of gold over 50 µin of nickel, providing low contact resistance and high corrosion resistance. Gold plating at this thickness ensures reliable electrical performance over thousands of mating cycles, critical for high-speed differential signal integrity at multi-Gbps data rates.
Which high-speed signal applications benefit most from the SEAF-40-06.0-S-06-2-A-K-TR open-pin-field design?
The open-pin-field layout of SEAF-40-06.0-S-06-2-A-K-TR is ideal for FPGA mezzanine cards, high-speed backplane daughter cards, and SerDes-based communication boards operating at data rates up to 56 Gbps per differential pair. Designers can freely assign up to 240 pins for signal, power, and ground, optimizing impedance and crosstalk control without a fixed pinout constraint.
What stacking height does SEAF-40-06.0-S-06-2-A-K-TR provide, and when is this height preferred over shorter alternatives?
The SEAF-40-06.0-S-06-2-A-K-TR provides a 6.0 mm board stacking height, which accommodates taller components such as voltage regulators, inductors, or heat sinks mounted on the lower PCB. This 6.0 mm height is preferred in multi-board systems with component height clearance requirements, compared to shorter 2.0 mm or 4.0 mm stack options used in ultra-compact designs.
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