SEAF-30-07.5-STL-08-2-A-GP-K-TR SAMTEC Connector (Other) In Stock
SAMTEC SEAF-30-07.5-STL-08-2-A-GP-K-TR is a 240-position SEARAY high-speed high-density open-pin-field array socket with 0.050" pitch and 7.5 mm stack height, incorporating a straddle-mount lead (STL) termination style with gold-plated contacts and tape-and-reel packaging for automated SMT assembly.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 240
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 240-position open-pin-field array at 0.050" (1.27 mm) pitch for maximum routing flexibility in high-density systems
- 7.5 mm board-to-board stack height for precise mezzanine card separation in multi-layer assemblies
- Straddle-mount lead (STL) termination style allowing mounting at the PCB edge for space-efficient layouts
- Gold-plated (GP) contacts providing low contact resistance and reliable high-frequency signal integrity
- SEARAY high-speed architecture supporting multi-gigabit differential pair routing at PCIe and SRIO speeds
- Tape-and-reel (-TR) packaging enabling automated pick-and-place SMT assembly for volume production
Applications
The SEAF-30-07.5-STL-08-2-A-GP-K-TR is designed for high-speed mezzanine card and board-edge interconnect applications in FPGA platforms, high-performance computing blades, and telecom line cards requiring multi-gigabit data transfer. The straddle-mount lead (STL) option combined with the 240-pin open-pin-field layout at 0.050" pitch enables flexible PCB edge mounting for systems where standard surface-mount placement conflicts with chassis or heatsink constraints.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What distinguishes the STL variant of SEAF-30-07.5-STL-08-2-A-GP-K-TR from the standard SEAF version?
The STL designation indicates a straddle-mount lead termination style, where the connector leads straddle the PCB edge rather than mounting entirely on the top surface. This allows the 240-pin SEARAY socket to be positioned at the card edge, saving board area and enabling chassis-edge mating configurations not possible with standard surface-mount placement at 0.050" pitch.
What stack height does this SEARAY socket define, and why is precise spacing critical for high-speed signal integrity?
The 7.5 mm stack height specifies the exact board-to-board separation when this socket mates with a SEAM header. Maintaining a controlled 7.5 mm gap is important for high-speed signal integrity because stub length and via length within the 0.050-inch pitch contact field affect impedance continuity at data rates above 5 Gbps per lane.
How many differential pairs can a 240-pin SEARAY array at 0.050" pitch accommodate for PCIe or SRIO links?
With 240 pins in an open-pin-field array at 0.050" pitch, engineers can assign up to 120 differential pairs when all pins are used for differential signaling. A typical PCIe Gen 3 x16 link needs 32 differential pairs for data plus reference clocks and sideband signals, leaving over 80 pins for power, ground, and other protocols within this single 240-pin SEARAY interface.
How does the gold-plated contact finish on SEAF-30-07.5-STL-08-2-A-GP-K-TR affect high-frequency performance compared to standard tin finish?
Gold plating on the GP-designated contacts provides lower and more stable contact resistance than tin, which is critical at high frequencies where even small resistance variations degrade insertion loss across a 240-pin array. At signal rates above 3 Gbps per differential pair, gold-plated contacts help maintain consistent eye-diagram margins across all channels in the SEARAY array.
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