SAM9X60D1GT-I/4FB Microchip Integrated Circuit (BGA) In Stock
Microchip SAM9X60D1GT-I/4FB is a System-in-Package MPU integrating an ARM926EJ-S RISC processor with embedded DDR memory and NAND flash in a 233-ball TFBGA package. It provides a complete single-chip Linux-capable compute platform for industrial and IoT applications. Available from authorized distributors with 13-week lead time and worldwide shipping.
- Manufacturer
- Microchip
- Package
- BGA
- Pin Count
- 233
- Lifecycle
- ACTIVE
- Datasheet
- SAM9X60D1GT-I/4FB Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $7.7625(MOQ 1)
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SAM9X60D1GT-I/4FB?
- SAM9X60 System-in-Package integrating ARM926EJ-S MPU, DDR DRAM, and NAND flash in a single 233-ball TFBGA die
- RISC architecture running Linux-capable embedded OS at up to 600 MHz for industrial IoT gateway and HMI applications
- SIP design eliminates separate DRAM and flash ICs, shrinking BOM and PCB footprint by up to 60% versus discrete solutions
- Industrial-grade qualification introduced in 2019 with 19-year estimated end-of-life for long-lifetime embedded designs
What is SAM9X60D1GT-I/4FB used for?
The SAM9X60D1GT-I/4FB targets industrial IoT gateways, smart meters, and medical monitoring devices that require a Linux-capable embedded processor with on-package memory for compact, reliable system designs. Its System-in-Package architecture with integrated DDR and NAND eliminates external memory routing complexity, reducing PCB layer count and simplifying signal integrity validation on 4-layer to 6-layer boards. The 19-year product longevity commitment from Microchip makes it a strong choice for designs requiring 10-year or longer field deployment with assured component availability.
What are the specifications of SAM9X60D1GT-I/4FB?
| Manufacturer Package Code | TFBGA-233 |
| Factory Lead Time | 13Weeks |
| Date Of Intro | 2019-09-23 |
| YTEOL | 19 |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | 5A992.C |
| HTS Code | 8542.31.00.01 |
| Country of Origin | Taiwan |
Where can I find the SAM9X60D1GT-I/4FB datasheet?
SAM9X60D1GT-I/4FB Datasheet DownloadOfficial datasheet from Microchip
What are equivalent replacements for SAM9X60D1GT-I/4FB?
Compatible alternatives and drop-in replacements for SAM9X60D1GT-I/4FB:
Frequently Asked Questions
What makes the SAM9X60D1GT-I/4FB a System-in-Package, and how does that reduce design complexity?
The SAM9X60D1GT-I/4FB integrates the ARM926EJ-S MPU core alongside DDR DRAM and NAND flash memory dies within a single 233-ball TFBGA package, eliminating the need for separate memory ICs and their associated high-speed routing. This SIP architecture can reduce PCB layer count by 2 layers and cut BOM component count by 5 to 10 parts in typical Linux single-board designs.
What is the factory lead time for SAM9X60D1GT-I/4FB, and how should procurement teams plan for this?
The SAM9X60D1GT-I/4FB has a factory lead time of 13 weeks, requiring procurement teams to place orders more than 3 months before scheduled production starts. Given the 13-week window, design teams should align prototype tape-out timelines with distributor order placement to avoid production line stoppages during ramp-up phases.
Which embedded operating systems can run on the SAM9X60 platform, and what development ecosystem does it offer?
The SAM9X60 ARM926EJ-S RISC processor supports mainline Linux kernel 5.x, Buildroot, and Yocto Project distributions, with Microchip providing a reference BSP with drivers for Ethernet MAC, USB Host/Device, SPI, I2C, and CAN interfaces. This mature ecosystem allows development teams to reuse open-source middleware for protocols like MQTT, Modbus TCP, and OPC-UA in industrial IoT gateway firmware within weeks of board bring-up.
How does the SAM9X60D1GT-I/4FB compare to a discrete SAM9X60 MPU plus external DDR and NAND components?
Using the SIP variant avoids sourcing 3 separate components—the MPU, a 128 MB DDR2 SDRAM, and a NAND flash device—and eliminates their high-speed routing requiring 50-ohm controlled-impedance traces. The 233-ball TFBGA footprint of the SIP is smaller than the combined pad area of discrete ICs, enabling a more compact 4-layer PCB versus the 6-layer or 8-layer boards typically needed for discrete DDR routing in industrial designs.
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About Microchip
Microchip is a leading electronic component manufacturer. FindMyChip sources Microchip ICs directly from authorized China distributors, offering competitive pricing and reliable stock.
More from Microchip
| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 1+ | $7.9600 | $7.96 |
| 1000+ | $7.9500 | $7950.00 |
| 16000+ | $7.7625 | $124200.00 |
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