SAM9X60D1G-I/4FB Microchip Display (BGA) In Stock
The SAM9X60D1G-I/4FB is a Microchip SAM9X60 System-in-Package RISC microprocessor integrating 1 GB DDR2 DRAM and 4 GB NAND Flash in a compact TFBGA-233 package. Designed for Linux-capable embedded applications requiring on-package memory. Available from stock with worldwide shipping.
- Manufacturer
- Microchip
- Package
- BGA
- Pin Count
- 233
- Lifecycle
- ACTIVE
- Datasheet
- SAM9X60D1G-I/4FB Datasheet PDF
- Category
- Display
- Price
- From $7.7100(MOQ 1)
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- SAM9X60 RISC MPU with 1 GB DDR2 DRAM integrated in the same package, eliminating external DRAM routing complexity
- On-package 4 GB NAND Flash supports Linux OS and application storage without additional external Flash ICs
- TFBGA-233 System-in-Package format shrinks the PCB footprint for Linux-capable embedded designs compared to discrete MPU plus memory solutions
Applications
The SAM9X60D1G-I/4FB is designed for compact embedded Linux platforms in industrial HMI, medical instruments, and IoT gateway devices requiring a full MPU subsystem with on-package memory. Its integrated 1 GB DDR2 DRAM and 4 GB NAND Flash reduce PCB complexity and signal integrity challenges associated with routing high-speed memory buses on multi-layer boards. The TFBGA-233 package enables dense module designs where a discrete MPU plus separate memory ICs would consume prohibitive board area.
Specifications
| Manufacturer Package Code | TFBGA-233 |
| Factory Lead Time | 13Weeks |
| Date Of Intro | 2019-09-23 |
| YTEOL | 19 |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | 5A992.C |
| HTS Code | 8542.31.00.01 |
| Country of Origin | Taiwan |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for SAM9X60D1G-I/4FB:
Microchip Technology Inc ARM926 MPU,BGA,IND TEMP,1GBit DDR2,T&R
Frequently Asked Questions
How does the SAM9X60D1G-I/4FB System-in-Package integration reduce PCB design complexity compared to discrete MPU plus DRAM solutions?
By integrating 1 GB DDR2 DRAM and 4 GB NAND Flash within the TFBGA-233 package alongside the SAM9X60 RISC core, the SAM9X60D1G-I/4FB eliminates the need to route high-speed DDR2 data lines (typically 32 bits wide at up to 200 MHz DDR clock) across the PCB. This removes the need for controlled-impedance trace matching, stub length tuning, and separate DRAM decoupling networks that a discrete MPU-plus-DIMM approach requires.
What storage capacity does SAM9X60D1G-I/4FB provide and is it sufficient for a Buildroot Linux image with application firmware?
The SAM9X60D1G-I/4FB includes 4 GB of on-package NAND Flash, which is sufficient to store a Buildroot Linux root filesystem (typically under 200 MB), a kernel image (around 5 MB), and hundreds of megabytes of application binaries or data logs within the same package. The 1 GB DDR2 DRAM provides ample RAM headroom for Linux with user-space daemons running simultaneously.
For an industrial HMI design targeting 10-year availability, how does SAM9X60D1G-I/4FB compare to Raspberry Pi CM modules on longevity?
The SAM9X60D1G-I/4FB is an industrial-grade RISC MPU with a YTEOL of 19 years, indicating long-term supply availability through at least 2038, far exceeding the typical 5-year lifecycle of commercial compute modules like Raspberry Pi CM4. This extended availability reduces redesign risk for industrial HMI and medical instrument programs requiring component supply continuity beyond 10-year production runs.
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| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 1+ | $7.7200 | $7.72 |
| 119+ | $7.7100 | $917.49 |
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