QTE-020-07-STL-D SAMTEC Connector (Other) In Stock
SAMTEC QTE-020-07-STL-D is a 20-position Q Strip high-speed ground-plane dual-row header with 0.80 mm pitch and stainless-steel hardware for enhanced durability. It supports multi-gigabit board-to-board interconnections in high-density PCB stack-up designs. Available in stock worldwide with global shipping options.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 40
- Lifecycle
- ACTIVE
- Datasheet
- QTE-020-07-STL-D Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of QTE-020-07-STL-D?
- 20-position dual-row Q Strip header at 0.80 mm pitch with integrated ground plane for superior high-frequency signal integrity
- Stainless steel (STL) hardware provides corrosion resistance and increased mechanical strength for repeated mating cycles in harsh environments
- High-speed ground-plane architecture suppresses crosstalk between adjacent signal pairs at multi-GHz data rates
- Compact 0.80 mm pitch dual-row layout maximizes connector density while maintaining controlled impedance for differential signal pairs
What is QTE-020-07-STL-D used for?
The QTE-020-07-STL-D is designed for high-speed board stacking in networking switches, FPGA development platforms, and radar signal processing modules where 20 contacts at 0.80 mm pitch with integrated ground-plane shielding are required. The stainless-steel hardware makes it suitable for industrial and defense electronics that require robust connectors capable of thousands of mating cycles. It is also used in high-frequency test fixture boards where maintaining signal integrity above 3 GHz across 20 differential signal paths is critical.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the QTE-020-07-STL-D datasheet?
QTE-020-07-STL-D Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for QTE-020-07-STL-D?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What distinguishes the STL variant of QTE-020-07-STL-D from a standard QTE-020-07 header?
The STL suffix designates stainless-steel hardware, replacing standard plated steel with corrosion-resistant stainless steel on the connector's retention and alignment features. This upgrade is significant in humid, salt-spray, or chemically active environments where standard steel would corrode after fewer than 500 mating cycles, while the stainless-steel version maintains dimensional stability and contact normal force over the full operating temperature range of -55°C to +125°C.
For a high-speed networking line card, how does the QTE-020-07-STL-D's ground-plane architecture help at multi-GHz frequencies?
The Q Strip ground-plane construction embeds a continuous ground reference between signal rows, providing controlled impedance for each of the 20 signal contacts at 0.80 mm pitch. This architecture reduces inter-pair crosstalk by more than 10 dB compared to open-pin-field connectors at frequencies above 3 GHz, enabling reliable transmission of differential pairs at data rates up to 10 Gbps per channel in compact board-stack configurations.
How does the QTE-020-07-STL-D compare to QTE-020-03-C-D in stack-height and application fit?
Both connectors share a 20-position, 0.80 mm pitch dual-row Q Strip architecture, but the -07 height designation provides a taller mated stack height (approximately 7 mm) compared to the -03 variant's 3 mm, accommodating thicker interposers, daughter cards, or heat spreaders between boards. The QTE-020-07-STL-D is preferred in rack-mount server designs where a 7 mm board-to-board gap allows airflow, while the -03 variant suits ultra-thin portable modules.
Which reflow and assembly processes are compatible with the QTE-020-07-STL-D?
The QTE-020-07-STL-D is designed for surface-mount assembly using standard 260°C peak lead-free reflow profiles per IPC/JEDEC J-STD-020. The 0.80 mm pitch contact pads require fine-pitch solder paste stencils with apertures of approximately 0.40 mm x 0.60 mm to achieve adequate solder volume without bridging. Post-reflow, the stainless-steel retention hardware locks the mated pair until at least 5 N of extraction force is applied, preventing accidental unmating during board handling.
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