QTE-020-03-C-D SAMTEC Connector (Other) In Stock
SAMTEC QTE-020-03-C-D is a 20-position Q Strip high-speed ground-plane board-stacking header with 0.80 mm pitch and gold-plated mating contacts. It supports high-frequency signal integrity in compact board-to-board stack-up designs. Available in stock worldwide with global shipping options.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 40
- Lifecycle
- ACTIVE
- Datasheet
- QTE-020-03-C-D Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 20-position dual-row board-stacking connector at 0.80 mm pitch for dense, high-speed PCB-to-PCB interconnections
- Gold-plated mating contacts with phosphor-bronze contact material for low insertion loss and extended durability
- Integrated ground-plane design in Q Strip architecture suppresses crosstalk and supports high-frequency signal integrity
- ELP (Extra Low Profile) additional feature option for space-constrained stacked-board assemblies
Applications
The QTE-020-03-C-D is designed for high-speed board-stacking applications in wireless communication modules, networking line cards, and FPGA evaluation platforms where 0.80 mm pitch ground-plane connectors are required. The gold-finished 20-position interface maintains signal integrity at multi-gigabit data rates in tightly coupled board stack configurations. It is well suited for compact industrial computing and medical imaging systems demanding low-profile, high-reliability interconnects.
Specifications
| Pbfree Code | Yes |
| YTEOL | 8.68 |
| Additional Feature | ELP |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Mating | GOLD |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| Terminal Pitch | 0.8mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 40 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What are the pitch and contact specifications of the QTE-020-03-C-D board-stacking connector?
The QTE-020-03-C-D offers 20 positions at a 0.80 mm pitch in a dual-row ground-plane header format. Mating contacts are gold-plated phosphor-bronze, while termination contacts use tin (Sn) over a nickel (Ni) barrier. This combination delivers low contact resistance and reliable mating cycles suited to multi-gigabit-per-second board-to-board interconnections.
Which high-speed system designs benefit from using the QTE-020-03-C-D Q Strip header?
Networking line cards, FPGA daughtercards, and wireless communication modules operating at multi-GHz frequencies benefit most from this connector. The integrated ground-plane structure suppresses crosstalk between signal pairs, maintaining eye-diagram integrity at data rates above 3 Gbps across the 20-position interface. The 0.80 mm pitch also minimizes board real estate compared to 1.00 mm pitch alternatives.
How does the ELP feature on the QTE-020-03-C-D affect board-to-board stack height?
The ELP (Extra Low Profile) designation reduces the unmated connector height, allowing designers to achieve tighter board-to-board stack-up dimensions — typically under 5 mm overall — compared to standard profile Q Strip connectors. This is critical in portable medical devices, handheld instruments, and compact industrial controllers where total PCB assembly height is constrained to less than 10 mm.
Is the QTE-020-03-C-D compatible with standard lead-free reflow soldering?
Yes, the QTE-020-03-C-D is marked Pb-free and is compatible with standard 260°C peak lead-free reflow profiles. The tin-over-nickel termination finish withstands repeated thermal excursions without solder joint degradation. SAMTEC's ELP board-stacking headers are also designed to maintain dimensional tolerances of ±0.05 mm after reflow, ensuring accurate mating with the corresponding Q Strip receptacle.
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