QRF8-026-05.0-L-D-A-GP SAMTEC Connector (Other) In Stock

Samtec QRF8-026-05.0-L-D-A-GP is a 26-position dual-row board stacking connector with 5.0 mm stack height, designed for high-speed board-to-board interconnect with Edge Rate signal integrity technology. Features gold-plated contacts, peg board mounting, and RoHS compliance for use in dense stack-up telecom and computing assemblies. Available with GP plating for demanding signal integrity applications.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
QRF8-026-05.0-L-D-A-GPOther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
55
Lifecycle
ACTIVE
Category
Connector
Temp Range
-55.0°C to 125.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • 26-position dual-row board stacking connector with 5.0 mm stack height
  • Edge Rate (E.L.P.) technology for high-speed differential signal integrity
  • Gold-plated (GP) contacts minimizing insertion loss at high frequencies
  • Peg board mounting option for precise mechanical alignment during assembly
  • RoHS compliant with Pb-free termination for global market compatibility
  • Body length 1.116 inch with 0.246 inch depth for compact stack-up designs

Applications

The QRF8-026-05.0-L-D-A-GP is designed for high-speed board stacking in telecom line cards, network switching equipment, and high-performance computing modules where signal integrity across a 5.0 mm board-to-board gap is critical. It is also used in test and measurement daughterboards and RF backplane assemblies where gold plating and Edge Rate technology reduce signal degradation.

Specifications

Pbfree CodeYes
Factory Lead Time2 Weeks, 3 Days
YTEOL8.68
Additional FeatureEDGE RATE, E.L.P.
Board Mounting OptionPEG
Body Breadth0.181inch
Body Depth0.246inch
Body Length1.116inch
Body/Shell StyleSOCKET
Connector TypeBOARD STACKING CONNECTOR
Contact Finish MatingNOT SPECIFIED
Contact Finish TerminationMatte Tin (Sn) - with Nickel (Ni) barrier
Contact GenderFEMALE
Contact MaterialNOT SPECIFIED
Contact PatternRECTANGULAR
Contact StyleBELLOWED TYPE
DIN ConformanceNO
Filter FeatureNO
IEC ConformanceNO
Insulator ColorBLACK
Insulator MaterialLIQUID CRYSTAL POLYMER
JESD-609 Codee3
MIL ConformanceNO
Mating Contact Pitch0.031inch
Mating InformationMULTIPLE MATING PARTS AVAILABLE
Mixed ContactsNO
Mounting Option 1LOCKING
Mounting StyleSTRAIGHT
Mounting TypeBOARD
Number Of ConnectorsONE
Number Of PCB Rows2
Number of Rows Loaded2
OptionGENERAL PURPOSE
PCB Contact PatternRECTANGULAR
PCB Contact Row Spacing2.9464mm
Plating Thickness10u inch
Polarization KeyPOLARIZED HOUSING
Rated Current (Signal)2.2A
Terminal Pitch0.8mm
Termination TypeSURFACE MOUNT
Total Number of Contacts52
PackageOther

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
ECCNEAR99
HTS Code8536.69.40.40
Country of OriginCosta Rica, USA

Datasheet

QRF8-026-05.0-L-D-A-GP Datasheet Download

Official datasheet from SAMTEC

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What stack height and position count does the QRF8-026-05.0-L-D-A-GP provide for board-to-board designs?

The QRF8-026-05.0-L-D-A-GP offers a 5.0 mm stack height with 26 positions in a dual-row layout, enabling precise board-to-board spacing in compact telecom and computing assemblies where vertical clearance is tightly controlled.

How does Edge Rate (E.L.P.) technology in the QRF8-026-05.0-L-D-A-GP benefit high-speed differential signal designs?

Samtec's Edge Rate technology shapes the contact geometry to reduce impedance discontinuities at the connector interface. For differential signal pairs running at multi-gigabit rates, this lowers insertion loss and crosstalk compared to standard board stacking connectors, which matters in 10 GbE or PCIe interconnect designs.

Is the QRF8-026-05.0-L-D-A-GP suitable for applications requiring RoHS-compliant gold-plated contacts?

Yes. The -GP suffix indicates gold plating on the contacts, and Samtec lists this part as RoHS compliant with a Pb-free code. Gold plating provides low and stable contact resistance, typically under 20 milliohms, making it suitable for high-reliability telecom and industrial board stack-ups that must meet EU RoHS directives.

What PCB footprint area does the QRF8-026-05.0-L-D-A-GP body require on the host board?

The connector body measures approximately 1.116 inches in length and 0.246 inches in depth, with a 0.181 inch breadth. This compact footprint fits into tight board-to-board stack designs while providing 26 dual-row contacts across the connector length.

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Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

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Rajesh Patel
Procurement Manager, VoltEdge Energy, India