MCP23S08-E/MLAlternatives & Equivalent Parts
About MCP23S08-E/ML
MCP23S08-E/ML is a Integrated Circuit component manufactured by Microchip. It comes in a Quad Flat No-Lead package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.
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Specification Comparison
| Parameter | MCP23S08-E/MLSource | MCP23S08T-E/ML | AD7789BRMZ | IL261-3E | GRM32ER71A476KE15L | MCP23S09-E/MG | MCP23S09T-E/MG |
|---|---|---|---|---|---|---|---|
| Manufacturer | Microchip | Microchip | Analog Devices | NVE | Murata Electronics | Microchip | Microchip |
| Package Type | Quad Flat No-Lead | Quad Flat No-Lead | Small Outline Packages | Small Outline Packages | Other | Quad Flat No-Lead | Quad Flat No-Lead |
| Pin Count | 20 | 20 | 10 | 16 | 2 | 16 | 16 |
| Temperature Range | -40.0°C ~ 125.0°C | -40.0°C ~ 125.0°C | -40.0°C ~ 105.0°C | — | -55.0°C ~ 125.0°C | -40.0°C ~ 125.0°C | -40.0°C ~ 125.0°C |
| Price | $0.8901 | $1.1700 | $4.5900 | — | $0.1575 | $1.1475 | $0.9850 |
| Stock | In Stock | In Stock | In Stock | In Stock | In Stock | In Stock | In Stock |
| Lifecycle | ACTIVE | ACTIVE | ACTIVE | ACTIVE | ACTIVE | ACTIVE | ACTIVE |
| Electrical Parameters | |||||||
| Pbfree Code | Yes | Yes | No | Yes | Yes | Yes | Yes |
| Manufacturer Package Code | QFN-20 | QFN-20 | RM-10 | — | — | QFN-16 | QFN-16 |
| Factory Lead Time | 6 Weeks | 6 Weeks | — | — | — | 2 Weeks | 8 Weeks |
| YTEOL | 9 | 9 | 10 | — | 7 | 9 | 9 |
| Clock Frequency-Max | 10 MHz | 10 MHz | — | — | — | 10 MHz | 10 MHz |
| JESD-30 Code | S-PQCC-N20 | S-PQCC-N20 | S-PDSO-G10 | — | — | S-XQCC-N16 | S-XQCC-N16 |
| JESD-609 Code | e3 | e3 | e3 | — | e3 | e3 | e3 |
| Number of Bits | 8 | 8 | 24 | — | — | 8 | 8 |
| Number of I/O Lines | 8 | 8 | — | — | — | 8 | 8 |
| Number of Ports | 1 | 1 | — | — | — | 1 | 1 |
| Package Body Material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | — | — | UNSPECIFIED | UNSPECIFIED |
| Package Equivalence Code | LCC20,.16SQ,20 | LCC20,.16SQ,20 | TSSOP10,.19,20 | — | — | LCC16,.12SQ,20 | LCC16,.12SQ,20 |
| Package Shape | SQUARE | SQUARE | SQUARE | — | RECTANGULAR PACKAGE | SQUARE | SQUARE |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | — | SMT | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Cel) | 260 | 260 | 260 | — | — | 260 | 260 |
| Qualification Status | Not Qualified | Not Qualified | Not Qualified | — | — | Not Qualified | Not Qualified |
| Supply Current-Max | 1 mA | 1 mA | 0.075 mA | — | — | 1 mA | 1 mA |
| Supply Voltage-Max | 5.5 V | 5.5 V | — | — | — | 5.5 V | 5.5 V |
| Supply Voltage-Min | 4.5 V | 4.5 V | — | — | — | 1.8 V | 1.8 V |
| Supply Voltage-Nom | 5 V | 5 V | 3 V | — | — | 5 V | 5 V |
| Surface Mount | YES | YES | YES | — | YES | YES | YES |
| Technology | CMOS | CMOS | — | — | — | CMOS | CMOS |
| Temperature Grade | AUTOMOTIVE | AUTOMOTIVE | INDUSTRIAL | — | — | AUTOMOTIVE | AUTOMOTIVE |
| Terminal Finish | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | — | Matte Tin (Sn) - with Nickel (Ni) barrier | Matte Tin (Sn) | Matte Tin (Sn) |
| Terminal Form | NO LEAD | NO LEAD | GULL WING | — | — | NO LEAD | NO LEAD |
| Terminal Pitch | 0.5 mm | 0.5 mm | 0.5 mm | — | — | 0.5 mm | 0.5 mm |
| Terminal Position | QUAD | QUAD | DUAL | — | — | QUAD | QUAD |
| uPs/uCs/Peripheral ICs Type | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE | — | — | — | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE |
| ## MCP23S08-E/ML Alternates Showing results | Image | — | — | — | — | — | — |
| Analog Input Voltage-Max | — | — | 5.25 V | — | — | — | — |
| Analog Input Voltage-Min | — | — | 0.1 V | — | — | — | — |
| Converter Type | — | — | ADC, DELTA-SIGMA | — | — | — | — |
| Linearity Error-Max (EL) | — | — | 0.0015% | — | — | — | — |
| Number of Analog In Channels | — | — | 1 | — | — | — | — |
| Number of Functions | — | — | 1 | — | — | — | — |
| Output Bit Code | — | — | BINARY, OFFSET BINARY | — | — | — | — |
| Output Format | — | — | SERIAL | — | — | — | — |
| Time@Peak Reflow Temperature-Max (s) | — | — | 30 | — | — | 40 | 40 |
| ## AD7789BRMZ Alternates Showing results | — | — | Image | — | — | — | — |
| Reach Compliance Code | — | — | — | — | Compliant | — | — |
| Capacitance | — | — | — | — | 47 µF | — | — |
| Capacitor Type | — | — | — | — | CERAMIC CAPACITOR | — | — |
| Dielectric Material | — | — | — | — | CERAMIC | — | — |
| Height | — | — | — | — | 2.5 mm | — | — |
| Mounting Feature | — | — | — | — | SURFACE MOUNT | — | — |
| Multilayer | — | — | — | — | Yes | — | — |
| Negative Tolerance | — | — | — | — | 10% | — | — |
| Packing Method | — | — | — | — | 180mm Reel Embossed Tape | — | — |
| Positive Tolerance | — | — | — | — | 10% | — | — |
| Rated (DC) Voltage (URdc) | — | — | — | — | 10 V | — | — |
| Size Code | — | — | — | — | 3225M/1210 | — | — |
| Temperature Characteristics Code | — | — | — | — | X7R | — | — |
| Temperature Coefficient | — | — | — | — | 15% ppm/°C | — | — |
| Terminal Shape | — | — | — | — | WRAPAROUND | — | — |
Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.
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Quick Links
Why Look for Alternatives?
Finding alternatives for MCP23S08-E/ML is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.
When evaluating MCP23S08-E/ML replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.
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FAQ
What is equivalent to MCP23S08-E/ML?
Known equivalents for MCP23S08-E/ML include MCP23S08T-E/ML, AD7789BRMZ, IL261-3E. Contact FindMyChip for a full compatibility analysis for your specific application.
Can I use a different manufacturer's part instead of MCP23S08-E/ML?
In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.
How do I verify MCP23S08-E/ML alternatives?
Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.