MAX32625IWY+ Analog Devices Integrated Circuit (BGA) In Stock
MAX32625IWY+ is an ultra-low-power 32-bit ARM Cortex-M4 with FPU microcontroller from Analog Devices, featuring 512 KB Flash, 160 KB SRAM, ADC, DMA, and 1.8 V nominal supply in a compact 63-ball WLCSP package for wearable and IoT applications. From $5.40, in stock, worldwide shipping.
- Manufacturer
- Analog Devices
- Package
- BGA
- Pin Count
- 63
- Lifecycle
- NOT RECOMMENDED
- Datasheet
- MAX32625IWY+ Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -30.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of MAX32625IWY+?
- ARM Cortex-M4 core with FPU delivers DSP-class signal processing at ultra-low active current for wearable health monitoring
- 512 KB Flash and 160 KB SRAM provide ample storage for complex firmware, sensor fusion algorithms, and data buffers
- Ultra-low-power architecture with multiple sleep modes enables multi-month operation from small coin-cell or Li-ion batteries
- Integrated ADC and DMA channels support efficient multi-channel biosensor data acquisition without CPU involvement
- 63-ball WLCSP package minimizes PCB footprint for space-constrained wearable, hearable, and IoT module designs
What is MAX32625IWY+ used for?
The MAX32625IWY+ is optimized for ultra-low-power wearable medical devices such as continuous glucose monitors, fitness trackers, and hearables, where its ARM Cortex-M4 FPU enables real-time sensor fusion and bio-signal processing at minimal current draw. With 512 KB Flash and 160 KB SRAM, it handles BLE communication stacks, accelerometer data fusion, and health algorithm execution simultaneously from a 1.8 V supply. The compact 63-ball WLCSP package makes it ideal for miniaturized IoT sensor nodes and smart patches requiring a high-performance MCU in the smallest possible form factor.
What are the specifications of MAX32625IWY+?
| Manufacturer Package Code | 63-WLCSP-N/A |
| Date Of Intro | 2016-10-27 |
| YTEOL | 3 |
| Has ADC | YES |
| Additional Feature | ALSO REQUIRES 1.8V NOM SUPPLY, SEATED HGT-CALCULATED |
| Bit Size | 32 |
| Boundary Scan | YES |
| Clock Frequency-Max | 0.032MHz |
| DAC Channels | NO |
| DMA Channels | YES |
| JESD-30 Code | R-PBGA-B63 |
| Number of I/O Lines | 40 |
| On Chip Program ROM Width | 8 |
| PWM Channels | YES |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| RAM (bytes) | 163840 |
| ROM (words) | 524288 |
| ROM Programmability | FLASH |
| Speed | 96MHz |
| Supply Voltage-Max | 1.26V |
| Supply Voltage-Min | 1.2V |
| Supply Voltage-Nom | 1.2V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | OTHER |
| Terminal Finish | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) |
| Terminal Form | BALL |
| Terminal Pitch | 0.4mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| HTS Code | 8542.31.00.25 |
| Country of Origin | Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA |
Where can I find the MAX32625IWY+ datasheet?
MAX32625IWY+ Datasheet DownloadOfficial datasheet from Analog Devices
What are equivalent replacements for MAX32625IWY+?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the ARM Cortex-M4 FPU in the MAX32625IWY+ accelerate health monitoring signal processing at ultra-low power?
The ARM Cortex-M4 FPU in the MAX32625IWY+ executes single-precision floating-point operations in 1 clock cycle, enabling efficient computation of FFT, IIR filter, and peak-detection algorithms needed for ECG, PPG, and accelerometer processing. Running at up to 96 MHz active frequency with a 1.8 V nominal supply, the FPU completes 512-point FFT routines far faster than a Cortex-M0 core, allowing the MCU to return to sleep sooner and reducing average power consumption in duty-cycled wearable applications.
What memory resources does the MAX32625IWY+ provide, and how do 512 KB Flash and 160 KB SRAM compare to competing wearable MCUs?
The MAX32625IWY+ provides 512 KB of internal Flash for firmware and configuration storage, plus 160 KB SRAM for runtime data, BLE stack buffers, and sensor data queues — significantly more than typical wearable MCUs offering 256 KB Flash and 64 KB SRAM. The extra 256 KB Flash accommodates over-the-air (OTA) firmware update dual-bank storage, while 160 KB SRAM supports concurrent multi-algorithm execution and large data ring buffers without external memory at 1.8 V supply.
Which wearable and IoT PCB designs benefit from the MAX32625IWY+ 63-ball WLCSP package size?
The 63-ball WLCSP package of the MAX32625IWY+ occupies less than 16 mm² of PCB area, enabling its use in ultra-compact smart patches, hearables, implantable-adjacent devices, and miniaturized IoT sensor tags where traditional QFN or LQFP packages would exceed available space. At 1.8 V nominal supply, the WLCSP also reduces power distribution trace lengths, lowering parasitic inductance and improving power integrity for sensitive ADC measurements in wearable health monitoring circuits.
How does the integrated DMA in the MAX32625IWY+ improve ADC data acquisition efficiency in multi-sensor wearable designs?
The DMA channels in the MAX32625IWY+ allow autonomous transfer of ADC samples from the peripheral to SRAM without CPU intervention, enabling the Cortex-M4 core to remain in a low-power state or execute other tasks while data from up to multiple sensor channels is collected. In a wearable ECG monitor sampling at 250 Hz with 12-bit ADC resolution, DMA reduces the CPU wakeup rate by over 90% compared to interrupt-driven sampling, substantially decreasing average active current from the 1.8 V supply.
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Why Buy from FindMyChip
About Analog Devices
Analog Devices (ADI) is a global leader in high-performance analog, mixed-signal, and digital signal processing integrated circuits used in virtually all types of electronic equipment.
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