LTC6820HUD#PBF Analog Devices Integrated Circuit (Quad Flat No-Lead) In Stock
The LTC6820HUD is an isoSPI isolated communications interface IC from Analog Devices, enabling long-distance SPI communication over a single twisted pair with galvanic isolation. It supports data rates up to 1 Mbps and operates in a 16-pin QFN package. Suited for battery management systems, industrial automation, and medical equipment requiring isolated SPI links.
- Manufacturer
- Analog Devices
- Package
- Quad Flat No-Lead
- Pin Count
- 16
- Lifecycle
- ACTIVE
- Datasheet
- LTC6820HUD#PBF Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $3.5500(MOQ 1)
- Temp Range
- -40.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- isoSPI isolated communication over single twisted pair
- Up to 1 Mbps data rate with galvanic isolation
- 16-pin QFN compact package for space-constrained designs
- Single-function interface IC for SPI protocol bridging
- Compatible with daisy-chain multi-node battery stack monitoring
- Robust noise immunity for industrial and automotive environments
Applications
The LTC6820HUD enables galvanically isolated SPI communication in high-voltage battery management systems, where each cell-monitoring IC must be electrically isolated from the host controller. Its single twisted-pair interface reduces wiring complexity in multi-cell stacks used in EV battery packs and industrial energy storage systems. It is also used in medical instruments and industrial automation where noise-immune isolated serial links are required.
Specifications
| Pbfree Code | No |
| Manufacturer Package Code | 05-08-1700 |
| YTEOL | 10 |
| Interface IC Type | INTERFACE CIRCUIT |
| JESD-30 Code | S-PQCC-N16 |
| JESD-609 Code | e3 |
| Number of Functions | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | SQUARE |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage-Max | 5.5V |
| Supply Voltage-Min | 2.7V |
| Supply Voltage-Nom | 3.3V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | AUTOMOTIVE |
| Terminal Finish | Matte Tin (Sn) |
| Terminal Form | NO LEAD |
| Terminal Pitch | 0.5mm |
| Terminal Position | QUAD |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | Quad Flat No-Lead |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.01 |
| Country of Origin | Thailand |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
At what maximum data rate does the LTC6820HUD operate over an isolated twisted-pair link?
The LTC6820HUD supports isoSPI communication at up to 1 Mbps over a single twisted-pair cable, providing fast data transfer while maintaining galvanic isolation. This rate is sufficient for real-time cell voltage monitoring in large battery stacks with 16 or more series cells, enabling timely balancing and protection responses.
How does the LTC6820HUD simplify wiring in a multi-cell EV battery management system?
By translating standard SPI into an isoSPI differential signal on a single twisted pair, the LTC6820HUD reduces cabling from multiple wires to just 2 wires per node in a daisy-chain stack. A 100-cell EV battery pack can use a series of LTC6820 nodes each separated by only a twisted pair, eliminating the need for multiple isolated power supplies and reducing EMI susceptibility.
Why is the QFN-16 package of the LTC6820HUD advantageous for dense BMS PCB layouts?
The 16-pin QFN package provides a compact footprint that fits within tight PCB area constraints typical of battery management modules. Its exposed thermal pad improves heat dissipation, and the low-profile package reduces board height, making the LTC6820HUD compatible with slim battery pack enclosures where board space is limited to a few square centimeters.
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About Analog Devices
Analog Devices (ADI) is a global leader in high-performance analog, mixed-signal, and digital signal processing integrated circuits used in virtually all types of electronic equipment.
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| 1000+ | $3.5500 | $3550.00 |
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