LTC6820HMS#TRPBF Analog Devices Integrated Circuit (Other) In Stock
LTC6820HMS#TRPBF is an isolated communications interface IC by Analog Devices supporting 3.3 V and 5 V logic levels for automotive and industrial isoSPI applications. Key specs: 16-pin MSOP package, single-function interface, thin shrink small outline body. Available in stock with worldwide shipping.
- Manufacturer
- Analog Devices
- Package
- Other
- Pin Count
- 16
- Lifecycle
- ACTIVE
- Datasheet
- LTC6820HMS#TRPBF Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $3.5500(MOQ 44)
- Temp Range
- -40.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Isolated SPI (isoSPI) interface supporting 3.3 V and 5 V logic levels
- Automotive-grade design for high-reliability in-vehicle networks
- 16-pin MSOP thin shrink small outline package
- Enables daisy-chained isoSPI communication over twisted-pair cable
- Single-function interface IC minimizing BOM complexity
- Compatible with Analog Devices BMS front-end ICs for battery stacks
Applications
The LTC6820HMS#TRPBF is designed to enable robust isolated SPI communications between battery management ICs in multi-cell automotive battery stacks, such as those used in electric vehicles and hybrid powertrains. It implements the isoSPI protocol, allowing high-speed, noise-immune data transfer over standard twisted-pair wiring across high-voltage isolation barriers. Its automotive-grade design and 3.3 V/5 V compatibility make it a natural companion to Analog Devices LTC68xx BMS front-end devices.
Specifications
| Pbfree Code | No |
| Manufacturer Package Code | 05-08-1669 |
| YTEOL | 10 |
| Interface IC Type | INTERFACE CIRCUIT |
| JESD-30 Code | R-PDSO-G16 |
| JESD-609 Code | e3 |
| Number of Functions | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage-Max | 5.5V |
| Supply Voltage-Min | 2.7V |
| Supply Voltage-Nom | 3.3V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | AUTOMOTIVE |
| Terminal Finish | Matte Tin (Sn) |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.5mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.01 |
| Country of Origin | Thailand |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What communication protocol does the LTC6820HMS#TRPBF implement and how does it maintain isolation?
The LTC6820HMS#TRPBF implements the isoSPI protocol, which translates standard 3.3 V or 5 V SPI signals into differential signals transmitted over twisted-pair cable. This approach provides galvanic isolation between nodes in a battery stack, tolerating common-mode voltages exceeding 100 V in EV battery management systems.
How many nodes can be daisy-chained with LTC6820HMS#TRPBF in a battery management system?
The isoSPI topology enabled by LTC6820HMS#TRPBF supports daisy-chaining multiple BMS nodes—typically up to 32 LTC68xx battery monitor ICs in a single stack—using only 2-wire twisted-pair connections between each node. This dramatically reduces wiring complexity and harness weight in large 400 V or 800 V automotive battery packs.
What supply voltages and package dimensions make LTC6820HMS#TRPBF suitable for space-constrained automotive boards?
This IC supports 3.3 V and 5 V supply rails and is housed in a 16-pin MSOP thin shrink small outline package, which has a very small footprint suitable for high-density automotive PCBs. Its compact body reduces board area consumption while meeting automotive thermal and mechanical reliability requirements across typical -40°C to 125°C operating ranges.
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About Analog Devices
Analog Devices (ADI) is a global leader in high-performance analog, mixed-signal, and digital signal processing integrated circuits used in virtually all types of electronic equipment.
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