LSHM-140-02.5-L-DV-A-N-TR SAMTEC Connector (Other) In Stock
SAMTEC LSHM-140-02.5-L-DV-A-N-TR is a 80-position (40 per row) dual-row board stacking connector with 0.50 mm pitch and gold-plated mating contacts, designed for high-density surface-mount stacking applications. It features a peg board-mounting option, matte tin termination with nickel barrier, and tape-and-reel packaging for automated SMT assembly.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 80
- Lifecycle
- ACTIVE
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 80-position dual-row board stacking connector at 0.50 mm pitch enabling ultra-high-density board-to-board interconnection
- Gold mating contacts over matte tin termination with nickel barrier for reliable, long-cycle stacking connections
- Peg board-mounting option providing mechanical retention and precise board-to-board alignment during stacking assembly
Applications
The LSHM-140-02.5-L-DV-A-N-TR is intended for compact board stacking applications in high-density systems such as modular computing platforms, FPGA daughter cards, and high-speed signal-processing modules where 80 connections are needed at a 0.50 mm pitch. Its dual-row configuration and peg alignment features ensure accurate mechanical registration between stacked PCBs, reducing misalignment risk during assembly. Tape-and-reel packaging supports high-volume automated production lines.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 5 Weeks, 3 Days |
| YTEOL | 8.68 |
| Board Mounting Option | PEG |
| Body Breadth | 0.196inch |
| Body Depth | 0.156inch |
| Body Length | 0.972inch |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Mating | GOLD |
| Contact Finish Termination | Matte Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | HERMAPHRODITIC |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Resistance | 15mΩ |
| Contact Style | BELLOWED TYPE |
| Dielectric Withstanding Voltage | 470VAC V |
| Durability | 100Cycles |
| Filter Feature | NO |
| Insulation Resistance | 1000000000Ω |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| Mating Contact Pitch | 0.02inch |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 3.7084mm |
| Plating Thickness | 10u inch |
| Polarization Key | POLARIZED HOUSING |
| Rated Current (Signal) | 2A |
| Reference Standard | UL |
| Terminal Pitch | 0.508mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 80 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Costa Rica, USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What stacking pitch and position count does the LSHM-140-02.5-L-DV-A-N-TR provide for board-to-board designs?
The LSHM-140-02.5-L-DV-A-N-TR offers 80 positions across 2 rows at a 0.50 mm pitch, making it one of the higher-density board stacking connectors in the SAMTEC LSHM series. This allows 80 high-speed or mixed-signal connections in a body measuring approximately 0.972 inch in length, suitable for compact modular board stack systems.
How does the peg board-mounting option on LSHM-140-02.5-L-DV-A-N-TR improve stacking assembly reliability?
The peg mounting option on LSHM-140-02.5-L-DV-A-N-TR provides mechanical alignment pegs that register the connector precisely to the mating PCB, preventing lateral movement during the mating process. For 80-position stacking connectors at 0.50 mm pitch, even small misalignment can cause contact damage, so the peg feature is especially valuable in repeated mate-unmate cycles or during automated board stacking.
In which high-density system integration scenarios is LSHM-140-02.5-L-DV-A-N-TR most effective?
LSHM-140-02.5-L-DV-A-N-TR excels in scenarios requiring 80 connections between two PCBs with minimal board-to-board spacing, such as FPGA mezzanine cards, compute-on-module (COM) boards, and 5G small cell radio units. The 0.50 mm pitch and dual-row layout minimize the connector's PCB footprint while gold mating contacts support the signal integrity demands of high-speed interfaces running at hundreds of MHz or multi-Gbps rates.
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