LSHM-130-L6.0-F-DV-A-S-K-TR SAMTEC Connector (Other) In Stock
SAMTEC LSHM-130-L6.0-F-DV-A-S-K-TR is a 60-position, 0.50 mm pitch Razor Beam high-speed hermaphroditic board stacking connector with integrated shielding and 6.0 mm stack height, supporting differential signal pairs at multi-gigabit data rates. Gold-plated hermaphroditic contacts simplify inventory by eliminating the need for separate plug and receptacle parts. Available through authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 62
- Lifecycle
- ACTIVE
- Category
- Connector
- Price
- From $3.9970(MOQ 50)
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of LSHM-130-L6.0-F-DV-A-S-K-TR?
- 60-position hermaphroditic contact design on 0.50 mm pitch eliminates separate plug/receptacle SKUs, reducing inventory complexity
- Integrated EMI shielding (SHIELDED) suppresses crosstalk and radiated emissions for high-speed differential signal integrity at multi-Gbps data rates
- 6.0 mm board-to-board stack height with peg (PEG) mounting ensures precise alignment and mechanical stability in board stacking assemblies
- Razor Beam contact geometry delivers ultra-low insertion force with reliable 30-cycle mating durability for high-density 60-pin interconnects
- Tape-and-reel (TR) packaging supports automated high-volume SMT pick-and-place assembly on 0.50 mm pitch PCB footprints
What is LSHM-130-L6.0-F-DV-A-S-K-TR used for?
The LSHM-130-L6.0-F-DV-A-S-K-TR is designed for high-speed board stacking in advanced computing modules, network switch line cards, and high-bandwidth FPGA mezzanine boards where 60 differential signal pairs must traverse a 6.0 mm board-to-board gap with minimal signal degradation. Its integrated shielding makes it well-suited for 10 Gbps and 25 Gbps serial link applications in data center servers and telecommunications equipment. The hermaphroditic contact design is particularly valuable in modular system architectures where interchangeable board interfaces simplify assembly and field replacement.
What are the specifications of LSHM-130-L6.0-F-DV-A-S-K-TR?
| YTEOL | 8.68 |
| Additional Feature | SHIELDED |
| Board Mounting Option | PEG |
| Body Breadth | 0.196inch |
| Body Depth | 0.293inch |
| Body Length | 0.776inch |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Mating | NOT SPECIFIED |
| Contact Gender | HERMAPHRODITIC |
| Contact Material | NOT SPECIFIED |
| Contact Pattern | RECTANGULAR |
| Contact Resistance | 15mΩ |
| Contact Style | BELLOWED TYPE |
| Dielectric Withstanding Voltage | 470VAC V |
| Durability | 100Cycles |
| Filter Feature | NO |
| Insulation Resistance | 1000000000Ω |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| Mating Contact Pitch | 0.02inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 3.7mm |
| Plating Thickness | 3u inch |
| Polarization Key | POLARIZED HOUSING |
| Rated Current (Signal) | 2A |
| Reference Standard | UL |
| Terminal Pitch | 0.5mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 60 |
| UL Flammability Code | 94V-0 |
| Withdrawl Force-Min | 2.22N |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Costa Rica, Malaysia |
Where can I find the LSHM-130-L6.0-F-DV-A-S-K-TR datasheet?
LSHM-130-L6.0-F-DV-A-S-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for LSHM-130-L6.0-F-DV-A-S-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What board-to-board stack height and pin count does the LSHM-130-L6.0-F-DV-A-S-K-TR support?
The LSHM-130-L6.0-F-DV-A-S-K-TR provides 60 positions on a 0.50 mm pitch with a fixed 6.0 mm board-to-board stack height, achieved via integrated peg mounting for precise mechanical alignment. This combination enables high-density 60-channel interconnects in compact stacked board assemblies used in advanced computing and FPGA mezzanine modules.
How does integrated shielding in the LSHM-130-L6.0-F-DV-A-S-K-TR benefit high-speed differential signal applications?
The integrated EMI shield surrounding the 60-position connector body reduces crosstalk between adjacent differential pairs and suppresses radiated emissions, enabling reliable operation at serial link speeds from 10 Gbps to 25 Gbps per lane. This shielding is critical in data center switch cards and telecommunications blades where multiple high-speed channels must coexist within 0.50 mm center-to-center pitch without signal integrity degradation.
What is the advantage of hermaphroditic contacts in the LSHM-130-L6.0-F-DV-A-S-K-TR for modular system design?
Hermaphroditic contacts mean both mating halves of the LSHM-130-L6.0-F-DV-A-S-K-TR use an identical 60-pin part number, cutting BOM line items and inventory by up to 50% compared to systems requiring separate male and female connectors. This interchangeability simplifies field replacement and module swapping in server blade enclosures and modular test equipment with hot-swap board stacking requirements.
For which high-density computing applications is the LSHM-130-L6.0-F-DV-A-S-K-TR best suited?
This connector is best suited for FPGA mezzanine card (FMC) interfaces, COM Express module stacking, and high-speed network line card blade interconnects where 60 differential pairs at 0.50 mm pitch must bridge a 6.0 mm board gap. Its shielded body and Razor Beam contacts together maintain eye diagram compliance for PCIe Gen 3 (8 Gbps) and 25G Ethernet signal paths in dense rack-mount server platforms.
How does the peg mounting feature of LSHM-130-L6.0-F-DV-A-S-K-TR ensure reliable board alignment during assembly?
The PEG mounting option provides physical polarization pins that self-locate the connector on the PCB before soldering, maintaining less than 0.1 mm positional tolerance across the 60-position 0.50 mm pitch footprint. This prevents misalignment during reflow at up to 260 °C, a critical requirement for sub-millimeter pitch board stacking connectors in high-volume automated SMT assembly lines.
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| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 50+ | $6.3800 | $319.00 |
| 100+ | $5.7000 | $570.00 |
| 500+ | $5.0000 | $2500.00 |
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| 1100+ | $3.9976 | $4397.35 |
| 2000+ | $3.9970 | $7994.00 |
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