LSHM-130-L4.0-STL-DV-A-N-TR SAMTEC Connector (Other) In Stock
SAMTEC LSHM-130-L4.0-STL-DV-A-N-TR is a 60-position, 0.50 mm pitch Razor Beam high-speed hermaphroditic terminal/socket strip in dual-row format with 4.0 mm stack height. It supports high-frequency board-to-board mating with tape-and-reel packaging for automated SMT placement. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 60
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 60-position dual-row hermaphroditic design on 0.50 mm pitch enables symmetrical board-to-board mating without gender-specific connector pairing
- Razor Beam contact technology delivers reliable high-speed signal integrity at data rates beyond 10 Gbps in a compact 0.50 mm pitch footprint
- 4.0 mm fixed stack height and tape-and-reel packaging support precise, automated SMT assembly for high-volume board-to-board interconnect applications
Applications
The LSHM-130-L4.0-STL-DV-A-N-TR is designed for high-speed board-to-board interconnects in FPGA mezzanine cards, server daughterboards, and telecommunications line cards where 60 differential or single-ended signals must traverse a 4.0 mm board gap at data rates exceeding 10 Gbps. Its hermaphroditic contact system eliminates gender-matching errors during automated assembly, making it equally valuable in test equipment probe interfaces and embedded computing module stacks.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What data rate capability does the LSHM-130-L4.0-STL-DV-A-N-TR Razor Beam contact system support?
SAMTEC Razor Beam connectors are characterized for high-speed signal integrity at data rates exceeding 10 Gbps per channel. The 0.50 mm pitch and controlled-impedance contact geometry of the LSHM-130-L4.0-STL-DV-A-N-TR keep insertion loss and crosstalk below critical thresholds for PCIe Gen 3, 10GbE, and similar 8-12 Gbps serial standards on 60-position mezzanine assemblies.
Why does the hermaphroditic design of the LSHM-130-L4.0-STL-DV-A-N-TR benefit automated board-to-board assembly?
Because both mating halves of the LSHM-130-L4.0-STL-DV-A-N-TR are identical, production lines stock a single part number for each connector slot instead of separate plug and receptacle SKUs. This reduces BOM complexity on high-volume FPGA mezzanine and server daughterboard builds, cutting the risk of gender-mismatch errors on 60-pin assemblies at line speeds above 500 boards per hour.
What does the 4.0 mm stack height mean for board-to-board clearance in a mezzanine card design?
The 4.0 mm stack height of the LSHM-130-L4.0-STL-DV-A-N-TR sets the fixed separation between the two mated PCBs at 4.0 mm, which must be matched in the mechanical design of the mezzanine card frame. This clearance accommodates low-profile SMT components up to approximately 3.2 mm tall on the facing board surfaces, a typical constraint in compact server blade and FPGA evaluation board stacks.
How does tape-and-reel packaging affect placement accuracy of the LSHM-130-L4.0-STL-DV-A-N-TR on a high-speed PCB?
The -TR tape-and-reel format presents each LSHM-130-L4.0-STL-DV-A-N-TR in a precision pocket that feeds directly to a pick-and-place nozzle, holding positional tolerance to within 0.05 mm for the 0.50 mm pitch pads. This accuracy is critical for 60-position high-speed connectors where a 0.10 mm placement error can cause solder bridging between adjacent 0.50 mm pads and degrade signal integrity on 10 Gbps channels.
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