LSHM-130-L3.0-H-DV-A-S-K-TR SAMTEC Connector (Other) In Stock
SAMTEC LSHM-130-L3.0-H-DV-A-S-K-TR is a 60-position, 0.50 mm pitch Razor Beam high-speed hermaphroditic connector with a 3.0 mm controlled board-to-board stacking height. Symmetrical mating design simplifies BOM management and assembly in compact mezzanine and module interconnect applications. Tape and reel packaging supports automated SMT assembly with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 62
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of LSHM-130-L3.0-H-DV-A-S-K-TR?
- 60-position, 0.50 mm pitch Razor Beam hermaphroditic design enables symmetric, error-free mating in either orientation
- 3.0 mm controlled board-to-board stacking height for precise mezzanine card spacing and module assembly
- Keyed alignment and high-speed construction support multi-Gbps differential pair routing in dense PCB stacks
What is LSHM-130-L3.0-H-DV-A-S-K-TR used for?
The LSHM-130-L3.0-H-DV-A-S-K-TR is designed for high-density mezzanine and board-to-board interconnects in networking equipment, defense avionics, and high-performance computing modules. Its 60-position, 0.50 mm pitch hermaphroditic configuration allows either mated connector to serve as plug or receptacle, streamlining inventory and assembly. The 3.0 mm controlled stacking height and keyed alignment ensure reliable, high-frequency signal routing in compact, ruggedized PCB stack-up designs.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the LSHM-130-L3.0-H-DV-A-S-K-TR datasheet?
LSHM-130-L3.0-H-DV-A-S-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for LSHM-130-L3.0-H-DV-A-S-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What board-to-board stacking height and pitch does LSHM-130-L3.0-H-DV-A-S-K-TR provide?
LSHM-130-L3.0-H-DV-A-S-K-TR provides a precisely controlled 3.0 mm board-to-board stacking height at 0.50 mm pitch, with 60 pins in a hermaphroditic terminal/socket configuration. This controlled height ensures consistent inter-board spacing in mezzanine card assemblies used in servers, networking hardware, and defense electronics modules.
What is the advantage of the hermaphroditic design in LSHM-130-L3.0-H-DV-A-S-K-TR?
The hermaphroditic design means both mating connectors are identical, so a single LSHM-130-L3.0-H-DV-A-S-K-TR part fits both sides of a 60-pin, 0.50 mm pitch board-to-board connection without needing separate plug and receptacle SKUs. This simplifies BOM management, reduces inventory complexity, and ensures consistent contact performance and insertion force across high-volume PCB assemblies.
What high-speed interfaces can LSHM-130-L3.0-H-DV-A-S-K-TR support across its 60 pins?
LSHM-130-L3.0-H-DV-A-S-K-TR supports multi-Gbps differential pair interfaces including PCIe, USB 3.0, and SerDes across its 60 pins at 0.50 mm pitch, making it suitable for high-bandwidth mezzanine card designs. The keyed alignment and 3.0 mm stacking height preserve signal integrity and reduce insertion errors in high-frequency, dense PCB interconnect applications.
How does LSHM-130-L3.0-H-DV-A-S-K-TR compare to wire-to-board solutions for mezzanine connections?
LSHM-130-L3.0-H-DV-A-S-K-TR offers a direct SMT board-to-board connection with 60 pins at 0.50 mm pitch, eliminating cable harnesses and delivering far higher signal density with better controlled impedance than wire-to-board alternatives. Its tape and reel format supports automated SMT reflow at up to 260°C, enabling efficient high-volume production that wiring harness solutions cannot match.
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