LM3S5951-IBZ80-C3 Texas Instruments Integrated Circuit (BGA) In Stock
Texas Instruments LM3S5951-IBZ80-C3 is a 32-bit ARM Cortex-M3 Stellaris microcontroller running up to 50 MHz with 256 KB Flash and 64 KB SRAM in a 108-ball BGA package. It features 67 GPIO lines, DMA, 10-bit ADC, USB, and Ethernet MAC/PHY. Available from stock worldwide with fast shipping.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 108
- Lifecycle
- OBSOLETE
- Datasheet
- LM3S5951-IBZ80-C3 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 32-bit ARM Cortex-M3 core operating at up to 50 MHz for high-throughput embedded applications
- 67 GPIO lines with integrated USB full-speed OTG and 10/100 Ethernet MAC for connectivity-rich designs
- 256 KB Flash and 64 KB SRAM with DMA controller enabling efficient peripheral data transfers
- 108-ball BGA package providing high pin density for compact industrial and networking PCB layouts
Applications
The LM3S5951-IBZ80-C3 is used in industrial Ethernet gateways, building automation controllers, and smart energy metering systems that require both USB and Ethernet connectivity on a single ARM Cortex-M3 chip. Its 67 GPIO lines and DMA support make it well-suited for data acquisition front-ends and protocol bridge applications between CAN, SPI, and Ethernet networks. It is also applied in embedded web server designs where the on-chip Ethernet MAC reduces external component count.
Specifications
| Pbfree Code | Yes |
| YTEOL | 0 |
| Has ADC | YES |
| Bit Size | 32 |
| Clock Frequency-Max | 16MHz |
| DAC Channels | NO |
| DMA Channels | YES |
| JESD-30 Code | S-PBGA-B108 |
| JESD-609 Code | e1 |
| Number of I/O Lines | 67 |
| PWM Channels | YES |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY |
| Qualification Status | Not Qualified |
| ROM Programmability | FLASH |
| Speed | 80MHz |
| Supply Voltage-Max | 3.6V |
| Supply Voltage-Min | 3V |
| Supply Voltage-Nom | 3.3V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | TIN SILVER COPPER |
| Terminal Form | BALL |
| Terminal Pitch | 0.8mm |
| Terminal Position | BOTTOM |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| HTS Code | 8542.31.00.25 |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for LM3S5951-IBZ80-C3:
Frequently Asked Questions
What is the core clock speed and memory capacity of the LM3S5951-IBZ80-C3?
The LM3S5951-IBZ80-C3 features an ARM Cortex-M3 core clocked at up to 50 MHz, paired with 256 KB of on-chip Flash program memory and 64 KB of SRAM. This combination provides sufficient throughput and storage for real-time control firmware with Ethernet and USB protocol stacks running concurrently.
Which connectivity interfaces does the LM3S5951-IBZ80-C3 integrate for industrial networking?
The LM3S5951-IBZ80-C3 integrates a 10/100 Mbps Ethernet MAC with MII/RMII interface, full-speed USB OTG at 12 Mbps, multiple UARTs, 2 SSI (SPI) ports, and I2C. This peripheral set allows it to serve as an Ethernet-to-serial or Ethernet-to-CAN gateway without external network controllers, reducing BOM cost in industrial router designs.
How does the DMA controller in the LM3S5951-IBZ80-C3 improve data acquisition performance?
The on-chip DMA controller in the LM3S5951-IBZ80-C3 offloads data transfers between the 10-bit ADC, UART, SSI, and SRAM from the Cortex-M3 CPU. This allows continuous ADC sampling at up to 1 Msps while the CPU processes Ethernet packets, achieving throughput levels that would saturate an interrupt-driven design running at 50 MHz.
Is the 108-ball BGA package of the LM3S5951-IBZ80-C3 suitable for standard PCB manufacturing?
The 108-ball BGA package uses a 0.5 mm ball pitch, which requires PCB layer count of at least 4 and via-in-pad or dogbone fanout routing. While it demands more advanced PCB fabrication than LQFP alternatives, it reduces the board footprint to roughly 9 mm x 9 mm, making it practical for space-constrained industrial gateway boards using standard FR4 with 100 µm min trace width.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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