LM1972N Texas Instruments Integrated Circuit (Dual-In-Line Packages) In Stock
Texas Instruments LM1972N is a dual-channel SPI-controlled audio attenuator IC with 78 dB attenuation range in 1 dB steps. It operates from a 4.5 V to 12 V supply and draws only 2 mA quiescent current. Packaged in a DIP-20 through-hole package for easy prototyping and audio system integration.
- Manufacturer
- Texas Instruments
- Package
- Dual-In-Line Packages
- Pin Count
- 20
- Lifecycle
- OBSOLETE
- Datasheet
- LM1972N Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- ?°C to 70.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Dual-channel digital attenuator with 78 dB range in 1 dB steps for precise audio volume control
- SPI-compatible 3-wire serial interface for direct connection to microcontrollers without additional circuitry
- Low quiescent current of 2 mA from a 4.5 V to 12 V single supply for efficient audio amplifier bias stages
- DIP-20 through-hole package ideal for breadboard prototyping and legacy audio equipment repair
Applications
LM1972N is designed for digitally controlled audio attenuation in preamplifiers, mixing consoles, and home theater receivers where precise 1 dB volume steps are required under microcontroller command. Its dual-channel topology handles stereo left and right audio paths simultaneously, eliminating channel imbalance common with mechanical potentiometers. The device also suits automotive audio head units and industrial intercom systems requiring software-controlled gain without mechanical wear.
Specifications
| YTEOL | 0 |
| Consumer IC Type | CONSUMER CIRCUIT |
| JESD-30 Code | R-PDIP-T20 |
| Number of Functions | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | DIP20,.3 |
| Package Shape | RECTANGULAR |
| Package Style | IN-LINE |
| Supply Voltage-Max (Vsup) | 12V |
| Supply Voltage-Min (Vsup) | 4.5V |
| Surface Mount | NO |
| Technology | CMOS |
| Temperature Grade | COMMERCIAL |
| Terminal Form | THROUGH-HOLE |
| Terminal Pitch | 2.54mm |
| Terminal Position | DUAL |
| Package | Dual-In-Line Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| HTS Code | 8542.39.00.60 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What attenuation range and step size does the LM1972N support for audio volume control?
The LM1972N provides 78 dB of total attenuation range in 1 dB increments, plus a mute state that applies greater than 100 dB attenuation. This 79-step resolution matches human hearing perception well, as 1 dB steps are barely distinguishable, making it suitable for high-fidelity stereo preamplifiers and digital mixing boards that require smooth fade transitions.
How is the LM1972N controlled by a microcontroller, and how many data bits does each volume update require?
The LM1972N uses a 3-wire SPI-compatible interface (DATA, CLK, LOAD) and accepts an 8-bit serial word to update each channel's attenuation level. A full stereo volume update requires two 8-bit transfers clocked at up to 5 MHz, completing in under 2 µs. This allows smooth real-time audio level control from a low-cost microcontroller with any hardware or bit-banged SPI port.
What supply voltage range and quiescent current does the LM1972N require, and how does this fit into a typical preamplifier design?
The LM1972N operates from a single 4.5 V to 12 V supply and draws 2 mA quiescent current. In a preamplifier running from a 9 V wall adapter, the LM1972N dissipates only 18 mW, which is negligible compared to op-amp output stages. The single-supply operation simplifies designs that avoid split bipolar rails, common in battery-powered portable recorders.
For a stereo audio product prototype, what advantage does the DIP-20 package of the LM1972N offer over surface-mount alternatives?
The DIP-20 through-hole package with 0.3-inch row spacing allows direct insertion into standard 100-mil breadboards or DIP sockets for rapid prototyping and replacement in legacy audio equipment. Compared to SOIC or TSSOP surface-mount variants, DIP packages enable soldering with standard through-hole iron techniques and hand-assembly during evaluation of 78 dB attenuation audio circuits without stencil printing.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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