LEOLVDSRDPT STMicroelectronics Integrated Circuit (Small Outline Packages) In Stock
STMicroelectronics LEOLVDSRDPT is a radiation-hardened plastic LVDS driver-receiver line transceiver in a 20-pin SOIC package for space and high-radiation environments. Provides differential LVDS signaling with 250 mV minimum output swing and differential input for robust noise immunity. Available from stock worldwide with fast shipping.
- Manufacturer
- STMicroelectronics
- Package
- Small Outline Packages
- Pin Count
- 20
- Lifecycle
- ACTIVE
- Datasheet
- LEOLVDSRDPT Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Radiation-hardened (rad-hard) design for reliable operation in space and high-radiation industrial environments
- LVDS differential output with 250 mV minimum output swing for high noise immunity signal transmission
- Combined driver and receiver in a single 20-pin SOIC package reducing board area in rad-hard designs
- Low output current max of 2 mA enabling power-efficient differential line driving in space-constrained systems
Applications
LEOLVDSRDPT is designed for satellite payload electronics, avionics data buses, and radiation-hardened computing systems where LVDS point-to-point signaling must withstand total ionizing dose and single-event effects. Its differential driver-receiver architecture enables high-speed serial data links across the spacecraft harness with low electromagnetic emissions and strong common-mode noise rejection. The device is also applicable in nuclear plant instrumentation and particle accelerator control systems requiring radiation-tolerant logic interfaces.
Specifications
| YTEOL | 7 |
| Differential Output | YES |
| Driver Number of Bits | 1 |
| Input Characteristics | DIFFERENTIAL |
| Interface IC Type | LINE TRANSCEIVER |
| Interface Standard | GENERAL PURPOSE |
| JESD-30 Code | R-PDSO-G20 |
| Number of Functions | 1 |
| Out Swing-Min | 0.25V |
| Output Low Current-Max | 0.002A |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | TSSOP20,.25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Receive Delay-Max | 2.5ns |
| Receiver Number of Bits | 1 |
| Screening Level | AEC-Q100 |
| Supply Current-Max | 10mA |
| Supply Voltage-Max | 3.6V |
| Supply Voltage-Min | 3V |
| Supply Voltage-Nom | 3.3V |
| Surface Mount | YES |
| Technology | CMOS |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.65mm |
| Terminal Position | DUAL |
| Total Dose | 50k Rad(Si) V |
| Transmit Delay-Max | 1.5ns |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.60 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What makes LEOLVDSRDPT suitable for space and radiation-hardened applications compared to standard LVDS transceivers?
LEOLVDSRDPT uses STMicroelectronics rad-hard plastic process technology that provides tolerance to total ionizing dose (TID) levels typically encountered in low-Earth and geostationary orbit missions. Unlike commercial LVDS devices rated only for industrial temperatures, LEOLVDSRDPT is designed to maintain LVDS differential output swing of at least 250 mV and differential input sensitivity across radiation-stressed conditions, making it reliable for 10-year satellite mission lifetimes.
What is the differential output swing of LEOLVDSRDPT and how does it affect signal integrity over long cable runs?
LEOLVDSRDPT provides a minimum differential output swing of 250 mV, consistent with the LVDS standard (TIA/EIA-644). This swing level, combined with the differential signaling architecture, allows signal transmission over twisted-pair cables or PCB traces up to several meters in length while rejecting common-mode noise up to several hundred millivolts, which is critical in electrically noisy environments such as motor-drive enclosures or spacecraft chassis with multiple switching power supplies.
How does combining the LVDS driver and receiver in one 20-pin package benefit PCB design in rad-hard systems?
Integrating both the 1-bit LVDS driver and receiver into the 20-pin SOIC LEOLVDSRDPT package reduces component count by 50% compared to using separate rad-hard driver and receiver ICs, freeing up board space on radiation-hardened PCBs where layout real estate is at a premium. This integration also simplifies the bill of materials, reduces procurement complexity, and ensures matched radiation tolerance specifications between both halves of the transceiver interface.
Related Guides
1206 100 uF MLCC Design Guide for Compact Bulk Decoupling
Design guidance for applying CL31A107MQHNNNE and related 1206 MLCCs in compact bulk decoupling networks.
Jul 3, 2026
0402 10 nF MLCC Design Guide for High-Speed Decoupling
Practical design guidance for using CL05B103KB5NNNC and related 0402 MLCCs in high-speed decoupling networks.
Jul 3, 2026
CL31A107MQHNNNE 1206 100 uF MLCC Selection Guide
How to choose CL31A107MQHNNNE and related 1206 MLCCs for low-voltage bulk capacitance and regulator stability.
Jul 2, 2026
CL05B103KB5NNNC 0402 10 nF X7R MLCC Selection Guide
How to choose CL05B103KB5NNNC and related 0402 MLCCs for bypassing, filtering, voltage derating, and sourcing.
Jul 2, 2026
Why Buy from FindMyChip
About STMicroelectronics
STMicroelectronics is a global semiconductor leader serving customers across the spectrum of electronics applications. ST's products are found in a wide range of applications including automotive, industrial, personal electronics, and communications.
In Stock · 24h Response · Worldwide Shipping
Response within 24 hours · Worldwide shipping
“The anti-counterfeit verification gave us confidence we'd never had with other China suppliers.”