L99PM72GXP STMicroelectronics Integrated Circuit (Small Outline Packages) In Stock
STMicroelectronics L99PM72GXP is an automotive-grade AEC-Q100 multi-output power management IC with 12 channels for body and comfort electronics, housed in a 36-pin PowerSSO EP package. It integrates voltage supervisors, reset functions, and multiple regulated outputs in a single chip for ECU power sequencing and management. Available in stock with worldwide distribution support.
- Manufacturer
- STMicroelectronics
- Package
- Small Outline Packages
- Pin Count
- 37
- Lifecycle
- NOT RECOMMENDED
- Datasheet
- L99PM72GXP Datasheet PDF
- Category
- Integrated Circuit
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of L99PM72GXP?
- Automotive AEC-Q100 qualified 12-channel power management IC supporting multi-rail ECU power sequencing and supervision
- Integrated voltage supervisor and reset controller functions reducing external component count in automotive body electronics designs
- 36-pin PowerSSO EP package with exposed thermal pad for efficient heat dissipation in high-temperature automotive environments up to 125°C
What is L99PM72GXP used for?
The L99PM72GXP is designed for automotive body and comfort electronics applications such as body control modules (BCMs), gateway ECUs, and HVAC controllers that require multi-channel power management, sequencing, and supervision on a single AEC-Q100 qualified device. Its 12-channel architecture and integrated reset functions make it suitable for managing complex multi-processor automotive ECU platforms where reliable power-on sequencing and supervisor functions are critical to system safety.
What are the specifications of L99PM72GXP?
| YTEOL | 3 |
| Adjustable Threshold | NO |
| Analog IC - Other Type | VOLTAGE SUPERVISOR/RESET IC |
| JESD-30 Code | R-PDSO-G36 |
| JESD-609 Code | e3 |
| Number of Channels | 12 |
| Number of Functions | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage-Max (Vsup) | 28V |
| Supply Voltage-Min (Vsup) | 4.5V |
| Supply Voltage-Nom (Vsup) | 12V |
| Surface Mount | YES |
| Terminal Finish | Matte Tin (Sn) - annealed |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.5mm |
| Terminal Position | DUAL |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.60 |
| Country of Origin | Malaysia |
Where can I find the L99PM72GXP datasheet?
L99PM72GXP Datasheet DownloadOfficial datasheet from STMicroelectronics
What are equivalent replacements for L99PM72GXP?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What automotive qualification standard does the L99PM72GXP meet, and what operating temperature range does that imply?
The L99PM72GXP is qualified to AEC-Q100 Grade 1, which requires passing reliability stress tests at junction temperatures from -40°C to +125°C. This qualification makes it suitable for automotive underhood and body applications where ambient temperatures can reach 85°C or higher, and it guarantees that the 12-channel power management functions remain reliable over the full automotive lifetime of 15 years or more.
How does the 12-channel architecture of the L99PM72GXP simplify power management in a body control module design?
With 12 independent channels, the L99PM72GXP can supervise and sequence multiple supply rails, microcontrollers, and peripheral ICs within a single body control module from one AEC-Q100 device. This consolidation eliminates the need for 3 to 6 separate discrete supervisor ICs, reducing BOM cost, PCB area, and potential points of failure in safety-critical automotive body electronics that must meet functional safety targets.
What thermal advantage does the 36-pin PowerSSO EP package provide for the L99PM72GXP in an automotive ECU?
The 36-pin PowerSSO EP (Exposed Paddle) package of the L99PM72GXP provides a large exposed metal pad on the underside that conducts heat directly to the PCB copper pour, reducing thermal resistance junction-to-board by 30–50% compared to a standard small outline package without an exposed pad. This improved thermal path allows the 12-channel power management IC to operate within its thermal limits at higher continuous power dissipation in confined automotive ECU enclosures where airflow is limited.
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About STMicroelectronics
STMicroelectronics is a global semiconductor leader serving customers across the spectrum of electronics applications. ST's products are found in a wide range of applications including automotive, industrial, personal electronics, and communications.
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