IDT70V25L25PFGI IDT Integrated Circuit (Quad Flat Packages) In Stock
IDT70V25L25PFGI is a IDT integrated circuit for buffering, data logging, and digital memory subsystems. Key specs include 3.6 V, 25 ns, 131072 bit. From quote-based pricing, check in-stock availability with worldwide shipping.
- Manufacturer
- IDT
- Package
- Quad Flat Packages
- Pin Count
- 100
- Lifecycle
- OBSOLETE
- Datasheet
- IDT70V25L25PFGI Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 3.6 V key rating for integrated circuit selection
- 100-pin TQFP footprint support for PCB and BOM matching
- 25 ns specification helps qualify alternates and replacements
- Designed for buffering, data logging, and digital memory subsystems using 131072 bit
Applications
IDT70V25L25PFGI is commonly used in buffering, data logging, and digital memory subsystems where designers need 3.6 V and reliable sourcing continuity. It is also useful for repair, replacement, and production BOMs that must preserve the 100-pin TQFP format and 25 ns requirement.
Specifications
| YTEOL | 0 |
| Access Time-Max | 25ns |
| I/O Type | COMMON |
| JESD-30 Code | S-PQFP-G100 |
| JESD-609 Code | e3 |
| Memory Density | 131072bit |
| Memory IC Type | MULTI-PORT SRAM |
| Memory Width | 16 |
| Number of Functions | 1 |
| Number of Ports | 2 |
| Number of Words | 8192words |
| Number of Words Code | 8000 |
| Operating Mode | ASYNCHRONOUS |
| Organization | 8KX16 |
| Output Characteristics | 3-STATE |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | QFP100,.63SQ,20 |
| Package Shape | SQUARE |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Standby Current-Max | 0.0025A |
| Standby Voltage-Min | 3V |
| Supply Current-Max | 0.18mA |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 3V |
| Supply Voltage-Nom (Vsup) | 3.3V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | MATTE TIN |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.5mm |
| Terminal Position | QUAD |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | Quad Flat Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | EAR99 |
| HTS Code | 8542.32.00.41 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
Which designs are a good fit for IDT70V25L25PFGI with 3.6 V?
IDT70V25L25PFGI fits buffering, data logging, and digital memory subsystems when the design needs 3.6 V and 25 ns. It is a practical choice when the BOM also matches the 100-pin TQFP footprint.
How should engineers check package compatibility for IDT70V25L25PFGI?
Compare the PCB land pattern, height allowance, and assembly process against the 100-pin TQFP style. The 100 pins detail is the first check before approving a replacement.
What matters when sourcing IDT70V25L25PFGI as a replacement?
Confirm the same 3.6 V, 25 ns, manufacturer traceability, and lifecycle status before substituting it. Buyers should also verify stock for the exact 100-pin TQFP configuration.
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About IDT
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