HSEC8-140-01-SM-DV-A SAMTEC Connector (Other) In Stock

SAMTEC HSEC8-140-01-SM-DV-A is an 80-position dual-row high-speed card edge connector with 0.8 mm pitch, gold mating contacts, and surface-mount termination for high-density PCIe and FPGA mezzanine board-to-board interfaces. Available in stock worldwide with fast shipping.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
HSEC8-140-01-SM-DV-AOther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
80
Lifecycle
ACTIVE
Category
Connector
Temp Range
-55.0°C to 125.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • 80 positions at 0.8 mm pitch delivers high pin density in a compact card edge footprint for FPGA mezzanine applications
  • Gold mating contacts over tin solder tails ensure low-resistance, high-cycle reliability at the card edge interface
  • Surface-mount termination (SM suffix) enables automated PCB assembly without through-hole drilling
  • Dual-row (DV) configuration provides separate signal and power pin assignment flexibility across 80 positions

Applications

The HSEC8-140-01-SM-DV-A is designed for FPGA mezzanine card (FMC) interfaces, high-speed serial backplane applications, and PCIe add-in card edge connections requiring 80 dual-row positions at 0.8 mm pitch. It is commonly used in software-defined radio platforms, data acquisition daughter cards, and signal processing mezzanines where bandwidth demands require high pin counts in a compact surface-mount card edge footprint. Network equipment manufacturers also select this connector for line cards and switching fabric blades where the gold mating contacts ensure reliable contact resistance across thousands of insertion cycles.

Specifications

Pbfree CodeYes
Factory Lead Time2 Weeks, 1 Day
YTEOL9
Body Breadth0.28inch
Body Depth0.314inch
Body Length1.567inch
Connector TypeCARD EDGE CONNECTOR
Contact Finish MatingGOLD
Contact Finish TerminationTin (Sn) - with Nickel (Ni) barrier
Contact GenderFEMALE
Contact MaterialBERYLLIUM COPPER
Contact Resistance15
Contact StyleBELLOWED TYPE
DIN ConformanceNO
Durability1000Cycles
Filter FeatureNO
IEC ConformanceNO
Insulation Resistance1000000000Ω
Insulator ColorBLACK
Insulator MaterialLIQUID CRYSTAL POLYMER
JESD-609 Codee3
MIL ConformanceNO
Mating Contact Pitch0.032inch
Mixed ContactsNO
Mounting Option 1LOCKING
Mounting StyleSTRAIGHT
Mounting TypeBOARD
Number Of ConnectorsONE
Number Of PCB Rows2
Number of Rows Loaded2
OptionGENERAL PURPOSE
Plating Thickness30u inch
Rated Current (Signal)2.8A
Terminal Pitch0.8mm
Termination TypeSURFACE MOUNT
Total Number of Contacts80
PackageOther

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
ECCNEAR99
HTS Code8536.69.40.40
Country of OriginMalaysia, USA

Datasheet

HSEC8-140-01-SM-DV-A Datasheet Download

Official datasheet from SAMTEC

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

How many positions and at what pitch does the HSEC8-140-01-SM-DV-A card edge connector support?

The HSEC8-140-01-SM-DV-A provides 80 positions in a dual-row configuration at 0.8 mm pitch, resulting in a high-density card edge interface with 160 total contact positions. This pitch and count are compatible with FPGA mezzanine card (FMC) standards, making it a drop-in choice for high-speed FPGA daughter card designs.

How does the gold mating contact finish of the HSEC8-140-01-SM-DV-A affect insertion cycle life in frequently swapped mezzanine cards?

Gold mating contacts maintain consistently low contact resistance across many hundreds of insertion cycles without developing the oxide layer that tin contacts accumulate over time. For FPGA development platforms where mezzanine cards are swapped frequently during prototyping, the gold finish of the HSEC8-140-01-SM-DV-A ensures repeatable signal integrity at 0.8 mm pitch contacts that would be difficult to maintain with tin-only mating surfaces.

Why do software-defined radio platforms prefer the HSEC8-140-01-SM-DV-A over a standard 2.54 mm pitch card edge connector?

Software-defined radio mezzanines require high-speed ADC and DAC data paths operating at several gigasamples per second, which demands short, closely spaced differential pairs that a 0.8 mm pitch dual-row 80-position connector provides far more efficiently than a 2.54 mm pitch alternative. The tighter pitch of the HSEC8-140-01-SM-DV-A also reduces the overall connector length by more than 60%, preserving precious PCB real estate on already-dense RF front-end boards.

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About SAMTEC

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AvailabilityIn Stock
Reference Price (USD)
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Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

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