HSEC8-140-01-SM-DV-A SAMTEC Connector (Other) In Stock
SAMTEC HSEC8-140-01-SM-DV-A is an 80-position dual-row high-speed card edge connector with 0.8 mm pitch, gold mating contacts, and surface-mount termination for high-density PCIe and FPGA mezzanine board-to-board interfaces. Available in stock worldwide with fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 80
- Lifecycle
- ACTIVE
- Datasheet
- HSEC8-140-01-SM-DV-A Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 80 positions at 0.8 mm pitch delivers high pin density in a compact card edge footprint for FPGA mezzanine applications
- Gold mating contacts over tin solder tails ensure low-resistance, high-cycle reliability at the card edge interface
- Surface-mount termination (SM suffix) enables automated PCB assembly without through-hole drilling
- Dual-row (DV) configuration provides separate signal and power pin assignment flexibility across 80 positions
Applications
The HSEC8-140-01-SM-DV-A is designed for FPGA mezzanine card (FMC) interfaces, high-speed serial backplane applications, and PCIe add-in card edge connections requiring 80 dual-row positions at 0.8 mm pitch. It is commonly used in software-defined radio platforms, data acquisition daughter cards, and signal processing mezzanines where bandwidth demands require high pin counts in a compact surface-mount card edge footprint. Network equipment manufacturers also select this connector for line cards and switching fabric blades where the gold mating contacts ensure reliable contact resistance across thousands of insertion cycles.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 2 Weeks, 1 Day |
| YTEOL | 9 |
| Body Breadth | 0.28inch |
| Body Depth | 0.314inch |
| Body Length | 1.567inch |
| Connector Type | CARD EDGE CONNECTOR |
| Contact Finish Mating | GOLD |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | FEMALE |
| Contact Material | BERYLLIUM COPPER |
| Contact Resistance | 15mΩ |
| Contact Style | BELLOWED TYPE |
| DIN Conformance | NO |
| Durability | 1000Cycles |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulation Resistance | 1000000000Ω |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.032inch |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| Plating Thickness | 30u inch |
| Rated Current (Signal) | 2.8A |
| Terminal Pitch | 0.8mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 80 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Malaysia, USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and at what pitch does the HSEC8-140-01-SM-DV-A card edge connector support?
The HSEC8-140-01-SM-DV-A provides 80 positions in a dual-row configuration at 0.8 mm pitch, resulting in a high-density card edge interface with 160 total contact positions. This pitch and count are compatible with FPGA mezzanine card (FMC) standards, making it a drop-in choice for high-speed FPGA daughter card designs.
How does the gold mating contact finish of the HSEC8-140-01-SM-DV-A affect insertion cycle life in frequently swapped mezzanine cards?
Gold mating contacts maintain consistently low contact resistance across many hundreds of insertion cycles without developing the oxide layer that tin contacts accumulate over time. For FPGA development platforms where mezzanine cards are swapped frequently during prototyping, the gold finish of the HSEC8-140-01-SM-DV-A ensures repeatable signal integrity at 0.8 mm pitch contacts that would be difficult to maintain with tin-only mating surfaces.
Why do software-defined radio platforms prefer the HSEC8-140-01-SM-DV-A over a standard 2.54 mm pitch card edge connector?
Software-defined radio mezzanines require high-speed ADC and DAC data paths operating at several gigasamples per second, which demands short, closely spaced differential pairs that a 0.8 mm pitch dual-row 80-position connector provides far more efficiently than a 2.54 mm pitch alternative. The tighter pitch of the HSEC8-140-01-SM-DV-A also reduces the overall connector length by more than 60%, preserving precious PCB real estate on already-dense RF front-end boards.
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