HCC4075BDG STMicroelectronics Integrated Circuit (Ceramic Dual-In-Line Packages) In Stock
HCC4075BDG is a STMicroelectronics Integrated Circuit for embedded systems, signal routing, communication interfaces, and control electronics. It combines -55°C to 125°C with Ceramic Dual-In-Line Packages with 14 pins. FindMyChip supports technical sourcing, stock checks, and worldwide shipping for this part.
- Manufacturer
- STMicroelectronics
- Package
- Ceramic Dual-In-Line Packages
- Pin Count
- 14
- Lifecycle
- ACTIVE
- Datasheet
- HCC4075BDG Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of HCC4075BDG?
- -55°C to 125°C key electrical or mechanical rating from supplier data
- Ceramic Dual-In-Line Packages with 14 pins package information for PCB and assembly planning
- Integrated Circuit classification for BOM search, sourcing, and alternates review
- Manufacturer-listed STMicroelectronics part number for traceable procurement workflows
What is HCC4075BDG used for?
HCC4075BDG is suited to embedded systems, signal routing, communication interfaces, and control electronics, especially when engineers need -55°C to 125°C and a traceable STMicroelectronics sourcing path. It supports repair, prototype, and production purchasing workflows where package, lifecycle, and parameter checks must be reviewed before release.
What are the specifications of HCC4075BDG?
| Manufacturer Package Code | DIL14 FP |
| YTEOL | 5 |
| Family | 4000/14000/40000 |
| JESD-30 Code | R-GDIP-T14 |
| Logic IC Type | OR GATE |
| Number of Functions | 3 |
| Number of Inputs | 3 |
| Package Body Material | CERAMIC, GLASS-SEALED |
| Package Equivalence Code | DIP14,.3 |
| Package Shape | RECTANGULAR |
| Package Style | IN-LINE |
| Packing Method | TR |
| Schmitt Trigger | NO |
| Screening Level | EUROPEAN SPACE AGENCY |
| Supply Voltage-Max (Vsup) | 20V |
| Supply Voltage-Min (Vsup) | 3V |
| Supply Voltage-Nom (Vsup) | 5V |
| Surface Mount | NO |
| Technology | CMOS |
| Terminal Form | THROUGH-HOLE |
| Terminal Pitch | 2.54mm |
| Terminal Position | DUAL |
| Total Dose | 100k Rad(Si) V |
| Package | Ceramic Dual-In-Line Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.60 |
| Country of Origin | France |
Where can I find the HCC4075BDG datasheet?
HCC4075BDG Datasheet DownloadOfficial datasheet from STMicroelectronics
What are equivalent replacements for HCC4075BDG?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
Which design requirements make HCC4075BDG a good fit for integrated circuit applications?
HCC4075BDG is a STMicroelectronics Integrated Circuit that suits embedded systems, signal routing, communication interfaces, and control electronics when the design needs -55°C to 125°C. Engineers should compare the captured supplier parameters with the final datasheet before release.
How should engineers account for package or assembly constraints on HCC4075BDG?
The available package data lists Ceramic Dual-In-Line Packages with 14 pins, and the relevant rating includes -55°C to 125°C. Check footprint, thermal margin, and assembly notes against the approved datasheet before committing the PCB.
What should procurement teams confirm before quoting HCC4075BDG for production builds?
Procurement should confirm quantity, date code, lifecycle status, and acceptable alternates for HCC4075BDG. The sourcing review should include -55°C to 125°C so engineering and purchasing evaluate the same requirement.
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Why Buy from FindMyChip
About STMicroelectronics
STMicroelectronics is a global semiconductor leader serving customers across the spectrum of electronics applications. ST's products are found in a wide range of applications including automotive, industrial, personal electronics, and communications.
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