HCC4050BDG STMicroelectronics Integrated Circuit (Ceramic Dual-In-Line Packages) In Stock
HCC4050BDG is a radiation-hardened CMOS hex buffer/level translator from STMicroelectronics in the 4000B logic family, with 6 independent single-input buffers supporting CMOS-to-TTL level translation in a ceramic DIP-16 package. From $2.00 in stock with worldwide shipping.
- Manufacturer
- STMicroelectronics
- Package
- Ceramic Dual-In-Line Packages
- Pin Count
- 16
- Lifecycle
- ACTIVE
- Datasheet
- HCC4050BDG Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Radiation-hardened CMOS 4000B hex buffer supports CMOS-to-TTL level translation for space and harsh-environment applications
- 6 independent non-inverting buffer channels with single inputs allow flexible signal routing in a ceramic DIP-16 footprint
- Wide supply voltage range from 3 V to 15 V enables direct interfacing between CMOS logic and TTL devices without extra level-shift circuitry
Applications
The HCC4050BDG is designed for space, military, and industrial systems requiring reliable CMOS logic operation in radiation environments. Its 6-channel buffer capability makes it ideal for driving TTL loads directly from CMOS controllers operating at 3 V to 15 V, such as in satellite subsystems and avionics control boards. The ceramic hermetic package provides long-term reliability where moisture resistance and thermal stability are critical.
Specifications
| Manufacturer Package Code | DIL16 FP |
| YTEOL | 5 |
| Additional Feature | CMOS-TTL LEVEL TRANSLATOR |
| Family | 4000/14000/40000 |
| JESD-30 Code | R-CDIP-T16 |
| Logic IC Type | BUFFER |
| Number of Functions | 6 |
| Number of Inputs | 1 |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED |
| Package Equivalence Code | DIP16,.3 |
| Package Shape | RECTANGULAR |
| Package Style | IN-LINE |
| Packing Method | TR |
| Schmitt Trigger | NO |
| Screening Level | EUROPEAN SPACE AGENCY |
| Supply Voltage-Max (Vsup) | 20V |
| Supply Voltage-Min (Vsup) | 3V |
| Supply Voltage-Nom (Vsup) | 5V |
| Surface Mount | NO |
| Technology | CMOS |
| Temperature Grade | MILITARY |
| Terminal Form | THROUGH-HOLE |
| Terminal Pitch | 2.54mm |
| Terminal Position | DUAL |
| Total Dose | 100k Rad(Si) V |
| Package | Ceramic Dual-In-Line Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.60 |
| Country of Origin | France |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What supply voltage range does HCC4050BDG support for CMOS-to-TTL level translation?
HCC4050BDG operates from 3 V to 15 V supply, which allows it to translate CMOS signals referenced to a 5 V or higher rail down to TTL-compatible 3.3 V logic levels. The 6 non-inverting buffer channels can each handle individual signal lines, making it a compact solution for multi-channel interface boards.
Which radiation-sensitive applications are best served by the HCC4050BDG ceramic DIP-16 package?
HCC4050BDG in the ceramic DIP-16 hermetic package is suited for satellite payloads, launch vehicle avionics, and nuclear instrumentation where radiation tolerance and moisture resistance are mandatory. The ceramic metal-sealed co-fired package maintains device integrity across the full military temperature range of -55°C to +125°C, well beyond the capability of plastic packages.
How many signal channels can HCC4050BDG buffer simultaneously, and what is the per-channel logic structure?
HCC4050BDG provides 6 independent buffer channels, each with 1 input and 1 non-inverting output. All 6 channels fit within the 16-pin ceramic DIP footprint, so a single device can handle up to 6 parallel address or data lines, reducing component count compared to using multiple 1-of-1 buffer ICs in the same board area.
Related Guides
1206 100 uF MLCC Design Guide for Compact Bulk Decoupling
Design guidance for applying CL31A107MQHNNNE and related 1206 MLCCs in compact bulk decoupling networks.
Jul 3, 2026
0402 10 nF MLCC Design Guide for High-Speed Decoupling
Practical design guidance for using CL05B103KB5NNNC and related 0402 MLCCs in high-speed decoupling networks.
Jul 3, 2026
CL31A107MQHNNNE 1206 100 uF MLCC Selection Guide
How to choose CL31A107MQHNNNE and related 1206 MLCCs for low-voltage bulk capacitance and regulator stability.
Jul 2, 2026
CL05B103KB5NNNC 0402 10 nF X7R MLCC Selection Guide
How to choose CL05B103KB5NNNC and related 0402 MLCCs for bypassing, filtering, voltage derating, and sourcing.
Jul 2, 2026
Why Buy from FindMyChip
About STMicroelectronics
STMicroelectronics is a global semiconductor leader serving customers across the spectrum of electronics applications. ST's products are found in a wide range of applications including automotive, industrial, personal electronics, and communications.
In Stock · 24h Response · Worldwide Shipping
Response within 24 hours · Worldwide shipping
“We've been using FindMyChip for 2 years. Pricing is consistently 20-30% below Mouser/DigiKey for volume orders.”