FX12B-60S-0.4SV Hirose In Stock
The FX12B-60S-0.4SV is a board stacking connector from Hirose featuring a robust design for high-density interconnects with 60-position configuration and 0.4mm contact pitch enabling compact multilayer PCB integration. Key specs: lead-free construction, 38-week manufacturing lead time, and reliable mating cycles for demanding industrial applications. Available globally from stock with competitive pricing and expedited worldwide shipping options.
- Manufacturer
- Hirose
- Package
- —
- Lifecycle
- NOT RECOMMENDED
- Datasheet
- FX12B-60S-0.4SV Datasheet PDF
- Price
- From $0.6185(MOQ 1)
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 60-position contact array with 0.4mm pitch enables ultra-compact 12-layer PCB stacking architectures
- Board stacking design provides reliable vertical interconnects for module-to-module communications in compact systems
- Hirose precision engineering ensures low-insertion-force mating and consistent contact reliability across 500+ cycles
Applications
The FX12B-60S-0.4SV is ideal for modular computing systems, high-density test fixtures, and industrial equipment requiring compact board-to-board interconnects. Its 60-position configuration supports signal and power distribution in stackable modules used in telecommunications equipment, programmable logic controllers, and data acquisition systems. The ultra-compact 0.4mm pitch enables space-efficient designs where traditional connectors would consume excessive board area.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 38Weeks |
| YTEOL | 3 |
| Connector Type | BOARD STACKING CONNECTOR |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Indonesia |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the contact pitch and signal capacity of the FX12B-60S-0.4SV board stacking connector?
The FX12B-60S-0.4SV provides 60-position contacts at 0.4mm pitch, enabling high-density interconnects in compact PCB stacking applications. This configuration supports 48-60 signal lines plus power/ground connections, ideal for modular systems requiring 100+ MHz signal integrity with controlled impedance. The 0.4mm pitch reduces connector footprint by 75% versus standard 2mm pitch alternatives.
For high-reliability industrial equipment using stackable PCB modules, how does the FX12B-60S-0.4SV ensure contact integrity?
Hirose's FX12B-60S-0.4SV provides gold-plated contacts rated for 500+ insertion cycles with low contact resistance below 50 mOhm, ensuring reliable operation throughout 5+ year system service life. The board stacking design with mechanical guidance prevents misalignment, making it suitable for harsh industrial environments, telecommunications cabinets, and test systems requiring hands-on module removal/replacement.
Can the FX12B-60S-0.4SV support both high-speed signal and 5V power distribution simultaneously in modular designs?
Yes, the 60-position configuration allows flexible allocation of 48-52 high-speed signal lines (supporting GHz-class data rates) plus dedicated 5V/12V power pairs and ground returns. This mixed-signal capability with 38-week lead time manufacturing makes it ideal for telecom line cards, industrial I/O modules, and test equipment requiring simultaneous analog sensors and high-speed digital communications.
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About Hirose
Hirose is a leading electronic component manufacturer. FindMyChip sources Hirose ICs directly from authorized China distributors, offering competitive pricing and reliable stock.
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| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 1+ | $0.6849 | $0.68 |
| 10+ | $0.6185 | $6.19 |
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