DRA790BAGCBDQ1 Texas Instruments Integrated Circuit (BGA) In Stock
DRA790BAGCBDQ1 is an AEC-Q100 qualified ARM Cortex-A15 SoC from Texas Instruments running at 300 MHz with integrated DSP, designed for automotive audio amplifier and infotainment applications. Supports -40°C to +125°C operating range and is packaged in a 538-pin FCBGA for high-density automotive PCB integration. Qualified under AEC-Q100 Grade 1 for long-term automotive reliability in body and cockpit electronics.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 538
- Lifecycle
- ACTIVE
- Datasheet
- DRA790BAGCBDQ1 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of DRA790BAGCBDQ1?
- Dual ARM Cortex-A15 cores at 300 MHz with integrated DSP deliver high-performance audio processing for automotive amplifier designs
- AEC-Q100 Grade 1 qualified over -40°C to +125°C ensuring long-term reliability in automotive underhood and cockpit environments
- 538-pin FCBGA package integrates rich peripheral set including audio serializer interfaces and multi-channel DMA for system-on-chip integration
What is DRA790BAGCBDQ1 used for?
The DRA790BAGCBDQ1 targets automotive audio amplifier controllers, DSP-based active noise cancellation systems, and digital signal processing in infotainment head units requiring real-time audio latency below 1 ms. Its AEC-Q100 qualification and wide -40°C to +125°C thermal range make it suitable for automotive cockpit domain controllers where high computational throughput and hardware-accelerated audio pipelines are required.
What are the specifications of DRA790BAGCBDQ1?
| Pbfree Code | Yes |
| Date Of Intro | 2018-08-30 |
| YTEOL | 15 |
| JESD-30 Code | S-PBGA-B538 |
| JESD-609 Code | e1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Screening Level | AEC-Q100 |
| Supply Voltage-Max | 1.2V |
| Supply Voltage-Min | 1.11V |
| Supply Voltage-Nom | 1.15V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | AUTOMOTIVE |
| Terminal Form | BALL |
| Terminal Pitch | 0.65mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| uPs/uCs/Peripheral ICs Type | SoC |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | 5A992.C |
| HTS Code | 8542.31.00.35 |
Where can I find the DRA790BAGCBDQ1 datasheet?
DRA790BAGCBDQ1 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for DRA790BAGCBDQ1?
Compatible alternatives and drop-in replacements for DRA790BAGCBDQ1:
Frequently Asked Questions
Which automotive safety and reliability standards does DRA790BAGCBDQ1 comply with for use in vehicle cockpit electronics?
DRA790BAGCBDQ1 is qualified to AEC-Q100 Grade 1, covering a junction temperature range of -40°C to +125°C. This qualification confirms the device withstands automotive thermal cycling, humidity, and electrostatic discharge conditions defined by JEDEC and AECQ stress tests, making it acceptable for cockpit domain controllers, digital amplifiers, and infotainment modules in passenger vehicles that must pass OEM reliability validation gates.
How does the integrated DSP in DRA790BAGCBDQ1 benefit real-time automotive audio processing compared to a CPU-only processor?
The on-chip DSP in DRA790BAGCBDQ1 handles compute-intensive tasks such as FIR filtering, FFT-based equalization, and active noise cancellation algorithms with deterministic latency well below 1 ms, without burdening the 300 MHz ARM Cortex-A15 application cores. Offloading these fixed-function tasks to the DSP frees the A15 cores for audio stream management, user interface rendering, and CAN or LIN bus communication in the same SoC.
What PCB design challenges does the 538-pin FCBGA package of DRA790BAGCBDQ1 present, and how are they typically addressed?
The 538-ball FCBGA requires high-density PCB routing with at least 4 to 6 signal layers to fan out power delivery, DDR memory interfaces, and audio serializer lines from the fine-pitch ball grid. Controlled impedance traces for high-speed differential pairs must maintain 100-ohm differential impedance, and the BGA courtyard demands strict pick-and-place accuracy within ±0.05 mm to avoid bridging under X-ray inspection at 260°C peak reflow temperature.
For an automotive audio amplifier design, when would DRA790BAGCBDQ1 be selected over a discrete DSP plus microcontroller approach?
DRA790BAGCBDQ1 consolidates a 300 MHz ARM Cortex-A15, DSP, and peripheral interfaces into a single 538-pin SoC, reducing BOM count, PCB area, and inter-chip communication latency compared to a discrete DSP plus MCU topology. Integration eliminates the 5 ns to 20 ns serialization overhead of an external audio data bus, which matters for multi-channel amplifiers processing 32 audio channels at 192 kHz sample rates where synchronization jitter must stay below 10 ns.
Related Guides
CSD87313DMS Synchronous Buck Power Stage Design Guide
Design a compact CSD87313DMS synchronous buck stage with practical guidance for loss, gate drive, PCB layout, EMI, thermal validation, and sourcing.
Aug 6, 2026
STEF05SGR eFuse Selection Guide for 5 V Overcurrent Protection
Choose STEF05SGR for 5 V overcurrent protection by checking current-limit margin, inrush, thermal loss, fault response, and sourcing.
Aug 6, 2026
C0402C103K3RACTU Selection Guide: Choosing a 10 nF 0402 MLCC
Select C0402C103K3RACTU by voltage margin, X7R behavior, tolerance, 0402 assembly risk, and qualified alternatives.
Aug 4, 2026
STM32H753VIT6 MCU Selection Guide: Memory, Package, Connectivity, and Security
Choose STM32H753VIT6 by evaluating memory architecture, LQFP-100 pin fit, connectivity, security, power, and sourcing tradeoffs.
Aug 4, 2026
Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
More from Texas Instruments
In Stock · 24h Response · Worldwide Shipping
Response within 24 hours · Worldwide shipping
“Their engineering team helped us find a pin-compatible alternative when our original MCU went EOL.”
You May Also Like
ACS770ECB-200U-PFF-T
Allegro Microsystems
Integrated Circuit
ACS770KCB-150U-PFF-T
Allegro Microsystems
Integrated Circuit
MC33901WEF
NXP
Integrated Circuit
MC7808BDTRKG
ON Semiconductor
Integrated Circuit
PA94EC
Apex Microtechnology
Integrated Circuit
AP7315-28SR-7
Diodes Inc.
Integrated Circuit
74HCT245D
Nexperia
Integrated Circuit
CY62256VNLL-70ZXCT
Cypress Semiconductor
Integrated Circuit
EPM7032AETC44-4N
Intel
Integrated Circuit
EPM3512AQC208-10N
Intel
Integrated Circuit
EPM3256ATC144-7N
Intel
Integrated Circuit
EPM3256AQC208-7N
Intel
Integrated Circuit
EPM3256AQC208-10N
Intel
Integrated Circuit
EPM3128ATC100-7N
Intel
Integrated Circuit
EPM1270F256C4N
Intel
Integrated Circuit
EPF8282ATC100-4N
Intel
Integrated Circuit
EPF6016QC208-2N
Intel
Integrated Circuit
EPF6016ATC144-3N
Intel
Integrated Circuit
EPF10K30ATC144-3N
Intel
Integrated Circuit
EPC2TI32N
Intel
Integrated Circuit
EPC2LC20
Intel
Integrated Circuit
EP3SL150F1152C4N
Intel
Integrated Circuit
EP2SGX60DF780C5N
Intel
Integrated Circuit
EP2SGX60CF780C5N
Intel
Integrated Circuit