CDC5806PWG4 Texas Instruments Integrated Circuit (Small Outline Packages) In Stock
The CDC5806PWG4 is a PLL-based clock generator providing 6 simultaneous output clocks in a 20-pin TSSOP package. It distributes a single reference clock to six identical outputs with low skew for synchronous digital systems. Available in stock worldwide with RoHS-compliant lead-free packaging.
- Manufacturer
- Texas Instruments
- Package
- Small Outline Packages
- Pin Count
- 20
- Lifecycle
- OBSOLETE
- Datasheet
- CDC5806PWG4 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of CDC5806PWG4?
- 6 true output clocks driven simultaneously from a single PLL reference
- PLL-based architecture ensures low output-to-output skew across all 6 outputs
- Compact 20-pin TSSOP package minimizes PCB footprint in dense designs
- Standard input conditioning for compatibility with common clock source levels
- Single-function design simplifies clock distribution in synchronous digital systems
What is CDC5806PWG4 used for?
The CDC5806PWG4 is designed for clock distribution in synchronous digital systems such as FPGAs, DSPs, microcontrollers, and memory arrays that require multiple identical clock signals with minimal skew. Its 6-output PLL architecture is well-suited for PCIe, DDR memory interfaces, and network switch designs where clock tree synthesis requires fan-out from a single reference oscillator. The TSSOP-20 package enables use in compact industrial, telecommunications, and embedded computing boards.
What are the specifications of CDC5806PWG4?
| YTEOL | 0 |
| Family | 5806 |
| Input Conditioning | STANDARD |
| JESD-30 Code | R-PDSO-G20 |
| JESD-609 Code | e4 |
| Logic IC Type | PLL BASED CLOCK DRIVER |
| Number of Functions | 1 |
| Number of True Outputs | 6 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | TSSOP20,.25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Packing Method | TUBE |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 3V |
| Supply Voltage-Nom (Vsup) | 3.3V |
| Surface Mount | YES |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | NICKEL PALLADIUM GOLD |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.65mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| HTS Code | 8542.39.00.60 |
Where can I find the CDC5806PWG4 datasheet?
CDC5806PWG4 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for CDC5806PWG4?
Compatible alternatives and drop-in replacements for CDC5806PWG4:
PLL Based Clock Driver, 5806 Series, 6 True Output(s), 0 Inverted Output(s), PDSO20
Frequently Asked Questions
In what systems does CDC5806PWG4 make sense when 20-pin is required?
CDC5806PWG4 is documented as a Integrated Circuit with a 20-pin characteristic, so designers can consider it for systems whose electrical, mechanical, and environmental requirements match official manufacturer data.
How should layout teams accommodate CDC5806PWG4 and its 20-pin characteristic?
Engineers should verify the 20-pin characteristic together with the manufacturer footprint, pin mapping, orientation, clearances, and assembly profile before releasing a PCB that uses CDC5806PWG4.
Does procurement need to validate the 20-pin detail for CDC5806PWG4?
Procurement teams should confirm CDC5806PWG4, its documented 20-pin characteristic, lifecycle status, packaging, lot traceability, and approved-source documentation before committing any production order.
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Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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