CD54HCT367F3A Texas Instruments Integrated Circuit (Ceramic Dual-In-Line Packages) In Stock
Texas Instruments CD54HCT367F3A is a hex non-inverting buffer and line driver in the HCT logic family, featuring active-low enable control and 50 pF load capacitance rating in a 16-pin ceramic DIP package. It provides TTL-compatible inputs with CMOS output drive levels. Available from stock worldwide.
- Manufacturer
- Texas Instruments
- Package
- Ceramic Dual-In-Line Packages
- Pin Count
- 16
- Lifecycle
- ACTIVE
- Datasheet
- CD54HCT367F3A Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of CD54HCT367F3A?
- HCT logic family with TTL-compatible input thresholds driving CMOS output levels for mixed-logic interfacing
- Hex (6-channel) non-inverting buffer with active-low enable, rated for 50 pF load capacitance per output
- 16-pin ceramic DIP package meeting MIL-spec reliability standards for aerospace and defense applications
What is CD54HCT367F3A used for?
The CD54HCT367F3A is used in military-grade and high-reliability digital systems as a bus driver and signal buffer between TTL and CMOS logic sections. Its ceramic package and MIL-883 screening suitability make it appropriate for aerospace avionics, space subsystem interfaces, and ruggedized industrial controllers. The active-low enable inputs allow multiple devices to share a common data bus with controlled drive contention.
What are the specifications of CD54HCT367F3A?
| Pbfree Code | Yes |
| YTEOL | 15 |
| Additional Feature | ONE FUNCTION WITH TWO BITS |
| Control Type | ENABLE LOW |
| Count Direction | UNIDIRECTIONAL |
| Family | HCT |
| JESD-30 Code | R-GDIP-T16 |
| JESD-609 Code | e0 |
| Load Capacitance (CL) | 50pF |
| Logic IC Type | BUS DRIVER |
| Max I(ol) | 0.006A |
| Number of Bits | 4 |
| Number of Functions | 6 |
| Number of Ports | 2 |
| Output Characteristics | 3-STATE |
| Output Polarity | TRUE |
| Package Body Material | CERAMIC, GLASS-SEALED |
| Package Equivalence Code | DIP16,.3 |
| Package Shape | RECTANGULAR |
| Package Style | IN-LINE |
| Packing Method | TUBE |
| Power Supply Current-Max (ICC) | 0.08mA |
| Prop. Delay@Nom-Sup | 38ns |
| Propagation Delay (tpd) | 38ns |
| Qualification Status | Not Qualified |
| Screening Level | 38535Q/M;38534H;883B |
| Supply Voltage-Max (Vsup) | 5.5V |
| Supply Voltage-Min (Vsup) | 4.5V |
| Supply Voltage-Nom (Vsup) | 5V |
| Surface Mount | NO |
| Technology | CMOS |
| Temperature Grade | MILITARY |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Terminal Form | THROUGH-HOLE |
| Terminal Pitch | 2.54mm |
| Terminal Position | DUAL |
| Package | Ceramic Dual-In-Line Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.90 |
Where can I find the CD54HCT367F3A datasheet?
CD54HCT367F3A Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for CD54HCT367F3A?
Compatible alternatives and drop-in replacements for CD54HCT367F3A:
Frequently Asked Questions
What load capacitance is the CD54HCT367F3A rated for and how does it affect signal integrity?
The CD54HCT367F3A is rated for 50 pF load capacitance per output channel, which sets the maximum trace and input capacitance the device can drive while meeting its propagation delay and output voltage specifications. Exceeding 50 pF increases rise and fall times, degrading signal integrity on high-speed bus lines.
How does the active-low enable control on the CD54HCT367F3A support multi-device bus architectures?
The two active-low enable inputs allow the CD54HCT367F3A to be selectively enabled or placed in a high-impedance state, preventing bus contention when multiple drivers share a common 6-bit data bus. This tri-state control supports standard address-decoded bus multiplexing in backplane and multi-board digital systems.
Why is the ceramic DIP package of the CD54HCT367F3A preferred in aerospace and defense applications over plastic SOIC variants?
The ceramic DIP package offers superior hermeticity, resisting moisture ingress at the die level compared to plastic encapsulation. This makes the CD54HCT367F3A suitable for MIL-STD-883 screening and long-term storage in avionics and satellite subsystems where plastic packages fail thermal cycling tests beyond -55°C to 125°C.
How does the HCT logic family of the CD54HCT367F3A enable direct replacement of TTL bus drivers?
HCT devices accept TTL input logic levels (V_IH ≥ 2.0 V, V_IL ≤ 0.8 V) while driving CMOS-compatible output swings close to the 5 V supply rail. This allows the CD54HCT367F3A to directly replace older 74LS367 or 74S367 TTL bus drivers in 5 V legacy boards without logic-level translation circuits.
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Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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