CD54HC40105F3A Texas Instruments Integrated Circuit (Ceramic Dual-In-Line Packages) In Stock
Texas Instruments CD54HC40105F3A is a high-speed CMOS 4-bit x 16-word FIFO register IC in a ceramic 16-pin DIP package with up to 10 MHz clock frequency and 2250 ns access time. Provides 64-bit FIFO buffering with 4-bit wide data path for asynchronous data transfer between systems. Available from authorized distributors with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- Ceramic Dual-In-Line Packages
- Pin Count
- 16
- Lifecycle
- ACTIVE
- Datasheet
- CD54HC40105F3A Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 64-bit (4-bit wide x 16-word deep) first-in first-out (FIFO) register operating at up to 10 MHz clock frequency for reliable asynchronous data buffering
- 500 ns cycle time and 2250 ns maximum access time enable stable interfacing between subsystems with differing clock domains or processing speeds
- Ceramic 16-pin DIP (CDIP-16) package provides enhanced reliability and temperature tolerance for military, aerospace, and high-reliability industrial applications
Applications
The CD54HC40105F3A is used for rate-matching and data buffering between processors, DSPs, and communication controllers in embedded systems where asynchronous 4-bit data streams must be decoupled. Its ceramic DIP package and wide supply voltage range make it suitable for military-grade avionics, industrial control computers, and legacy-compatible data acquisition systems requiring robust 64-bit FIFO buffering.
Specifications
| Pbfree Code | Yes |
| YTEOL | 15 |
| Access Time-Max | 2250ns |
| Clock Frequency-Max (fCLK) | 10MHz |
| Cycle Time | 500ns |
| JESD-30 Code | R-GDIP-T16 |
| JESD-609 Code | e0 |
| Memory Density | 64bit |
| Memory IC Type | OTHER FIFO |
| Memory Width | 4 |
| Number of Functions | 1 |
| Number of Words | 16words |
| Number of Words Code | 16 |
| Operating Mode | SYNCHRONOUS |
| Organization | 16X4 |
| Output Characteristics | 3-STATE |
| Output Enable | YES |
| Package Body Material | CERAMIC, GLASS-SEALED |
| Package Equivalence Code | DIP16,.3 |
| Package Shape | RECTANGULAR |
| Package Style | IN-LINE |
| Parallel/Serial | PARALLEL |
| Qualification Status | Not Qualified |
| Screening Level | 38535Q/M;38534H;883B |
| Supply Voltage-Max (Vsup) | 6V |
| Supply Voltage-Min (Vsup) | 2V |
| Supply Voltage-Nom (Vsup) | 4.5V |
| Surface Mount | NO |
| Technology | CMOS |
| Temperature Grade | MILITARY |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Terminal Form | THROUGH-HOLE |
| Terminal Pitch | 2.54mm |
| Terminal Position | DUAL |
| Package | Ceramic Dual-In-Line Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.90 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the FIFO depth and data width of the CD54HC40105F3A?
The CD54HC40105F3A is a 4-bit wide by 16-word deep FIFO register, providing 64 bits of total storage. It operates at a maximum clock frequency of 10 MHz with a cycle time of 500 ns, enabling efficient asynchronous data buffering between digital subsystems operating at different rates.
For an asynchronous serial-to-parallel interface design, how does the CD54HC40105F3A facilitate data rate matching?
The CD54HC40105F3A provides 16 words x 4-bit FIFO buffering with independent read and write controls, allowing a fast 10 MHz write clock side to fill the buffer independently from a slower read clock domain. The 2250 ns maximum access time gives the receiving processor ample setup time to read valid data, preventing data loss during asynchronous domain crossing.
Why is the ceramic DIP package of the CD54HC40105F3A significant for high-reliability system procurement?
The ceramic dual-in-line package (CDIP-16) of the CD54HC40105F3A offers superior hermetic sealing compared to plastic DIP packages, making it suitable for military, aerospace, and high-reliability industrial designs. Ceramic packaging withstands wider temperature extremes and moisture ingress, and parts with JESD-609 code e0 confirm RoHS-compliant lead-free construction for modern compliance requirements.
Related Guides
1206 100 uF MLCC Design Guide for Compact Bulk Decoupling
Design guidance for applying CL31A107MQHNNNE and related 1206 MLCCs in compact bulk decoupling networks.
Jul 3, 2026
0402 10 nF MLCC Design Guide for High-Speed Decoupling
Practical design guidance for using CL05B103KB5NNNC and related 0402 MLCCs in high-speed decoupling networks.
Jul 3, 2026
CL31A107MQHNNNE 1206 100 uF MLCC Selection Guide
How to choose CL31A107MQHNNNE and related 1206 MLCCs for low-voltage bulk capacitance and regulator stability.
Jul 2, 2026
CL05B103KB5NNNC 0402 10 nF X7R MLCC Selection Guide
How to choose CL05B103KB5NNNC and related 0402 MLCCs for bypassing, filtering, voltage derating, and sourcing.
Jul 2, 2026
Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
In Stock · 24h Response · Worldwide Shipping
Response within 24 hours · Worldwide shipping
“We've been using FindMyChip for 2 years. Pricing is consistently 20-30% below Mouser/DigiKey for volume orders.”