CD4049UBF Texas Instruments Logic ICs (Ceramic DIP-16) In Stock
CD4049UBF is a CMOS hex inverter buffer with CMOS-to-TTL level translation capability by Texas Instruments in a 16-pin ceramic DIP package. Key specs: 6 inverter functions, 50 pF load capacitance, 18 mA output low current. From $0.40, in stock with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- Ceramic DIP-16
- Pin Count
- 16
- Lifecycle
- ACTIVE
- Datasheet
- CD4049UBF Datasheet PDF
- Category
- Logic ICs
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 6 independent CMOS inverter buffers with CMOS-to-TTL level translation in a single 16-pin package
- 50 pF rated load capacitance and 18 mA output low current drive moderate logic loads in industrial environments
- Ceramic DIP-16 package provides hermetic protection for reliable operation in military and high-reliability applications
Applications
CD4049UBF is widely used as a CMOS-to-TTL interface buffer in mixed-logic systems, signal inversion chains, and level-shifting circuits between 5 V CMOS and TTL devices. Its six independent inverters make it practical for industrial control panels, legacy instrument interfaces, and embedded systems where multiple CMOS signal paths must drive TTL inputs simultaneously.
Specifications
| Pbfree Code | Yes |
| YTEOL | 15 |
| Additional Feature | CMOS-TTL LEVEL TRANSLATOR |
| Family | 4000/14000/40000 |
| JESD-30 Code | R-GDIP-T16 |
| JESD-609 Code | e0 |
| Load Capacitance (CL) | 50pF |
| Logic IC Type | INVERTER |
| Max I(ol) | 0.018A |
| Number of Functions | 6 |
| Number of Inputs | 1 |
| Package Body Material | CERAMIC, GLASS-SEALED |
| Package Equivalence Code | DIP16,.3 |
| Package Shape | RECTANGULAR |
| Package Style | IN-LINE |
| Packing Method | TUBE |
| Power Supply Current-Max (ICC) | 0.6mA |
| Prop. Delay@Nom-Sup | 120ns |
| Propagation Delay (tpd) | 120ns |
| Qualification Status | Not Qualified |
| Schmitt Trigger | NO |
| Supply Voltage-Max (Vsup) | 18V |
| Supply Voltage-Min (Vsup) | 3V |
| Supply Voltage-Nom (Vsup) | 10V |
| Surface Mount | NO |
| Technology | CMOS |
| Temperature Grade | MILITARY |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Terminal Form | THROUGH-HOLE |
| Terminal Pitch | 2.54mm |
| Terminal Position | DUAL |
| ## CD4049UBF Alternates Showing results | Image |
| Package | Ceramic DIP-16 |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.90 |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for CD4049UBF:
suggested
Frequently Asked Questions
How many inverter channels does CD4049UBF provide and what output current can each channel sink?
CD4049UBF contains 6 independent inverter buffers, each capable of sinking up to 18 mA at the output low state. This 18 mA sink current is sufficient to directly drive standard TTL inputs and small LED indicators, making each channel a versatile single-gate driver in industrial logic circuits.
Can CD4049UBF reliably translate CMOS 5 V signals to TTL-compatible levels without additional components?
Yes. The CD4049UBF is specifically designed as a CMOS-to-TTL level translator. When powered from a 5 V supply, its output low voltage stays well below the 0.8 V TTL threshold and output high exceeds the 2 V TTL minimum, enabling direct CMOS-to-TTL interfacing across the 3 V to 18 V CMOS supply range without external resistors or buffers.
What load capacitance spec applies to CD4049UBF and how does it affect switching speed?
Texas Instruments rates CD4049UBF for a load capacitance of 50 pF. At this capacitance the propagation delay is typically in the range of 60 ns to 200 ns depending on supply voltage, so designers should keep PCB trace lengths short and stray capacitance below 50 pF to maintain switching speed in high-frequency clock buffering applications.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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