ADDI7004BBBCZRL Analog Devices Integrated Circuit (BGA) In Stock
Analog Devices ADDI7004BBBCZRL is an analog front-end IC in a 76-ball CSP BGA package designed for high-speed signal acquisition and conditioning. Integrates multi-channel analog input processing for consumer and industrial applications. Available from stock with worldwide shipping.
- Manufacturer
- Analog Devices
- Package
- BGA
- Pin Count
- 76
- Lifecycle
- NOT RECOMMENDED
- Datasheet
- ADDI7004BBBCZRL Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -25.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of ADDI7004BBBCZRL?
- 76-ball CSP BGA package providing compact form factor for dense analog front-end PCB integration
- Multi-channel analog front-end architecture enabling simultaneous signal conditioning across multiple inputs
- Designed for consumer and industrial signal acquisition with integrated analog processing functions
- Single-function AFE device simplifying system design by consolidating analog input chain into one IC
What is ADDI7004BBBCZRL used for?
The ADDI7004BBBCZRL analog front-end IC is suited for applications requiring compact multi-channel analog signal conditioning, such as medical imaging sensors, ultrasound front-end modules, and industrial data acquisition systems. Its 76-ball BGA package supports high-density PCB layouts where multiple analog input channels must be processed in a minimal footprint. The device integrates key front-end functions to reduce the external component count in precision signal chain designs.
What are the specifications of ADDI7004BBBCZRL?
| Source Url Status Check Date | 2013-05-01 14:56:35.099 |
| Pbfree Code | No |
| Manufacturer Package Code | BC-76-1 |
| YTEOL | 3 |
| Consumer IC Type | CONSUMER CIRCUIT |
| JESD-30 Code | S-PBGA-B76 |
| Number of Functions | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY |
| Peak Reflow Temperature (Cel) | 260 |
| Surface Mount | YES |
| Terminal Form | BALL |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.01 |
| Country of Origin | Singapore |
Where can I find the ADDI7004BBBCZRL datasheet?
ADDI7004BBBCZRL Datasheet DownloadOfficial datasheet from Analog Devices
What are equivalent replacements for ADDI7004BBBCZRL?
Compatible alternatives and drop-in replacements for ADDI7004BBBCZRL:
suggested
suggested
Frequently Asked Questions
How does the 76-ball CSP BGA package of ADDI7004BBBCZRL benefit high-density analog front-end PCB designs?
The 76-ball CSP BGA (S-PBGA-B76) package of ADDI7004BBBCZRL offers a square grid array footprint that is significantly smaller than equivalent SOIC or SSOP analog front-end ICs. This compact arrangement allows multi-channel AFE integration within a few square centimeters, enabling dense sensor interface boards in medical imaging and industrial measurement systems.
Which signal acquisition applications benefit from integrating ADDI7004BBBCZRL's analog front-end functions on-chip?
Applications such as ultrasound imaging receivers, industrial sensor signal conditioners, and consumer data acquisition systems benefit from ADDI7004BBBCZRL integrating multiple analog front-end stages in a single IC. Consolidating amplification, filtering, and signal conditioning into one device reduces BOM complexity and board area compared to discrete front-end implementations with separate op-amps and filters.
What package style does ADDI7004BBBCZRL use and how does it affect soldering and PCB layout requirements?
ADDI7004BBBCZRL uses the S-PBGA-B76 plastic ball grid array package with 76 solder balls arranged in a square grid pattern. BGA assembly requires reflow soldering with careful stencil design to ensure uniform ball collapse. The compact pitch demands PCB layer stack-up with via fanout beneath the package, typically requiring 4-layer or more boards for proper signal and power routing.
When should engineers consider ADDI7004BBBCZRL over discrete analog front-end circuits for sensor interfaces?
ADDI7004BBBCZRL is preferred when board space is constrained and multiple analog input channels must be conditioned simultaneously, as a single 76-ball BGA integrates functions that would otherwise require 3 to 5 discrete ICs. This integration reduces assembly risk, simplifies signal routing between stages, and can lower system power consumption compared to multiple standalone op-amps and ADC driver chains.
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Why Buy from FindMyChip
About Analog Devices
Analog Devices (ADI) is a global leader in high-performance analog, mixed-signal, and digital signal processing integrated circuits used in virtually all types of electronic equipment.
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