9LP525BG-2LF IDT Integrated Circuit (Small Outline Packages) In Stock
IDT 9LP525BG-2LF is a low-power clock distribution IC in a 56-pin TSSOP package supporting output frequencies up to 400 MHz for high-speed digital systems. Designed for multi-channel clock fanout in servers, networking, and telecom equipment. RoHS-compliant and available worldwide with fast shipping from authorized distributors.
- Manufacturer
- IDT
- Package
- Small Outline Packages
- Pin Count
- 56
- Lifecycle
- OBSOLETE
- Datasheet
- 9LP525BG-2LF Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- ?°C to 70.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of 9LP525BG-2LF?
- Up to 400 MHz maximum output clock frequency for high-speed digital system timing distribution
- 56-pin TSSOP package with 0.5 mm pitch for compact, high-density PCB integration
- Low-power design optimized for multi-output clock fanout in servers and networking equipment
What is 9LP525BG-2LF used for?
The 9LP525BG-2LF is designed for high-density clock fanout in servers, networking switches, and telecommunications equipment where clock signals up to 400 MHz must be distributed to multiple loads simultaneously. Its 56-pin TSSOP package with 0.5 mm pitch enables compact PCB layouts requiring precise multi-channel timing distribution. Low-power operation minimizes thermal load in rack-mounted, power-constrained digital systems.
What are the specifications of 9LP525BG-2LF?
| Pbfree Code | Yes |
| Manufacturer Package Code | PAG56 |
| YTEOL | 0 |
| JESD-30 Code | R-PDSO-G56 |
| JESD-609 Code | e3 |
| Output Clock Frequency-Max | 400MHz |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Primary Clock/Crystal Frequency-Nom | 14.318MHz |
| Supply Voltage-Max | 3.465V |
| Supply Voltage-Min | 3.135V |
| Supply Voltage-Nom | 3.3V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | COMMERCIAL |
| Terminal Finish | MATTE TIN |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.5mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| uPs/uCs/Peripheral ICs Type | CLOCK GENERATOR, OTHER |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.01 |
Where can I find the 9LP525BG-2LF datasheet?
9LP525BG-2LF Datasheet DownloadOfficial datasheet from IDT
What are equivalent replacements for 9LP525BG-2LF?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What maximum output clock frequency does IDT 9LP525BG-2LF support?
The IDT 9LP525BG-2LF supports a maximum output clock frequency of 400 MHz, making it well suited for high-speed digital systems including server motherboards, FPGAs, ASICs, and networking equipment. This broad frequency range enables flexible system timing architectures spanning multiple clock domains at high data transfer rates.
What package does 9LP525BG-2LF use and how does it fit on a PCB?
The 9LP525BG-2LF is housed in a 56-pin TSSOP package measuring 6.1 mm wide with 0.5 mm pin pitch. This thin small-outline profile is well suited for high-density PCB layouts in server blades, networking line cards, and telecom boards where board space is limited and up to 400 MHz clock distribution is required.
What peak reflow soldering temperature is 9LP525BG-2LF rated for?
The 9LP525BG-2LF is rated for a peak reflow temperature of 260°C, classified as JEDEC J-STD-020 compliant for lead-free SMT assembly. In its 56-pin TSSOP form with 0.5 mm pitch, it is compatible with automated pick-and-place and standard reflow ovens used in high-volume production of server and networking PCBs.
Which high-speed digital applications are best served by 9LP525BG-2LF?
9LP525BG-2LF is best suited for server motherboards, networking switches, and telecom line cards that require distributing clock signals at up to 400 MHz across multiple digital ICs or subsystems. Its 56-pin TSSOP compact footprint and low-power design reduce overall system thermal budget while delivering precise, low-jitter clock fanout for demanding high-frequency digital architectures.
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