89HPES6T6G2ZCALG IDT Integrated Circuit (BGA) In Stock

IDT 89HPES6T6G2ZCALG is a high-speed BGA integrated circuit for board-level bus interconnect designs. Key specs include SMBus support, 100 MHz clocking, and 625 MBps transfer. Offered for stock-driven worldwide sourcing.

OBSOLETEIntegrated CircuitVerified Jul 2026
Package / Visual Reference
89HPES6T6G2ZCALGBGA
Quick Facts
Manufacturer
IDT
Package
BGA
Pin Count
324
Lifecycle
OBSOLETE
Category
Integrated Circuit
Temp Range
?°C to 70.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • SMBus-compatible management interface for board control
  • 100 MHz maximum clock frequency from fetched specifications
  • 625 MBps maximum data transfer rate for high-speed interconnect paths
  • ALG324 / BGA-324 plastic epoxy package for dense PCB layouts
  • Pb-free code and JESD-609 e1 material classification

Applications

89HPES6T6G2ZCALG fits communications, embedded computing, and storage boards that need a managed high-speed interconnect IC in a dense BGA package. It is suited to designs where SMBus control, 100 MHz clock capability, and 625 MBps transfer capability must be planned into the system architecture.

Specifications

Pbfree CodeYes
Manufacturer Package CodeALG324
YTEOL0
Bus CompatibilitySMBUS
Clock Frequency-Max100MHz
Data Transfer Rate-Max625MBps
JESD-30 CodeS-PBGA-B324
JESD-609 Codee1
Package Body MaterialPLASTIC/EPOXY
Package Equivalence CodeBGA324,18X18,40
Package ShapeSQUARE
Package StyleGRID ARRAY
Peak Reflow Temperature (Cel)260
Qualification StatusNot Qualified
Supply Current-Max1127mA
Supply Voltage-Max1.1V
Supply Voltage-Min0.9V
Supply Voltage-Nom1V
Surface MountYES
TechnologyCMOS
Temperature GradeCOMMERCIAL
Terminal FinishTIN SILVER COPPER
Terminal FormBALL
Terminal Pitch1mm
Terminal PositionBOTTOM
Time@Peak Reflow Temperature-Max (s)30
uPs/uCs/Peripheral ICs TypeBUS CONTROLLER, PCI
PackageBGA

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
Moisture Sensitivity LevelMSL 4
ECCN3A991.a.2
HTS Code8542.39.00.01

Datasheet

89HPES6T6G2ZCALG Datasheet Download

Official datasheet from IDT

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

How do the bus and speed limits affect 89HPES6T6G2ZCALG designs?

The fetched specifications show SMBus compatibility, a 100 MHz maximum clock, and a 625 MBps maximum transfer rate, so designers should align host management and throughput budgets around those limits.

For layout review, what should be checked around the ALG324 BGA footprint?

Use the ALG324 package code and BGA-324 footprint expectation to confirm pad mapping, solder-mask rules, and assembly inspection coverage for all 324 pins before releasing the PCB.

When does this IDT device fit procurement for communications boards?

It suits high-speed board interconnect programs that need a plastic/epoxy BGA device with Pb-free coding, 100 MHz clock capability, and distributor traceability for repeat production.

Related Guides

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About IDT

IDT is a leading electronic component manufacturer. FindMyChip sources IDT ICs directly from authorized China distributors, offering competitive pricing and reliable stock.

AvailabilityIn Stock
Reference Price (USD)
Contact for Price
Buy from 1pc · Factory-direct pricing
pcs

In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

The anti-counterfeit verification gave us confidence we'd never had with other China suppliers.

RP
Rajesh Patel
Procurement Manager, VoltEdge Energy, India