89HPES6T6G2ZCALG IDT Integrated Circuit (BGA) In Stock
IDT 89HPES6T6G2ZCALG is a high-speed BGA integrated circuit for board-level bus interconnect designs. Key specs include SMBus support, 100 MHz clocking, and 625 MBps transfer. Offered for stock-driven worldwide sourcing.
- Manufacturer
- IDT
- Package
- BGA
- Pin Count
- 324
- Lifecycle
- OBSOLETE
- Datasheet
- 89HPES6T6G2ZCALG Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- ?°C to 70.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of 89HPES6T6G2ZCALG?
- SMBus-compatible management interface for board control
- 100 MHz maximum clock frequency from fetched specifications
- 625 MBps maximum data transfer rate for high-speed interconnect paths
- ALG324 / BGA-324 plastic epoxy package for dense PCB layouts
- Pb-free code and JESD-609 e1 material classification
What is 89HPES6T6G2ZCALG used for?
89HPES6T6G2ZCALG fits communications, embedded computing, and storage boards that need a managed high-speed interconnect IC in a dense BGA package. It is suited to designs where SMBus control, 100 MHz clock capability, and 625 MBps transfer capability must be planned into the system architecture.
What are the specifications of 89HPES6T6G2ZCALG?
| Pbfree Code | Yes |
| Manufacturer Package Code | ALG324 |
| YTEOL | 0 |
| Bus Compatibility | SMBUS |
| Clock Frequency-Max | 100MHz |
| Data Transfer Rate-Max | 625MBps |
| JESD-30 Code | S-PBGA-B324 |
| JESD-609 Code | e1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA324,18X18,40 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Supply Current-Max | 1127mA |
| Supply Voltage-Max | 1.1V |
| Supply Voltage-Min | 0.9V |
| Supply Voltage-Nom | 1V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | COMMERCIAL |
| Terminal Finish | TIN SILVER COPPER |
| Terminal Form | BALL |
| Terminal Pitch | 1mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| uPs/uCs/Peripheral ICs Type | BUS CONTROLLER, PCI |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 4 |
| ECCN | 3A991.a.2 |
| HTS Code | 8542.39.00.01 |
Where can I find the 89HPES6T6G2ZCALG datasheet?
89HPES6T6G2ZCALG Datasheet DownloadOfficial datasheet from IDT
What are equivalent replacements for 89HPES6T6G2ZCALG?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How do the bus and speed limits affect 89HPES6T6G2ZCALG designs?
The fetched specifications show SMBus compatibility, a 100 MHz maximum clock, and a 625 MBps maximum transfer rate, so designers should align host management and throughput budgets around those limits.
For layout review, what should be checked around the ALG324 BGA footprint?
Use the ALG324 package code and BGA-324 footprint expectation to confirm pad mapping, solder-mask rules, and assembly inspection coverage for all 324 pins before releasing the PCB.
When does this IDT device fit procurement for communications boards?
It suits high-speed board interconnect programs that need a plastic/epoxy BGA device with Pb-free coding, 100 MHz clock capability, and distributor traceability for repeat production.
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About IDT
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