74HC112DB,112 Nexperia Integrated Circuit (Small Outline Packages) In Stock
74HC112DB,112 from Nexperia is a integrated circuit for industrial controls, embedded electronics, maintenance sourcing, and production assemblies. Key specifications include 1Ma, 50pF, 20000000Hz, 0.0052A, SSOP1 package/footprint, supporting reliable selection for OEM maintenance, prototyping, and production BOMs. The SSOP1 format supports standard assembly and sourcing workflows.
- Manufacturer
- Nexperia
- Package
- Small Outline Packages
- Pin Count
- 16
- Lifecycle
- OBSOLETE
- Datasheet
- 74HC112DB,112 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 1Ma rating/value supports defined circuit selection for this integrated circuit
- 50pF specification provides an additional quantitative design check
- SSOP1 package or footprint supports standard PCB assembly and replacement planning
- 16-pin configuration helps confirm footprint, routing, and connector compatibility
- -40°C to 125°C operating range suits controlled industrial or commercial environments
- Nexperia sourcing identity supports BOM traceability and authorized-equivalent review
Applications
74HC112DB,112 is commonly considered for industrial controls, embedded electronics, maintenance sourcing, and production assemblies where designers need a integrated circuit with 1Ma, 50pF, 20000000Hz, 0.0052A, SSOP1 package/footprint. It is suitable for OEM BOM refresh, maintenance sourcing, prototype builds, and production assemblies that require traceable component selection.
Specifications
| Manufacturer Package Code | SOT338-1 |
| Date Of Intro | 1995-11-01 |
| YTEOL | 0 |
| Family | HC/UH |
| JESD-30 Code | R-PDSO-G16 |
| JESD-609 Code | e4 |
| Load Capacitance (CL) | 50pF |
| Logic IC Type | J-K FLIP-FLOP |
| Max Frequency@Nom-Sup | 20000000Hz |
| Max I(ol) | 0.0052A |
| Number of Bits | 2 |
| Number of Functions | 2 |
| Output Polarity | COMPLEMENTARY |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | SSOP16,.3 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, SHRINK PITCH |
| Packing Method | TUBE |
| Peak Reflow Temperature (Cel) | 260 |
| Power Supply Current-Max (ICC) | 0.00008mA |
| Prop. Delay@Nom-Sup | 53ns |
| Propagation Delay (tpd) | 265ns |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 6V |
| Supply Voltage-Min (Vsup) | 2V |
| Supply Voltage-Nom (Vsup) | 5V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | AUTOMOTIVE |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.65mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Trigger Type | NEGATIVE EDGE |
| fmax-Min | 24MHz |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| HTS Code | 8542.39.00.60 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
Which designs are a good fit for 74HC112DB,112 when 1Ma is required?
74HC112DB,112 is a integrated circuit from Nexperia for industrial controls, embedded electronics, maintenance sourcing, and production assemblies. The 1Ma specification helps engineers confirm electrical margin before adding it to a production BOM.
How should engineers check the footprint before placing 74HC112DB,112 on a PCB?
Review the SSOP1 package information together with 16 pins before layout release. That check reduces substitution risk when matching land pattern, assembly process, and approved vendor data.
When would procurement choose 74HC112DB,112 instead of a nearby alternate?
Buyers should keep 74HC112DB,112 when the approved design depends on 50pF and SSOP1 compatibility. Alternate reviews should verify at least 1 matching electrical rating and footprint constraint.
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