74FST6800QG8 IDT Integrated Circuit (Small Outline Packages) In Stock
The 74FST6800 Bus switch performs the function of connecting or isolating two ports without providing any inherent current sink or source capability. This device connecs input and output ports through an n-channel FET and has hot insertion capability. The low on-resistance and simplicity of the connection between input and output ports reduces the delay in this path to close to zero. The FST6800 provides a 10-Bit TTL-compatible interface. The 74FST6800 operates at -40C to +85C
- Manufacturer
- IDT
- Package
- Small Outline Packages
- Pin Count
- 24
- Lifecycle
- OBSOLETE
- Datasheet
- 74FST6800QG8 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 24 pins integrated circuit from IDT
- Small Outline Packages format supports production PCB assembly and sourcing review
- obsolete lifecycle status for bill-of-material risk screening
- Datasheet-backed context for 74FST6800QG8 technical and procurement validation
Applications
74FST6800QG8 is used in embedded control, signal processing, timing, memory, and mixed-signal board designs where the 24 pins requirement must align with the approved design. It suits OEM sourcing, maintenance, and production builds that need manufacturer-traceable component data before purchase.
Specifications
| Pbfree Code | Yes |
| Manufacturer Package Code | PCG24 |
| YTEOL | 0 |
| Additional Feature | TTL COMPATIBLE BUS SWITCH |
| Control Type | ENABLE LOW |
| Count Direction | UNIDIRECTIONAL |
| Family | CBT/FST/QS/5C/B |
| JESD-30 Code | R-PDSO-G24 |
| JESD-609 Code | e3 |
| Load Capacitance (CL) | 50pF |
| Logic IC Type | BUS DRIVER |
| Number of Bits | 10 |
| Number of Functions | 1 |
| Number of Ports | 2 |
| Output Characteristics | 3-STATE |
| Output Polarity | TRUE |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, SHRINK PITCH |
| Packing Method | TR, 13 INCH |
| Peak Reflow Temperature (Cel) | 260 |
| Prop. Delay@Nom-Sup | 0.25ns |
| Propagation Delay (tpd) | 0.25ns |
| Qualification Status | Not Qualified |
| Screening Level | MIL-STD-883 |
| Supply Voltage-Max (Vsup) | 5.25V |
| Supply Voltage-Min (Vsup) | 4.75V |
| Supply Voltage-Nom (Vsup) | 5V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | MATTE TIN |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.635mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| HTS Code | 8542.39.00.01 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
Which designs are a good fit for 74FST6800QG8?
74FST6800QG8 fits embedded control where engineers need 24 pins and integrated circuit behavior from IDT. Review the datasheet and approved footprint before release.
How should engineers check key specifications before release?
Engineers should confirm 0 A, package compatibility, lifecycle status, and board constraints for 74FST6800QG8. These checks reduce layout, compliance, and purchasing risk before production.
What sourcing checks matter for 74FST6800QG8 orders?
Procurement teams should verify current stock, lead time, traceability, and alternates while keeping the 50 pF requirement aligned with the approved bill of materials.
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