71V124SA10PHG8 IDT Integrated Circuit (Small Outline Packages) In Stock
The 71V124 3.3V CMOS SRAM is organized as 128K x 8. The JEDEC center power/GND pinout reduces noise generation and improves system performance. All bidirectional inputs and outputs of the 71V124 are LVTTL-compatible and operation is from a single 3.3V supply. Fully static asynchronous circuitry is used; no clocks or refreshes are required for operation.
- Manufacturer
- IDT
- Package
- Small Outline Packages
- Pin Count
- 32
- Lifecycle
- OBSOLETE
- Datasheet
- 71V124SA10PHG8 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- ?°C to 70.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of 71V124SA10PHG8?
- Integrated Circuit from IDT for production electronic assemblies
- Small Outline Packages package with 32 pins for PCB footprint planning
- Datasheet context includes 71V for engineering cross-checks
- Manufacturer or distributor datasheet URL available for technical verification
- Suitable for embedded systems, industrial electronics, communication equipment applications
What is 71V124SA10PHG8 used for?
71V124SA10PHG8 is commonly used in embedded systems, industrial electronics, communication equipment, test fixtures, and production BOM sourcing where designers need dependable integrated circuit behavior and manufacturer-traceable sourcing. It is appropriate for production BOM builds, repair demand, and alternate qualification workflows that compare package fit, lifecycle status, and parameters such as 32 pins.
What are the specifications of 71V124SA10PHG8?
| Pbfree Code | Yes |
| Manufacturer Package Code | PHG32 |
| YTEOL | 0 |
| Access Time-Max | 10ns |
| I/O Type | COMMON |
| JESD-30 Code | R-PDSO-G32 |
| JESD-609 Code | e3 |
| Memory Density | 1048576bit |
| Memory IC Type | STANDARD SRAM |
| Memory Width | 8 |
| Number of Functions | 1 |
| Number of Words | 131072words |
| Number of Words Code | 128000 |
| Operating Mode | ASYNCHRONOUS |
| Organization | 128KX8 |
| Output Characteristics | 3-STATE |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | TSOP32,.46 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, THIN PROFILE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Standby Current-Max | 0.01A |
| Standby Voltage-Min | 3.15V |
| Supply Current-Max | 0.145mA |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 3.15V |
| Supply Voltage-Nom (Vsup) | 3.3V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | COMMERCIAL |
| Terminal Finish | MATTE TIN |
| Terminal Form | GULL WING |
| Terminal Pitch | 1.27mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | 3A991.b.2.b |
| HTS Code | 8542.32.00.41 |
Where can I find the 71V124SA10PHG8 datasheet?
71V124SA10PHG8 Datasheet DownloadOfficial datasheet from IDT
What are equivalent replacements for 71V124SA10PHG8?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
Which design use cases are a practical fit for 71V124SA10PHG8?
71V124SA10PHG8 is a Integrated Circuit from IDT suited to embedded systems, industrial electronics, communication equipment, test fixtures, and production BOM sourcing. The 32 pins detail helps engineers confirm schematic fit, interface allocation, and sourcing suitability before BOM approval.
How should engineers check package compatibility for 71V124SA10PHG8 during layout review?
Use the Small Outline Packages package information together with 32 pins when comparing footprints, assembly drawings, and mating or socket constraints. This reduces layout risk before prototype or production purchasing.
What should procurement keep aligned when cross-referencing 71V124SA10PHG8 against alternates?
Cross-reference checks should preserve the manufacturer, Integrated Circuit function, package style, lifecycle status, and at least one key parameter such as 71V. Matching these details lowers substitution risk across 1 approved BOM.
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