53647-1674-TR185 Molex Connector (Other) In Stock
Molex 53647-1674-TR185 is a high-density 160-position, 2-row surface-mount PCB header with 0.635 mm pitch, designed for compact board-to-board and FPC/FFC interface applications. Its fine-pitch dual-row configuration delivers 160 signal contacts in a space-efficient SMT footprint suitable for high-speed data and control systems.
- Manufacturer
- Molex
- Package
- Other
- Pin Count
- 162
- Lifecycle
- ACTIVE
- Datasheet
- 53647-1674-TR185 Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 160 positions in a dual-row layout at 0.635 mm pitch, achieving very high contact density for compact PCB designs
- Surface-mount technology (SMT) assembly for streamlined automated PCB manufacturing and consistent solder joint quality
- Fine 0.635 mm pitch spacing enables high signal count interconnects in space-critical computing and communications hardware
Applications
The 53647-1674-TR185 is suited for high-density board-to-board interconnects in servers, networking switches, and industrial computing modules where 160 signals must be routed across a compact interface. Its 0.635 mm pitch supports high-speed differential pairs and parallel data buses common in FPGA and ASIC daughtercard designs. The SMT profile enables integration in slim form-factor designs with automated reflow assembly.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signal contacts does the 53647-1674-TR185 provide and at what pitch?
The 53647-1674-TR185 provides 160 signal contacts arranged in 2 rows at a 0.635 mm pitch. This fine-pitch dual-row layout delivers a very high contact density, making it suitable for high-bandwidth interconnects in servers, FPGAs, and high-speed data acquisition boards.
What board assembly method is required for the Molex 53647-1674-TR185 and how does it affect production?
The 53647-1674-TR185 uses surface-mount technology (SMT) assembly, compatible with standard reflow soldering at 0.635 mm pitch. SMT placement enables high-volume automated assembly on modern pick-and-place lines, and the dual-row footprint minimizes board area while maintaining 160 contacts.
When should a designer choose the 53647-1674-TR185 over a lower-density 80-position connector?
The 53647-1674-TR185 is preferable when the interface requires more than 80 signals or when routing constraints require consolidating two 80-position connectors into a single 160-position, 0.635 mm pitch component. This reduces the PCB area occupied by connectors by up to 50% while maintaining signal integrity for parallel buses operating at high data rates.
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