Integrated Circuit

Maximum Input Clock Frequency > 4 GHz Typical; 330 ps Typical Propagation Delay; 145 ps Typical Rise and Fall Times; Differential LVPECL Outputs, 750 mV PeaktoPeak, Typical; Operating Range: VCC = 2.375 V to 5.5 V with VEE = 0 V

ON SEMICONDUCTOR - NB3N551DR2G - Fanout Buffer, 180 MHz, 3 V to 5.5 V, 4 Outputs, SOIC-8

12 Differential Clock Output Pairs @ 0.7 V; Low−Power NMOS Push−Pull Compatible Outputs for NB3W1200L; Optimized 100 MHz and 133 MHz Operating Frequencies to Meet The Next Generation PCIe Gen 2/Gen 3/ Gen 4 and Intel QPI & UPI Phase Jitter; DB1200ZL Compliant; 3.3 V ±5% Supply Voltage Operation; Fixed−Feedback for Lowest Input−To−Output Delay Variation; SMBus Programmable Configurations to Allow Multiple Buffers in a Single Control Network; PLL Bypass Configurable for PLL or Fanout Operation; Programmable P

Maximum Input Clock Frequency > 3.5 GHz Typical; Maximum Input Data Frequency > 5 Gb/s Typical; 220 ps Typical Propagation Delay ; 65 ps Typical Rise and Fall Times ; CML Output with Operating Range: VCC = 2.375 V to 3.8 V with VEE = 0 V; CML Output Level (400 mV Peak-to-Peak Output), Differential Output Only; 50 Ω Internal Input and Output Termination Resistors; Functionally Compatible with Existing 2.5 V / 3.3 V LVEL, LVEP, EP, and SG Devices; Pb-Free Packages are Available

HCSL Differential Output; Typical Period RMS jitter of 1.5 ps; Uses 25 MHz Fundamental Mode Parallel Resonant Crystal; Industrial Temperature Range -40C to +85C; Operating Range 3.3 V +/- 10%; PCIe Gen1, Gen2, Gen3, Gen4, QPI, UPI Jitter Compliant

SOIC-8

TSSOP-24

Typical TIE RMS jitter of 2.5 ps; Uses 25 MHz Fundamental Mode Parallel Resonant Crystal; HCSL Differential Output; Operating Range 3.3 V 5%; Industrial Temperature Range -40C to +85C; PCIe Clock Generation Gen 1, Gen 2, Gen 3, Gen 4

6 LVTTL/LVCMOS Output Clock copies; Supply Operation VDD VDDO: 1.8 V0.2 V, 2.5 V 5% or 3.3 V 5% Core VDD 1.8 V equal or greater than VDD0: 1.8 V, 2.5 V, 3.3 V Nom. ; Crystal Oscillator Interface; Crystal Input Frequency Range: 3 MHz to 40 MHz; Clock Input Frequency Range: 3 MHz to 100 MHz; LVCMOS compatible Enable Inputs; 5 V Tolerant Enable Inputs; Tight Output to Output Skew: 80 ps Max; Synchronous Output Enable; Phase Noise Floor 160 dBc (at 1 MHz); Industrial Temp. Rang; 16 Pin TSSOP or SOIC Package; Pb

TSSOP-16

NB3N108KMNR4G, Clock Multiplexer HCSL HCSL, 32-Pin QFN

ON Semiconductor NB3N1200KMNG Differential Buffer, 64-Pin QFN

Period Jitter RMS of 5.0 ps; 1 LV-PECL Differential Output and 1 LVMOS/LVTTL single ended output; Selectable Clock Multiplier; Operating Range - 3.3V +/- 10%; Industrial Temperature Range -40C to +85C

Uses 25 MHz Fundamental Mode Parallel Resonant Crystal; Power Down Mode; 4 Low Skew HCSL or LVDS Outputs; OE Tri-States Outputs; Spread of -0.5%, -1.0%, -1.5% and No Spread; PCIe Gen 1, Gen 2, Gen 3 and Gen 4 Jitter Compliant; Low Phase Noise; Operating Range 3.3 V ±5%; Industrial Temperature Rangeˆ-40°C to +85°C; Functionally Compatible with IDT557-05, IDT5V41066, IDT5V41236; These are Pb-Free Devices

0.150 INCH, LEAD FREE, SOIC-8

Zero Delay PLL Clock Driver Single 100MHz to 133MHz 64-Pin QFN EP T/R

Typical Input Clock Frequency 100, 133, 166, or 400 MHz; 220 ps Typical Rise and Fall Times; 800 ps Typical Propagation Delay; Delta tpd 100 ps Maximum Propagation Delay Variation per Diff Pair; 0.1 ps Typical RMS Phase Jitter; Operating Range: VCC = 3.0 V to 3.6 V with GND = 0 V; Differential HCSL Output Levels

TSSOP-16

SOIC-16

Typical Maximum Frequency >2 GHz; 430 ps Typical Propagation Delay; Operating Range: VCC = 2.375 V to 3.8 V; VEE = -2.375 V to -3.8 V; GNDI = 0 V; Q Output will default LOW with Inputs Open or at GND; Pb-Free Packages are Available

ON Semiconductor NB2305AI1HDTG PLL Clock Buffer 8-Pin TSSOP

Five LVCMOS / LVTTL Outputs up to 200 MHz; Differential Inputs Accept LVPECL, LVDS, HCSL, SSTL, or LVCMOS/LVTTL; Crystal Interface; Crystal Input Frequency Range: 10 MHz to 50 MHz; Output Skew: 10 ps Typical; Additive RMS Phase Jitter @ 156.25 MHz, (12 kHz – 20 MHz): 0.03 ps (Typical); Synchronous Output Enable; Output Defined Level When Input is Floating; Multiple Power Supply Modes Available (See Datasheet); Two Separate Output Bank Power Supplies; Industrial Temperature Range: −40°C to 85°C

2.7 to 3.6 V power supply range ; Very low standby current - typical Isb as low as 1 uA; Very low operating current - as low as 3 mA; Simple memory control: single chip select (CS), serial input (SI) and serial output (SO); Flexible operating modes: word read and write, page mode (32 word page), and burst mode (full array); 32 K x 8 bit organization ; Self timed write cycles; Built-in write protection (CS high); HOLD pin for pausing communication

2.7 to 3.6 V power supply range ; Very low standby current - typical Isb as low as 1 uA; Very low operating current - as low as 3 mA; Simple memory control: single chip select (CS), serial input (SI) and serial output (SO); Flexible operating modes: word read and write, page mode (32 word page), and burst mode (full array); 32 K x 8 bit organization ; Self timed write cycles; Built-in write protection (CS high); HOLD pin for pausing communication

2.7 to 3.6 V power supply range; Very low standby current - as low as 1 uA; Very low operating current - as low as 3 mA; Flexible operating modes: word read and write, page mode (32 word page), and burst mode (full array); 8 K x 8 bit organization ; Simple memory control: single chip select (CS), serial input (SI) and serial output (SO); Self timed write cycles; Built-in write protection (CS high); HOLD pin for pausing communication; High reliability - unlimited write cycles; RoHS Compliant Packages - Green

Low Leakage Specified @ 150 C Case Temperature; 175 C Operating Junction Temperature; High Voltage Capability to 600 Volts; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Current Derating Specified @ Both Case and Ambient Temperatures; Ultrafast 35 and 60 Nanosecond Recovery Time; Weight: 4.3 grams (approximately); Low Forward Drop; Case: Epoxy, Molded; Epoxy Meets UL94, VO @ 1/8"; High Temperature Glass Passivated Junction Mechanical Characteristics:; Lead Temp

Low Leakage Specified @ 150 C Case Temperature; 175 C Operating Junction Temperature; High Voltage Capability to 600 Volts; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Current Derating Specified @ Both Case and Ambient Temperatures; Ultrafast 35 and 60 Nanosecond Recovery Time; Weight: 4.3 grams (approximately); Low Forward Drop; Case: Epoxy, Molded; Epoxy Meets UL94, VO @ 1/8"; High Temperature Glass Passivated Junction Mechanical Characteristics:; Lead Temp

175 C Operating Junction Temperature; High Temperature Glass Passivated Junction; High Voltage Capability to 600 Volts; Lead Temperature for Soldering Purposes: 260 C Max. for 10 Seconds; Current Derating @ Both Case and Ambient Temperatures Mechanical Characteristics:; Ultrafast 35 and 60 Nanosecond Recovery Times; Marking: U1610, U1615, U1620, U1640, U1660; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Weight: 1.9 grams (approximately); Case: Epoxy, Molded; L

175 C Operating Junction Temperature; High Temperature Glass Passivated Junction; Shipped 50 units per plastic tube; High Voltage Capability to 600 Volts; Lead Temperature for Soldering Purposes: 260 C Max. for 10 Seconds; Current Derating @ Both Case and Ambient Temperatures Mechanical Characteristics:; Ultrafast 35 and 60 Nanosecond Recovery Times; Marking: U1610, U1615, U1620, U1640, U1660; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Weight: 1.9 grams (app

Simplifies Circuit Design; Reduces Board Space; Reduces Component Count; S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant

Small Package Size for High Density Applications; FINISH:Corrosion Resistant Finish, Easily Solderable; Package Designed for Optimal Automated Board Assembly; Available in 8 mm Tape and Reel Use the Device Number to order the 7 inch/3,000 unit reel. Replace with "T3" in the Device Number to order the 13 inch/10,000 unit reel.; Low Leakage < 2.0 mA; SC-59 Package Allows Four Separate Unidirectional Configurations; CASE:Void Free, Transfer-Molded, Thermosetting Plastic Case; Peak Power - Min. 24 W @ 1.0 ms (U

SOP-8

Extremely High RBSOA Capability; Inverters; 100 C Performance Specified for: Reverse-Biased SOA with Inductive Load Switching Times with Inductive Loads Saturation Voltages Leakage Currents; Relay Drivers 120 ns Inductive Crossover Time 100 C (T; Motor Controls 800 ns Inductive Storage Time 100 C (T; Extended FBSOA Rating Using Ultra-fast Rectifiers; Switching Regulators Collector-Emitter Voltage VCEV = 1000 Vdc; Solenoids 80 ns Inductive Fall Time 100 C (Typ); Fast Turn-Off Times; Deflection Circuits; Pb-F

Lead Formed Version in 16 mm Tape and Reel ("T4" Suffix); High DC Current Gain hFE = 2500 (Typ) @ IC = 2.0 Adc; Monolithic Construction With Built-in Base-Emitter Shunt Resistors; Lead Formed for Surface Mount Applications in Plastic Sleeves (No Suffix); Straight Lead Version in Plastic Sleeves ("1" Suffix); Surface Mount Replacements for TIP110-TIP117 Series; Complementary Pairs Simplifies Designs; NJV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q

SCR; TO-220AB; 6 V (TYP.); 300A ITSM; 16A ON-STATE (AVG. MAX.); 25A; 1.5; +125

THYRISTOR, SCR 12A 50V TO220AB

SCR; TO-220AB; 2V; 100A ITSM; 8A; 22; 30 UA (TYP.) GATE TRIGGER; +110; -40; 60

SOT-23, 3 PIN

LDO Regulator, 500 mA, 5 V, Negative 4%; TJ = -40°C to +125°C

THYRISTOR, SCR 12A 50V TO-220

No External Components Required; Internal Thermal Overload Protection; Internal Short Circuit Current Limiting; Output Transistor Safe-Area Compensation; Available in 2% Voltage Tolerance (See Ordering Information); Pb-Free Package May be Available. The G-Suffix Denotes a Pb-Free Lead Finish.

No External Components Required; Internal Thermal Overload Protection; Internal Short Circuit Current Limiting; Output Transistor Safe-Area Compensation; Also Available in Surface Mount DPAK (DT) Package DEVICE TYPE/NOMINAL OUTPUT VOLTAGE MC79M05 -5.0 V MC79M12 -12 V MC79M08 -8.0 V MC79M15 -15 V; Pb-Free Package May be Available. The G-Suffix Denotes a

No External Components Required; Internal Thermal Overload Protection; Internal Short Circuit Current Limiting; Output Transistor Safe-Area Compensation; Also Available in Surface Mount DPAK (DT) Package DEVICE TYPE/NOMINAL OUTPUT VOLTAGE MC79M05 -5.0 V MC79M12 -12 V MC79M08 -8.0 V MC79M15 -15 V; Pb-Free Package May be Available. The G-Suffix Denotes a

Fixed LDO Voltage Regulator, 7905, -35V to -10V, 1.1V Dropout, -5Vout, 500mAout, TO-220-3

ON Semiconductor MC79M15BDTG is a fixed -15 V negative linear voltage regulator delivering up to 500 mA output current with a 1.1 V dropout voltage, rated from -40°C to +125°C. It accepts input voltages from 17.5 V to 30 V and is housed in a DPAK SMT package for compact board-level power regulation.