TE Connectivity

TE Connectivity VAL-U-LOK Series, 4.2mm Pitch 6 Way 2 Row Straight PCB Header, Solder, Through Hole Termination, 9A

Configuration Features: Contacts Preloaded Yes | Number of Signal Positions 4 | PCB Mount Orientation Vertical | Number of Rows 2 | Number of Positions 4 | Contact Features: Contact Type Pin | Contact Current Rating (Max) 9 AMP | Contact Retention Within Housing With | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Layout Matrix | Dimensions: PCB Thickness (Recommended) .07 INCH | Wire Size 26 – 18 AWG | Connector Height .555 INCH | Compatible Insula

TE Connectivity VAL-U-LOK Series, 4.2mm Pitch 2 Way 2 Row Straight PCB Header, Solder, Through Hole Termination, 9A

TE Connectivity VAL-U-LOK Series, 4.2mm Pitch 8 Way 2 Row Straight PCB Header, Solder, Through Hole Termination, 9A

TE Connectivity VAL-U-LOK Series, 4.2mm Pitch 6 Way 2 Row Straight PCB Header, Solder, Through Hole Termination, 9A

TE Connectivity VAL-U-LOK Series, 4.2mm Pitch 4 Way 2 Row Straight PCB Header, Solder, Through Hole Termination, 9A

TE Connectivity VAL-U-LOK Series, 4.2mm Pitch 2 Way 2 Row Straight PCB Header, Solder, Through Hole Termination, 9A

TE Connectivity VAL-U-LOK Series, 4.2mm Pitch 8 Way 2 Row Straight PCB Header, Solder, Through Hole Termination, 9A

Configuration Features: Number of Rows 2 | Number of Positions 6 | Number of Signal Positions 0 | PCB Mount Orientation Vertical | Number of Power Positions 6 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Type Pin | Contact Layout Inline | Contact Mating Area Plating Material Tin | Multiple Contact Types With | Contact Mating Area Plating Material Thickness .1 MICM | Contact Mating Area Plating Material Thickness 3.9 MICIN | Contac

Configuration Features: Number of Rows 2 | PCB Mount Orientation Vertical | Number of Signal Positions 0 | Number of Positions 4 | Number of Power Positions 4 | Contact Features: Contact Type Pin | Contact Current Rating (Max) 9 AMP | Contact Mating Area Plating Material Tin | Contact Layout Inline | Contact Mating Area Plating Material Thickness .1 MICM | Multiple Contact Types With | Contact Mating Area Plating Material Thickness 3.9 MICIN | Contact Retention Within Housing Without | PCB Contact Terminati

TE Connectivity VAL-U-LOK Series, 4.2mm Pitch 2 Way 2 Row Straight PCB Header, Solder, Through Hole Termination, 9A

TE Connectivity VAL-U-LOK Series, 4.2mm Pitch 8 Way 2 Row Straight PCB Header, Solder, Through Hole Termination, 9A

Configuration Features: Number of Power Positions 6 | Number of Signal Positions 0 | Number of Positions 6 | Number of Rows 2 | PCB Mount Orientation Vertical | Contact Features: Contact Layout Matrix | Contact Layout Inline | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Type Pin | Contact Mating Area Plating Material Thickness .1 MICM | Contact Current Rating (Max) 9 AMP | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Materi

TE Connectivity VAL-U-LOK Series, 4.2mm Pitch 4 Way 2 Row Straight PCB Header, Solder, Through Hole Termination, 9A

TE Connectivity VAL-U-LOK Series, 4.2mm Pitch 2 Way 2 Row Straight PCB Header, Solder, Through Hole Termination, 9A

Contact Features: Mating Square Post Dimension 1.14 MM | Wire Contact Termination Area Plating Thickness 2.54 MICM | Contact Underplating Material Nickel | Mating Square Post Dimension .045 INCH | Contact Retention Within Housing With | Contact Type Socket | Wire Contact Termination Area Plating Material Tin | Contact Shape & Form Single Beam | Contact Underplating Material Thickness 1.27 MICM | Contact Underplating Material Thickness 50 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Cont

Contact Features: Contact Shape & Form Single Beam | Wire Contact Termination Area Plating Material Tin | Wire Contact Termination Area Plating Thickness 100 MICIN | Mating Square Post Dimension .045 INCH | Contact Underplating Material Thickness 50 MICIN | Contact Underplating Material Thickness 1.27 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | Mating Square Post Dimension 1.14 MM | Contact Orientation Straight | Contact Current Rating (Max) 9 AMP | Wire Contact Termination Area Plating

Contact Features: Wire Contact Termination Area Plating Thickness 2.54 MICM | Contact Underplating Material Nickel | Contact Orientation Straight | Wire Contact Termination Area Plating Material Finish Bright | Contact Underplating Material Thickness 1.27 MICM | Mating Square Post Dimension .045 INCH | Mating Square Post Dimension 1.14 MM | Contact Retention Within Housing With | Wire Contact Termination Area Plating Material Tin | Wire Contact Termination Area Plating Thickness 100 MICIN | Contact Mating A

Contact Features: Contact Type Pin | Contact Retention Within Housing With | Contact Orientation Straight | Mating Square Post Dimension .045 INCH | Contact Fabrication Stamped & Formed | Contact Base Material Phosphor Bronze | Wire Contact Termination Area Plating Material Finish Bright | Contact Current Rating (Max) 9 AMP | Mating Square Post Dimension 1.14 MM | Contact Mating Area Plating Material Tin | Wire Contact Termination Area Plating Material Pre-Tin | Wire Contact Termination Area Plating Thickne

Contact Features: Contact Underplating Material Nickel | Contact Underplating Material Thickness 50 MICIN | Contact Orientation Straight | Contact Type Pin | Contact Retention Within Housing With | Mating Square Post Dimension 1.14 MM | Contact Base Material Brass | Wire Contact Termination Area Plating Material Finish Bright | Mating Square Post Dimension .045 INCH | Wire Contact Termination Area Plating Material Tin | Wire Contact Termination Area Plating Thickness 2.54 MICM | Contact Mating Area Plating

Contact Features: Contact Mating Area Plating Material Tin | Contact Orientation Straight | Contact Type Pin | Mating Square Post Dimension 1.14 MM | Wire Contact Termination Area Plating Material Pre-Tin | Wire Contact Termination Area Plating Material Finish Bright | Contact Fabrication Stamped & Formed | Wire Contact Termination Area Plating Thickness 2.54 MICM | Contact Retention Within Housing With | Mating Square Post Dimension .045 INCH | Wire Contact Termination Area Plating Thickness 100 MICIN | Co

Contact Features: Mating Square Post Dimension .045 INCH | Wire Contact Termination Area Plating Thickness 2.54 MICM | Contact Orientation Straight | Wire Contact Termination Area Plating Thickness 100 MICIN | Mating Square Post Dimension 1.14 MM | Contact Base Material Phosphor Bronze | Contact Shape & Form Single Beam | Contact Current Rating (Max) 9 AMP | Contact Type Socket | Wire Contact Termination Area Plating Material Finish Bright | Wire Contact Termination Area Plating Material Pre-Tin | Contact M

Contact Features: Wire Contact Termination Area Plating Material Tin | Contact Orientation Straight | Contact Mating Area Plating Material Gold | Contact Underplating Material Thickness 50 MICIN | Contact Type Pin | Contact Base Material Phosphor Bronze | Mating Square Post Dimension 1.14 MM | Mating Square Post Dimension .045 INCH | Contact Fabrication Stamped & Formed | Contact Current Rating (Max) 9 AMP | Wire Contact Termination Area Plating Thickness 2.54 MICM | Contact Retention Within Housing With |

Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Base Material Phosphor Bronze | Contact Mating Area Plating Material Tin | Contact Retention Within Housing With | Wire Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Current Rating (Max) 9 AMP | Dimensions: Wire Size .2 – .8 MMSQ | Wire Size 24 – 18 AWG | Compa

Contact Features: Contact Current Rating (Max) 9 AMP | Contact Orientation Straight | Wire Contact Termination Area Plating Thickness 2.54 MICM | Wire Contact Termination Area Plating Thickness 100 MICIN | Mating Square Post Dimension 1.14 MM | Contact Underplating Material Thickness 1.27 MICM | Wire Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Retention Within Housing With | Mating Square Post Dimension .045 INCH | Contact Mating Area Plating Material Gold | Contact Mating Are

Configuration Features: Number of Positions 3 | Number of Rows 1 | Insertion Force 15 NEWT | Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Layout Inline | Contact Retention Within Housing Without | Contact Type Receptacle | Dimensions: Product Length 13.8 MM | Product Width 20.6 MM | Connector Height .291 INCH | Compatible Insulation Diameter Range 1.2 – 3.1 MM | Product Width .811 INCH | Product Length .543 INCH | Compatible Insulation Diameter Range .047 – .122 INCH | Con

Configuration Features: Number of Positions 3 | Compatible With Wire & Cable Type Discrete Wire | Insertion Force 15 NEWT | Number of Rows 1 | Contact Features: Contact Retention Within Housing Without | Contact Type Pin | Contact Layout Inline | Dimensions: Connector Height .291 INCH | Product Width 23.9 MM | Compatible Insulation Diameter Range 1.2 – 3.1 MM | Connector Height 7.4 MM | Product Length 13.8 MM | Compatible Insulation Diameter Range .047 – .122 INCH | Product Width .94 INCH | Product Leng

Configuration Features: Insertion Force 15 NEWT | Compatible With Wire & Cable Type Discrete Wire | Number of Positions 3 | Number of Rows 1 | Contact Features: Contact Layout Inline | Contact Retention Within Housing Without | Contact Type Pin | Dimensions: Compatible Insulation Diameter Range 1.2 – 3.1 MM | Connector Height 7.4 MM | Compatible Insulation Diameter Range .047 – .122 INCH | Product Length .543 INCH | Connector Height .291 INCH | Product Length 13.8 MM | Product Width 23.9 MM | Product Wi

Contact Features: Contact Retention Within Housing With | Mating Square Post Dimension 1.14 MM | Contact Mating Area Plating Material Tin | Contact Base Material Brass | Contact Mating Area Plating Material Thickness 2.54 MICM | Wire Contact Termination Area Plating Thickness 2.54 MICM | Contact Current Rating (Max) 9 AMP | Contact Orientation Straight | Contact Mating Area Plating Material Thickness 100 MICIN | Mating Square Post Dimension .045 INCH | Contact Type Socket | Wire Contact Termination Area Pla

Contact Features: Mating Square Post Dimension 1.14 MM | Wire Contact Termination Area Plating Thickness 100 MICIN | Contact Mating Area Plating Material Tin | Wire Contact Termination Area Plating Material Finish Bright | Contact Retention Within Housing With | Contact Mating Area Plating Material Thickness 2.54 MICM | Mating Square Post Dimension .045 INCH | Wire Contact Termination Area Plating Thickness 2.54 MICM | Contact Current Rating (Max) 9 AMP | Contact Mating Area Plating Material Thickness 100 M

Configuration Features: Number of Power Positions 8 | Number of Signal Positions 0 | Number of Positions 8 | PCB Mount Orientation Right Angle | Number of Rows 2 | Contact Features: Contact Layout Inline | Contact Type Pin | Contact Retention Within Housing Without | Contact Layout Matrix | Contact Current Rating (Max) 9 AMP | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Mating Area Plating Material Thickness 2.03 MICM | PCB Contact Termination

Configuration Features: Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Signal Positions 0 | Number of Power Positions 6 | Number of Positions 6 | Contact Features: Contact Mating Area Plating Material Thickness 80 MICIN | Contact Layout Inline | Contact Type Pin | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Current Rating (Max) 9 AMP | Contact Mating Area Plating Material Tin | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material T

Configuration Features: Number of Rows 2 | Number of Positions 4 | PCB Mount Orientation Right Angle | Contacts Preloaded Yes | Contact Features: Contact Mating Area Plating Material Tin | Contact Layout Inline | Contact Current Rating (Max) 9 AMP | Contact Retention Within Housing Without | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Dimensions: Wire Size .12 – 1.4 MMSQ | Product Width 13 MM | Connector Height 9.8 MM | Row-to-Row Spacing .165 INCH | Product Width .512 INCH | Co

Configuration Features: Number of Power Positions 2 | Number of Signal Positions 0 | Number of Rows 2 | Number of Positions 2 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Tin | Contact Layout Inline | Contact Mating Area Plating Material Thickness 2.03 MICM | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 9 AMP | Contact Type Pin | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Retention Within Housing Witho

Configuration Features: Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Power Positions 6 | Number of Positions 6 | Contact Features: Contact Current Rating (Max) 9 AMP | Contact Layout Inline | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Type Pin | Contact Mating Area Plating Material Tin | Dimensions: PCB Thickness

Configuration Features: Number of Positions 2 | Number of Rows 2 | Number of Power Positions 2 | PCB Mount Orientation Right Angle | Contact Features: Contact Layout Inline | Contact Current Rating (Max) 9 AMP | Contact Mating Area Plating Material Thickness 80 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Retention Within Housing Without | Dimensions: PCB Thickness

Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 6 | Number of Power Positions 6 | Number of Rows 2 | Contact Features: Contact Current Rating (Max) 9 AMP | Contact Mating Area Plating Material Tin | Contact Layout Inline | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Layout Matrix | Contact Mating Area Plating Material Thickness 80 MICIN | Di

Configuration Features: Number of Positions 2 | Number of Power Positions 2 | Number of Rows 2 | PCB Mount Orientation Right Angle | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 9 AMP | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Layout Inline | Contact Type Pin | Dimensions: Compatible Ins

Use the download button to access the 1586040-8 schematic symbol, PCB footprint, and 3D model.

Configuration Features: Number of Rows 2 | Number of Positions 6 | Number of Power Positions 6 | PCB Mount Orientation Vertical | Contact Features: Contact Current Rating (Max) 9 AMP | Contact Layout Inline | Contact Retention Within Housing Without | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.03 MICM | Dimensions: Connector Height

Configuration Features: PCB Mount Orientation Vertical | Number of Power Positions 4 | Number of Rows 2 | Number of Positions 4 | Contact Features: Contact Current Rating (Max) 9 AMP | Contact Layout Inline | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Type Pin | Dimensions: Product Width 9.8

Configuration Features: Number of Positions 8 | Number of Power Positions 8 | Number of Rows 2 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Thickness 80 – 200 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 9 AMP | Contact Mating Area Plating Material Tin | Contact Layout Inline | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 2.03 – 5.08 MICM | Contact Type Pin | Dimensions:

Configuration Features: Number of Power Positions 6 | PCB Mount Orientation Vertical | Number of Rows 2 | Number of Positions 6 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 80 – 200 MICIN | Contact Mating Area Plating Material Thickness 2.03 – 5.08 MICM | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Contact Layout Inline | Contact Current Rating (Max) 9 AMP | Contact Type Pin | Dimensions:

Configuration Features: Number of Rows 2 | Number of Power Positions 8 | PCB Mount Orientation Vertical | Number of Positions 8 | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.03 – 5.08 MICM | Contact Type Pin | Contact Current Rating (Max) 9 AMP | Contact Mating Area Plating Material Thickness 80 – 200 MICIN | Contact Layout Matrix | Contact Layo

Configuration Features: Number of Rows 2 | PCB Mount Orientation Vertical | Number of Positions 6 | Number of Power Positions 6 | Contact Features: Contact Layout Inline | Contact Layout Matrix | Contact Type Pin | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 2.03 – 5.08 MICM | Contact Mating Area Plating Material Thickness 80 – 200 MICIN | Contact Current Rating (M

Configuration Features: Number of Rows 2 | Number of Positions 2 | PCB Mount Orientation Vertical | Number of Power Positions 2 | Contact Features: Contact Mating Area Plating Material Thickness 2.03 – 5.08 MICM | Contact Current Rating (Max) 9 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material Thickness 80 – 200 MICIN | Contact Layout Inline | Contact Retention Within Housing Without | Dimensions:

Configuration Features: Number of Positions 5 | Number of Rows 1 | Insertion Force 15 NEWT | Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Retention Within Housing Without | Contact Layout Inline | Contact Type Receptacle | Dimensions: Compatible Insulation Diameter Range .047 – .122 INCH | Compatible Insulation Diameter Range 1.2 – 3.1 MM | Connector Height 7.5 MM | Connector Height .295 INCH | Product Length .874 INCH | Product Width 19.8 MM | Product Width .779 INCH | Pr

Configuration Features: Number of Rows 1 | Number of Positions 5 | Compatible With Wire & Cable Type Discrete Wire | Insertion Force 15 NEWT | Contact Features: Contact Retention Within Housing Without | Contact Layout Inline | Contact Type Pin | Dimensions: Connector Height .291 INCH | Product Width .937 INCH | Product Width 23.8 MM | Product Length .874 INCH | Compatible Insulation Diameter Range 1.2 – 3.1 MM | Compatible Insulation Diameter Range .047 – .122 INCH | Connector Height 7.4 MM | Product L

Configuration Features: Insertion Force 15 NEWT | Compatible With Wire & Cable Type Discrete Wire | Number of Positions 8 | Number of Rows 2 | Contact Features: Contact Type Pin | Contact Layout Matrix | Contact Retention Within Housing Without | Dimensions: Row-to-Row Spacing 4.2 MM | Compatible Insulation Diameter Range .047 – .122 INCH | Connector Height .378 INCH | Row-to-Row Spacing .165 INCH | Product Length 18 MM | Connector Height 9.6 MM | Product Width 23.9 MM | Product Width .94 INCH | Compatibl