TE Connectivity
TE Connectivity is a leading electronic component manufacturer. FindMyChip sources TE Connectivity ICs directly from authorized China distributors, offering competitive pricing and reliable stock.
8,050
Total Products
24
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All TE Connectivity Components
Showing 3,201–3,250 of 8,050
Contact Features: Contact Mating Area Plating Material Thickness .75 MICM | Contact Retention Within Housing With | Contact Base Material Phosphor Bronze | Contact Mating Area Plating Material Gold | Contact Length 22.2 MM | Contact Length .87 INCH | Dimensions: Compatible Insulation Diameter Range 1.1 – 1.8 INCH | Mechanical Attachment: Contact Retention Type Within Housing Snap-In | Operation/Application: Circuit Application Signal | Solder Process Feature Solder Dipped | Packaging Features: Packaging M
Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Wire Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 3 AMP | Contact Base Material Phosphor Bronze | Mating Square Post Dimension .64 MM | Mating Square Post Dimension .025 INCH | Contact Mating Area Plating Material Tin | Contact Type Socket | Dimensions: Wire Size .12 – .15 MMSQ | Wire Size 236.82 – 266.03 CMA | Wire Size 26 AWG | Electrical Characteristics: Termination Resistance 1
Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Mating Area Plating Material Gold | Contact Base Material Phosphor Bronze | Mating Square Post Dimension .025 INCH | Contact Type Socket | Contact Current Rating (Max) 3 AMP | Mating Square Post Dimension .64 MM | Wire Contact Termination Area Plating Material Gold Flash | Dimensions: Wire Size .12 – .15 MMSQ | Wire Size 236.82 – 266.03 CMA | Wire Size 26 AWG | Electrical Characteristics: Insulation Resis
Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Base Material Phosphor Bronze | Wire Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Mating Square Post Dimension .025 INCH | Contact Type Socket | Mating Square Post Dimension .64 MM | Contact Current Rating (Max) 3 AMP | Dimensions: Wire Size 394.71 – 1184.12 CMA | Wire Size .2 – .6 MMSQ | Wire Size 24 – 20 AWG | Electrical Characteristics: Insulation Resista
Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Current Rating (Max) 3 AMP | Contact Base Material Phosphor Bronze | Mating Square Post Dimension .025 INCH | Contact Type Socket | Contact Mating Area Plating Material Gold | Mating Square Post Dimension .64 MM | Wire Contact Termination Area Plating Material Gold Flash | Dimensions: Wire Size 24 – 20 AWG | Wire Size 394.71 – 1184.12 CMA | Wire Size .2 – .6 MMSQ | Electrical Characteristics: Terminatio
TE Connectivity 2mm Pitch 240 Way, 25 ° Through Hole Mount DDR2 DIMM Socket ,1.8 V
Body Features: Primary Product Color Black | Connector Profile Standard | Configuration Features: Number of Rows 2 | Number of Positions 14 | PCB Mount Orientation Vertical | Contact Features: Mating Square Post Dimension .025 INCH | Contact Mating Area Plating Material Thickness 30 MICIN | Mating Square Post Dimension .64 MM | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 1 AMP | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plati
Body Features: Connector Profile Standard | Primary Product Color Black | Configuration Features: Number of Rows 2 | PCB Mount Orientation Vertical | Number of Positions 10 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Type Pin | Mating Square Post Dimension .64 MM | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Tin | Contact Mating A
Body Features: Connector Profile Low | Primary Product Color Black | Daisy Chain Without | Configuration Features: Number of Positions 26 | Number of Rows 2 | PCB Mount Orientation Vertical | Contact Features: Contact Base Material Phosphor Bronze | Mating Pin Diameter .025 INCH | Wire Contact Termination Area Plating Thickness 1.27 MICM | Contact Type Socket | Contact Underplating Material Nickel | Contact Current Rating (Max) 1 AMP | Wire Contact Termination Area Plating Material Tin | Contact Shape & For
Body Features: Daisy Chain Without | Primary Product Color Black | Connector Profile Low | Configuration Features: Number of Rows 2 | Number of Positions 40 | PCB Mount Orientation Vertical | Contact Features: Contact Base Material Phosphor Bronze | Wire Contact Termination Area Plating Thickness 50 MICIN | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Wire Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Type Sock
Body Features: Daisy Chain Without | Connector Profile Low | Primary Product Color Black | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 26 | Number of Rows 2 | Contact Features: Contact Shape & Form Tuning Fork | Wire Contact Termination Area Plating Thickness 50 MICIN | Mating Square Post Dimension .64 MM | Contact Current Rating (Max) 1 AMP | Contact Mating Area Plating Material Thickness .76 MICM | Wire Contact Termination Area Plating Thickness 1.27 MICM | Contact Base Ma
Body Features: Primary Product Color Black | Connector Profile Low | Daisy Chain Without | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 2 | Number of Positions 24 | Contact Features: Contact Base Material Phosphor Bronze | Contact Underplating Material Nickel | Wire Contact Termination Area Plating Thickness 50 MICIN | Mating Square Post Dimension .64 MM | Contact Type Socket | Contact Mating Area Plating Material Thickness .76 MICM | Contact Shape & Form Tuning Fork | Mating Pin
Body Features: Connector Profile Low | Primary Product Color Black | Daisy Chain Without | Configuration Features: Number of Positions 20 | PCB Mount Orientation Vertical | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Gold | Mating Square Post Dimension .64 MM | Contact Shape & Form Tuning Fork | Contact Mating Area Plating Material Thickness 29.92 MICIN | Wire Contact Termination Area Plating Thickness 50 M
Body Features: Primary Product Color Black | Daisy Chain Without | Connector Profile Low | Configuration Features: Number of Rows 2 | Number of Positions 16 | PCB Mount Orientation Vertical | Contact Features: Contact Base Material Phosphor Bronze | Wire Contact Termination Area Plating Thickness 50 MICIN | Wire Contact Termination Area Plating Thickness 1.27 MICM | Contact Mating Area Plating Material Thickness .76 MICM | Mating Pin Diameter .025 INCH | Contact Type Socket | Contact Mating Area Plating Mat
Body Features: Daisy Chain Without | Primary Product Color Black | Connector Profile Low | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 24 | Number of Rows 2 | Contact Features: Contact Base Material Phosphor Bronze | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 1 AMP | Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Mating Pin Diameter .025 INCH | Wire Contact Termination Area Plating
Body Features: Primary Product Color Black | Daisy Chain Without | Connector Profile Low | Configuration Features: Number of Positions 30 | Number of Rows 2 | PCB Mount Orientation Vertical | Contact Features: Wire Contact Termination Area Plating Thickness 50 MICIN | Mating Square Post Dimension .025 INCH | Contact Mating Area Plating Material Gold | Contact Base Material Phosphor Bronze | Contact Mating Area Plating Material Thickness .38 MICM | Wire Contact Termination Area Plating Material Tin | Contact
Body Features: Daisy Chain Without | Primary Product Color Black | Connector Profile Low | Configuration Features: Number of Positions 40 | PCB Mount Orientation Vertical | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Thickness .38 MICM | Contact Mating Area Plating Material Gold | Contact Base Material Phosphor Bronze | Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Wire Contact Termination Area Plating Thickness 5
Body Features: Connector Profile Low | Primary Product Color Black | Daisy Chain Without | Configuration Features: Number of Positions 16 | Number of Rows 2 | PCB Mount Orientation Vertical | Contact Features: Contact Underplating Material Nickel | Mating Square Post Dimension .64 MM | Contact Mating Area Plating Material Thickness .38 MICM | Contact Type Socket | Contact Current Rating (Max) 1 AMP | Wire Contact Termination Area Plating Thickness 1.27 MICM | Mating Pin Diameter .64 MM | Mating Pin Diameter
Body Features: Primary Product Color Black | Configuration Features: Number of Rows 2 | Number of Positions 26 | Contact Features: Contact Mating Area Plating Material Thickness 15 MICIN | Wire Contact Termination Area Plating Thickness 5 MICIN | Wire Contact Termination Area Plating Material Gold Flash | Contact Mating Area Plating Material Gold | Wire Contact Termination Area Plating Thickness .127 MICM | Mating Square Post Dimension .64 MM | Contact Current Rating (Max) 1 AMP | Mating Square Post Dimensi
Body Features: Primary Product Color Blue | Configuration Features: Number of Rows 2 | Number of Positions 26 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | Wire Contact Termination Area Plating Material Gold Flash | Wire Contact Termination Area Plating Thickness 5 MICIN | Mating Square Post Dimension .64 MM | Mating Square Post Dimension .025 INCH | Contact Current Rating (Max) 1 AMP | Wire Contact Termination Area Plating Thicknes
Body Features: Primary Product Color Blue | Configuration Features: Number of Positions 16 | Number of Rows 2 | Contact Features: Mating Square Post Dimension .64 MM | Wire Contact Termination Area Plating Thickness 5 MICIN | Contact Current Rating (Max) 1 AMP | Wire Contact Termination Area Plating Material Gold Flash | Mating Square Post Dimension .025 INCH | Wire Contact Termination Area Plating Thickness .127 MICM | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickne
622-0630LF FEM SOCKT,LEAD FREE
Body Features: Primary Product Color Blue | Configuration Features: Number of Rows 2 | Number of Positions 14 | Contact Features: Wire Contact Termination Area Plating Thickness 100 – 200 MICIN | Wire Contact Termination Area Plating Material Tin | Wire Contact Termination Area Plating Thickness 2.54 – 5.08 MICM | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 1 AMP | Dimensions: Row-to-Row Spacing 2.54 MM | Row-to-Row S
Body Features: Primary Product Color Blue | Configuration Features: Number of Rows 2 | Number of Positions 10 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 1 AMP | Contact Mating Area Plating Material Gold | Wire Contact Termination Area Plating Thickness 100 – 200 MICIN | Wire Contact Termination Area Plating Material Tin | Wire Contact Termination Area Plating Thickness 2.54 – 5.08 MICM | Dimensions: Row-to-Row Spacing 2.54 MM | Row-to-Row S
Contact Features: Contact Base Material Copper | Mating Pin Diameter 1.02 MM | PCB Contact Termination Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 30 MICIN | Contact Underplating Material Thickness 40 MICIN | PCB Contact Termination Area Plating Material Thickness .76 MICM | Contact Retention Within Housing Without | Contact Orientation Straight | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rat
TE Connectivity Female Straight PCB Connector Housing
TE Connectivity Male Straight PCB Connector Housing
Contact Features: Contact Size Size 20 | Contact Retention Within Housing Without | Wire Contact Termination Area Plating Material Gold | Contact Mating Area Plating Material Thickness 29.8 MICIN | Contact Mating Area Plating Material Gold | Contact Type Socket | PCB Contact Termination Area Plating Material Gold | Contact Orientation Straight | Wire Contact Termination Area Plating Thickness 10 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rating (Max) 5 AMP | Mating Pin
TE Connectivity 8 Way Male Straight PCB Connector Housing
Contact Features: Contact Mating Area Plating Material Finish Bright | Wire Contact Termination Area Plating Thickness .076 MICM | Contact Underplating Material Nickel | Contact Orientation Straight | Contact Mating Area Plating Material Thickness 30 MICIN | Mating Pin Diameter 1.57 MM | Mating Pin Diameter .062 INCH | Contact Underplating Material Thickness 50 MICIN | Barrel Type Open | Contact Shape & Form Round | Wire Contact Termination Area Plating Material Gold Flash | Contact Mating Area Plating Mate
Contact Features: Wire Contact Termination Area Plating Thickness 1.02 MICM | Wire Contact Termination Area Plating Thickness 40 MICIN | Contact Mating Area Plating Material Tin | Mating Pin Diameter .062 INCH | Contact Mating Area Plating Material Thickness 40 MICIN | Wire Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 1.02 MICM | Contact Base Material Brass | Contact Orientation Straight | Contact Current Rating (Max) 13 AMP | Contact Underplating Material N
Contact Features: Barrel Type Open | Contact Base Material Brass | Contact Orientation Straight | Contact Retention Within Housing With | Wire Contact Termination Area Plating Material Tin-Lead | Contact Mating Area Plating Material Tin | Contact Type Pin | Mating Pin Diameter .082 INCH | Mating Pin Diameter 2.1 MM | Dimensions: Compatible Insulation Diameter Range 1.4 – 2.4 MM | Wire Size 22 – 18 AWG | Wire Size .3 – .75 MMSQ | Compatible Insulation Diameter Range .055 – .095 INCH | Mechanical Atta
MATE-N-LOK PCB Connector Contact, Female, Crimp, Tin Plating 18 → 22 AWG
Contact Features: Contact Retention Within Housing With | Contact Mating Area Plating Material Tin | Mating Pin Diameter .082 INCH | Contact Orientation Straight | Wire Contact Termination Area Plating Material Tin-Lead | Contact Type Socket | Contact Base Material Phosphor Bronze | Mating Pin Diameter 2.1 MM | Dimensions: Compatible Insulation Diameter Range 2.5 – 3.8 MM | Compatible Insulation Diameter Range .098 – .15 INCH | Wire Size 17 – 13 AWG | Wire Size 1 – 2.5 MMSQ | Mechanical Attachment:
Contact Features: Wire Contact Termination Area Plating Thickness .4 – 3.5 MICM | Mating Pin Diameter .082 INCH | Wire Contact Termination Area Plating Material Pre-Tin | Barrel Type Open | Contact Shape & Form Round | Contact Type Socket | Contact Mating Area Plating Material Tin | Contact Retention Within Housing With | Contact Base Material Phosphor Bronze | Contact Orientation Straight | Wire Contact Termination Area Plating Thickness 15.75 – 137.8 MICIN | Mating Pin Diameter 2.1 MM | Dimensions: Co
Contact Features: Mating Pin Diameter 2.1 MM | Contact Mating Area Plating Material Tin | Wire Contact Termination Area Plating Material Pre-Tin | Contact Type Pin | Mating Pin Diameter .082 INCH | Contact Orientation Straight | Wire Contact Termination Area Plating Thickness 30 MICIN | Wire Contact Termination Area Plating Thickness .76 MICM | Contact Retention Within Housing With | Contact Base Material Phosphor Bronze | Dimensions: Wire Size 1 – 2.5 MMSQ | Wire Size 17 – 13 AWG | Compatible Insulatio
Contact Features: Wire Contact Termination Area Plating Thickness .76 MICM | Contact Retention Within Housing With | Contact Orientation Straight | Contact Type Pin | Mating Pin Diameter 2.1 MM | Contact Mating Area Plating Material Tin | Mating Pin Diameter .082 INCH | Wire Contact Termination Area Plating Thickness 30 MICIN | Wire Contact Termination Area Plating Material Pre-Tin | Contact Base Material Brass | Dimensions: Wire Size 17 – 13 AWG | Compatible Insulation Diameter Range .098 – .15 INCH |
Contact Features: Wire Contact Termination Area Plating Material Pre-Tin | Mating Pin Diameter 2.1 MM | Barrel Type Open | Mating Pin Diameter .082 INCH | Contact Base Material Brass | Contact Shape & Form Round | Wire Contact Termination Area Plating Thickness .4 – 3.5 MICM | Contact Type Socket | Contact Retention Within Housing With | Contact Orientation Straight | Wire Contact Termination Area Plating Thickness 15.75 – 137.8 MICIN | Contact Mating Area Plating Material Tin | Dimensions: Compatible I
Contact Features: Contact Mating Area Plating Material Finish Bright | Contact Size Size 16 | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Underplating Material Thickness 50 MICIN | Contact Current Rating (Max) 13 AMP | Mating Pin Diameter .062 INCH | Contact Orientation Straight | Contact Base Material Brass | Wire Contact Termination Area Plating Thickness 3 MICIN | Contact Mating Area Plating Material Precious Metal | Contact Underplating Material Nickel | Contact Mating Area Plating
Contact Features: Contact Underplating Material Nickel | Wire Contact Termination Area Plating Thickness 1.02 MICM | Contact Underplating Material Thickness 1.27 MICM | Contact Base Material Brass | Wire Contact Termination Area Plating Material Tin | Contact Orientation Straight | Mating Pin Diameter 1.57 MM | Mating Pin Diameter .062 INCH | Contact Mating Area Plating Material Thickness 40 MICIN | Wire Contact Termination Area Plating Thickness 40 MICIN | Contact Mating Area Plating Material Thickness 1.0
Contact Features: Wire Contact Termination Area Plating Material Gold Flash | Mating Pin Diameter 1.57 MM | Contact Mating Area Plating Material Thickness 30 MICIN | Wire Contact Termination Area Plating Thickness 3 MICIN | Mating Pin Diameter .062 INCH | Contact Current Rating (Max) 13 AMP | Contact Retention Within Housing With | Contact Base Material Brass | Contact Mating Area Plating Material Gold | Contact Underplating Material Thickness 50 MICIN | Contact Underplating Material Thickness 1.27 MICM | C
Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Underplating Material Nickel | Wire Contact Termination Area Plating Thickness 3 MICIN | Contact Mating Area Plating Material Finish Bright | Contact Underplating Material Thickness 50 MICIN | Contact Orientation Straight | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 13 AMP | Wire Contact Termination Area Plating Material Gold Flash | Mating Pin Diameter 1.57 MM | Mating Pin Diamete
Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Connection Capacity Single | Contact Features: Terminal Plating Material Tin | Terminal Orientation Straight | Mating Tab Width 6.35 MM | Mating Tab Thickness .81 MM | Quick Disconnect Terminal Type Receptacle | Mating Tab Width .25 INCH | Mating Tab Thickness .032 INCH | Contact Base Material Phosphor Bronze | Crimp Type F-Crimp | Barrel Type Open | Dimensions: Wire Size 20 – 15 AWG | Product Length .88 INCH | Compatible Insulation
TE Connectivity 2 Way Female, Male Straight PCB Connector Housing 50
TE Connectivity 2 Way Female, Male Straight PCB Connector Housing 50
Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Wire Contact Termination Area Plating Material Gold | Contact Current Rating (Max) 9 AMP | Contact Type Socket | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold | Contact Base Material Phosphor Bronze | Contact Retention Within Housing With | Dimensions: Compatible Insulation Diameter Range 1.8 – 3.1 MM
Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Type Socket | Contact Current Rating (Max) 9 AMP | Wire Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Tin | Contact Retention Within Housing With | Contact Base Material Phosphor Bronze | Contact Mating Area Plating Material Thickness 100 MICIN | Dimensions: Compatible Insulation Diameter Range 1.8 – 3.1 MM | C
Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Current Rating (Max) 9 AMP | Contact Retention Within Housing With | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold | Contact Type Socket | Contact Base Material Brass | Wire Contact Termination Area Plating Material Gold | Dimensions: Wire Size 1.25 – 1.4 MMSQ | Compatible Insulation Diameter R
Contact Features: Mating Square Post Dimension 1.14 MM | Contact Base Material Brass | Wire Contact Termination Area Plating Material Finish Bright | Contact Current Rating (Max) 9 AMP | Contact Orientation Straight | Wire Contact Termination Area Plating Thickness 100 MICIN | Mating Square Post Dimension .045 INCH | Contact Retention Within Housing With | Wire Contact Termination Area Plating Material Pre-Tin | Wire Contact Termination Area Plating Thickness 2.54 MICM | Contact Shape & Form Single Beam | C
TE Connectivity VAL-U-LOK Series, 4.2mm Pitch 8 Way 2 Row Straight PCB Header, Solder, Through Hole Termination, 9A
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