Renesas Electronics

The R8C/28 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data

The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data

The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data

The R8C/26 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu

The R8C/26 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu

The R8C/25 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu

The R8C/25 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu

The R8C/25 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu

The R8C/25 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu

The R8C/25 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu

The R8C/24 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1Mb of address space, it is capable of executing instructions at high speed. This MCU is equipped with one CAN module and s

The R8C/24 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1Mb of address space, it is capable of executing instructions at high speed. This MCU is equipped with one CAN module and s

The R8C/24 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1Mb of address space, it is capable of executing instructions at high speed. This MCU is equipped with one CAN module and s

The R8C/24 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1Mb of address space, it is capable of executing instructions at high speed. This MCU is equipped with one CAN module and s

The R8C/24 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1Mb of address space, it is capable of executing instructions at high speed. This MCU is equipped with one CAN module and s

The R8C/24 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1Mb of address space, it is capable of executing instructions at high speed. This MCU is equipped with one CAN module and s

RL78/L1C microcontrollers have a built-in segment LCD driver and USB 2.0 function. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.76 μANote 2, internal voltage boost: 1.23 μA, and capacitive split: 0.74 µA. They support USB high-speed battery charging (Battery Charging Specification 1.2) and com

RL78/L1C microcontrollers have a built-in segment LCD driver and USB 2.0 function. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.76 μANote 2, internal voltage boost: 1.23 μA, and capacitive split: 0.74 µA. They support USB high-speed battery charging (Battery Charging Specification 1.2) and com

RL78/L1C microcontrollers have a built-in segment LCD driver and USB 2.0 function. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.76 μANote 2, internal voltage boost: 1.23 μA, and capacitive split: 0.74 µA. They support USB high-speed battery charging (Battery Charging Specification 1.2) and com

RL78/L1C microcontrollers have a built-in segment LCD driver and USB 2.0 function. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.76 μANote 2, internal voltage boost: 1.23 μA, and capacitive split: 0.74 µA. They support USB high-speed battery charging (Battery Charging Specification 1.2) and com

RL78/G10 microcontrollers realize the industry's lowest level of consumption current (CPU: 46 μA/MHz, standby (STOP): 560 nA). With an on-chip oscillator, A/D converter, comparator, and more, and a 10/16-pin package lineup, they support more compact system size. These low pin count microcontrollers are perfect for small consumer electronics.

RL78/G10 microcontrollers realize the industry's lowest level of consumption current (CPU: 46 μA/MHz, standby (STOP): 560 nA). With an on-chip oscillator, A/D converter, comparator, and more, and a 10/16-pin package lineup, they support more compact system size. These low pin count microcontrollers are perfect for small consumer electronics.

RL78/G10 microcontrollers realize the industry's lowest level of consumption current (CPU: 46 μA/MHz, standby (STOP): 560 nA). With an on-chip oscillator, A/D converter, comparator, and more, and a 10/16-pin package lineup, they support more compact system size. These low pin count microcontrollers are perfect for small consumer electronics.

RL78/G10 microcontrollers realize the industry's lowest level of consumption current (CPU: 46 μA/MHz, standby (STOP): 560 nA). With an on-chip oscillator, A/D converter, comparator, and more, and a 10/16-pin package lineup, they support more compact system size. These low pin count microcontrollers are perfect for small consumer electronics.

RL78/G10 microcontrollers realize the industry's lowest level of consumption current (CPU: 46 μA/MHz, standby (STOP): 560 nA). With an on-chip oscillator, A/D converter, comparator, and more, and a 10/16-pin package lineup, they support more compact system size. These low pin count microcontrollers are perfect for small consumer electronics.

RL78/G10 microcontrollers realize the industry's lowest level of consumption current (CPU: 46 μA/MHz, standby (STOP): 560 nA). With an on-chip oscillator, A/D converter, comparator, and more, and a 10/16-pin package lineup, they support more compact system size. These low pin count microcontrollers are perfect for small consumer electronics.

RL78/G10 microcontrollers realize the industry's lowest level of consumption current (CPU: 46 μA/MHz, standby (STOP): 560 nA). With an on-chip oscillator, A/D converter, comparator, and more, and a 10/16-pin package lineup, they support more compact system size. These low pin count microcontrollers are perfect for small consumer electronics.

RL78/L13 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.61 μANote 2, and internal voltage boost: 1.42 μA, and capacitive split: 0.77 µA. With a lineup of 64/80-pin products supporting up to 376 segments, these microcontrollers are perfect for

RL78/L13 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.61 μANote 2, and internal voltage boost: 1.42 μA, and capacitive split: 0.77 µA. With a lineup of 64/80-pin products supporting up to 376 segments, these microcontrollers are perfect for

RL78/L13 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.61 μANote 2, and internal voltage boost: 1.42 μA, and capacitive split: 0.77 µA. With a lineup of 64/80-pin products supporting up to 376 segments, these microcontrollers are perfect for

RL78/L13 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.61 μANote 2, and internal voltage boost: 1.42 μA, and capacitive split: 0.77 µA. With a lineup of 64/80-pin products supporting up to 376 segments, these microcontrollers are perfect for

RL78/L13 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.61 μANote 2, and internal voltage boost: 1.42 μA, and capacitive split: 0.77 µA. With a lineup of 64/80-pin products supporting up to 376 segments, these microcontrollers are perfect for

RL78/L13 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.61 μANote 2, and internal voltage boost: 1.42 μA, and capacitive split: 0.77 µA. With a lineup of 64/80-pin products supporting up to 376 segments, these microcontrollers are perfect for

RL78/L13 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.61 μANote 2, and internal voltage boost: 1.42 μA, and capacitive split: 0.77 µA. With a lineup of 64/80-pin products supporting up to 376 segments, these microcontrollers are perfect for

RL78/L12 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.60 μANote 2, internal voltage boost: 1.19 μA, and capacitive split: 0.68 µA. With a lineup of 32 to 64-pin products supporting up to 280 segments, these microcontrollers are perfect for s

RL78/L12 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.60 μANote 2, internal voltage boost: 1.19 μA, and capacitive split: 0.68 µA. With a lineup of 32 to 64-pin products supporting up to 280 segments, these microcontrollers are perfect for s

RL78/L12 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.60 μANote 2, internal voltage boost: 1.19 μA, and capacitive split: 0.68 µA. With a lineup of 32 to 64-pin products supporting up to 280 segments, these microcontrollers are perfect for s

RL78/L12 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.60 μANote 2, internal voltage boost: 1.19 μA, and capacitive split: 0.68 µA. With a lineup of 32 to 64-pin products supporting up to 280 segments, these microcontrollers are perfect for s

RL78/L12 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.60 μANote 2, internal voltage boost: 1.19 μA, and capacitive split: 0.68 µA. With a lineup of 32 to 64-pin products supporting up to 280 segments, these microcontrollers are perfect for s

RL78/L12 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.60 μANote 2, internal voltage boost: 1.19 μA, and capacitive split: 0.68 µA. With a lineup of 32 to 64-pin products supporting up to 280 segments, these microcontrollers are perfect for s

RL78/L12 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.60 μANote 2, internal voltage boost: 1.19 μA, and capacitive split: 0.68 µA. With a lineup of 32 to 64-pin products supporting up to 280 segments, these microcontrollers are perfect for s

RL78/L12 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.60 μANote 2, internal voltage boost: 1.19 μA, and capacitive split: 0.68 µA. With a lineup of 32 to 64-pin products supporting up to 280 segments, these microcontrollers are perfect for s

RL78/L12 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.60 μANote 2, internal voltage boost: 1.19 μA, and capacitive split: 0.68 µA. With a lineup of 32 to 64-pin products supporting up to 280 segments, these microcontrollers are perfect for s

RL78/L12 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.60 μANote 2, internal voltage boost: 1.19 μA, and capacitive split: 0.68 µA. With a lineup of 32 to 64-pin products supporting up to 280 segments, these microcontrollers are perfect for s

RL78/L12 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.60 μANote 2, internal voltage boost: 1.19 μA, and capacitive split: 0.68 µA. With a lineup of 32 to 64-pin products supporting up to 280 segments, these microcontrollers are perfect for s

RL78/I1B microcontrollers adapt various electricity meter metrologies for different regulations by country and realize the efficient power measurement by the combination of low active current 96uA/MHz, standby current 0.66uA (Halt mode with 32kHz oscillator and RTC backup on), 24-bit ΔΣA/D converter, phase adjustment circuits and high pass filter. CPU clock frequency can be minimized taking advantage of the efficient power measurement features, which includes the low power ΔΣ A/D converter 0.53mA/ch. RL78/I

RL78/I1B microcontrollers adapt various electricity meter metrologies for different regulations by country and realize the efficient power measurement by the combination of low active current 96uA/MHz, standby current 0.66uA (Halt mode with 32kHz oscillator and RTC backup on), 24-bit ΔΣA/D converter, phase adjustment circuits and high pass filter. CPU clock frequency can be minimized taking advantage of the efficient power measurement features, which includes the low power ΔΣ A/D converter 0.53mA/ch. RL78/I

RL78/I1B microcontrollers adapt various electricity meter metrologies for different regulations by country and realize the efficient power measurement by the combination of low active current 96uA/MHz, standby current 0.66uA (Halt mode with 32kHz oscillator and RTC backup on), 24-bit ΔΣA/D converter, phase adjustment circuits and high pass filter. CPU clock frequency can be minimized taking advantage of the efficient power measurement features, which includes the low power ΔΣ A/D converter 0.53mA/ch. RL78/I

In addition to two USB 2.0 (full speed) host channels or one function channel, the RL78/G1C microcontrollers are compliant with Battery Charging Specification 1.2 (BC 1.2) for high-speed battery charging. These microcontrollers are suitable for office equipment that connect via USB such as a printer, mouse, and keyboard, as well as for USB chargers for healthcare devices, mobile batteries, and more.

In addition to two USB 2.0 (full speed) host channels or one function channel, the RL78/G1C microcontrollers are compliant with Battery Charging Specification 1.2 (BC 1.2) for high-speed battery charging. These microcontrollers are suitable for office equipment that connect via USB such as a printer, mouse, and keyboard, as well as for USB chargers for healthcare devices, mobile batteries, and more.