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EPM570GT100C4N, CPLD MAX II Flash 440 Cells, 76 I/O, 57 Labs, ISP, 1.71 → 1.89 V 100-Pin TQFP

TQFP-32

EP4CE30F29C6N, FPGA Cyclone 28848 Cells, 28848 Gates, 608256, 1803 Blocks, 1.15 → 1.25 V 780-Pin FBGA

23 X 23 MM, 2.60 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-484

EP1C3T100C8N, FPGA Cyclone 2910 Cells, 59904bit, 291 Blocks, 1.425 → 1.575 V 100-Pin TQFP

5M570ZT144C4N, CPLD MAX V Flash 440 Cells, 114 I/O, 570 Labs, 9.5ns, ISP, 1.71 → 1.89 V 144-Pin TQFP

5M2210ZF256C4N, CPLD MAX V Flash 1700 Cells, 203 I/O, 2210 Labs, 9.1ns, ISP, 1.71 → 1.89 V 256-Pin FBGA

5M1270ZT144C4N, CPLD MAX V Flash 980 Cells, 114 I/O, 1270 Labs, 8.1ns, ISP, 1.71 → 1.89 V 144-Pin TQFP

Cooper Bussmann 300F ±10% 7mΩ 2.5 V Through Hole Electric Double Layer Capacitor Supercap XB

Cooper Bussmann 10A F Surface Mount Fuse, 125 V ac, 72 V dc

Cooper Bussmann 1A Surface Mount Fuse, 1000 V dc

Cooper Bussmann 0.5A Radial F Leaded PCB Mount Fuse, 250 V ac, 450 V dc

Cooper Bussmann 0.1F -20 → +80% 4Ω 5 V Through Hole Electric Double Layer Capacitor Supercap PB

Cooper Bussmann 100F Electric Double Layer Capacitor -10 → +30% Tolerance Supercap HV Series 2.7V dc Through Hole

Cooper Bussmann 10F -10 → +30% 34mΩ 2.7 V Through Hole Electric Double Layer Capacitor Supercap HV

Cooper Bussmann HCM0703 Series Shielded Wire-wound SMD Inductor with a Composite Iron Powder Core, 2.82 μH ±20% 10A Idc

Cooper Bussmann DRA Series Shielded Wire-wound SMD Inductor with a Ferrite Core, 82 μH ±20% 3.84A Idc

Cooper Bussmann DRA Series Shielded Wire-wound SMD Inductor with a Ferrite Core, 330 μH ±20% 1.93A Idc

Cooper Bussmann DRA Series Shielded Wire-wound SMD Inductor with a Ferrite Core, 100 μH ±20% 3.46A Idc

Cooper Bussmann DR73/74/125/127 Series Shielded Wire-wound SMD Inductor with a Ferrite Core, 6.8 μH ±20% 3.67A Idc