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N+1 and ORing Power Rail Controller with Enable -40°C ~ 85°C 3V ~ 16.5V 4.25 mA 4.25 mA Delay Time - OFF 130 ns

Use the download button to access the TPS23757PWR schematic symbol, PCB footprint, and 3D model.

Power Over Ethernet Controller 1 Channel 802.3at (PoE+), 802.3af (PoE) 20-HTSSOP , 0V ~ 57V ,920µA , -40°C ~ 125°C

IEEE 802.3-2005 PoE Interface and Isolated Converter Controller with Enhanced ESD Ride-Through

3-13V Dual HotSwap IC w/ Independent Channel Circuit Breaking & Power Good Report, Act-Low Enable

Use the download button to access the TPS22922YZPR schematic symbol and PCB footprint.

LOAD SWITCH

Texas Instruments TPS22904YFPR is a single-channel load switch operating from 1.1 V to 3.6 V with 68 mΩ on-resistance and 500 mA continuous output current. Quick output discharge and ultra-small 4-ball DSBGA package minimize power loss and PCB space. Available from stock worldwide with fast shipping.

ULTRA SMALL, LOW INPUT VOLTAGE, LOW rON, LOAD SWITCHES

Power Switch/Driver 3:2 1A 20-HTSSOP

Use the download button to access the TPS2101DBVR schematic symbol, PCB footprint, and 3D model.

TPS2065DBVR is a single-channel, 1A current-limited power distribution switch optimized for USB applications. Features undervoltage lockout, 2.7V–5.5V input range, and overload protection. From $0.62, in stock with worldwide shipping.

The TPS2061DGNR is a single-channel 1A current-limited high-side power distribution switch from Texas Instruments with 2.7V to 5.5V input range and undervoltage lockout. It provides overcurrent and thermal protection in a compact 8-pin SOIC package. Available from stock with worldwide shipping.

Dual 1.5A Current-Limited, Power Distribution Switch

2-ch, 1.5A loading, 2.7-5.5V, 70mΩ USB power switch, active-low, reverse blocking

Use the download button to access the TPS2044BDR schematic symbol, PCB footprint, and 3D model.

Use the download button to access the TPS2042BDR schematic symbol, PCB footprint, and 3D model.

Use the download button to access the TPS2041BDBVR schematic symbol, PCB footprint, and 3D model.