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The R8C/26 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu

The R8C/25 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu

The R8C/25 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu

The R8C/25 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu

The R8C/25 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu

The R8C/25 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu

The R8C/24 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1Mb of address space, it is capable of executing instructions at high speed. This MCU is equipped with one CAN module and s

The R8C/24 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1Mb of address space, it is capable of executing instructions at high speed. This MCU is equipped with one CAN module and s

The R8C/24 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1Mb of address space, it is capable of executing instructions at high speed. This MCU is equipped with one CAN module and s

The R8C/24 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1Mb of address space, it is capable of executing instructions at high speed. This MCU is equipped with one CAN module and s

The R8C/24 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1Mb of address space, it is capable of executing instructions at high speed. This MCU is equipped with one CAN module and s

The R8C/24 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1Mb of address space, it is capable of executing instructions at high speed. This MCU is equipped with one CAN module and s

RL78/L1C microcontrollers have a built-in segment LCD driver and USB 2.0 function. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.76 μANote 2, internal voltage boost: 1.23 μA, and capacitive split: 0.74 µA. They support USB high-speed battery charging (Battery Charging Specification 1.2) and com

RL78/L1C microcontrollers have a built-in segment LCD driver and USB 2.0 function. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.76 μANote 2, internal voltage boost: 1.23 μA, and capacitive split: 0.74 µA. They support USB high-speed battery charging (Battery Charging Specification 1.2) and com

RL78/L1C microcontrollers have a built-in segment LCD driver and USB 2.0 function. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.76 μANote 2, internal voltage boost: 1.23 μA, and capacitive split: 0.74 µA. They support USB high-speed battery charging (Battery Charging Specification 1.2) and com

RL78/L1C microcontrollers have a built-in segment LCD driver and USB 2.0 function. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.76 μANote 2, internal voltage boost: 1.23 μA, and capacitive split: 0.74 µA. They support USB high-speed battery charging (Battery Charging Specification 1.2) and com

RL78/G10 microcontrollers realize the industry's lowest level of consumption current (CPU: 46 μA/MHz, standby (STOP): 560 nA). With an on-chip oscillator, A/D converter, comparator, and more, and a 10/16-pin package lineup, they support more compact system size. These low pin count microcontrollers are perfect for small consumer electronics.

RL78/G10 microcontrollers realize the industry's lowest level of consumption current (CPU: 46 μA/MHz, standby (STOP): 560 nA). With an on-chip oscillator, A/D converter, comparator, and more, and a 10/16-pin package lineup, they support more compact system size. These low pin count microcontrollers are perfect for small consumer electronics.

RL78/G10 microcontrollers realize the industry's lowest level of consumption current (CPU: 46 μA/MHz, standby (STOP): 560 nA). With an on-chip oscillator, A/D converter, comparator, and more, and a 10/16-pin package lineup, they support more compact system size. These low pin count microcontrollers are perfect for small consumer electronics.

RL78/G10 microcontrollers realize the industry's lowest level of consumption current (CPU: 46 μA/MHz, standby (STOP): 560 nA). With an on-chip oscillator, A/D converter, comparator, and more, and a 10/16-pin package lineup, they support more compact system size. These low pin count microcontrollers are perfect for small consumer electronics.