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TSSOP, TSOP5/6,.11,37

DiodesZetex 74AHC1G126W5-7, Buffer, Driver 3-State, Non-Inverting, 2 → 5.5 V, 5-Pin SOT-25

Fairchild Semiconductor NC7SZ32M5, 2-Input OR Logic Gate, 1.65 → 5.5 V, 5-Pin SOT-23

Fairchild Semiconductor NC7SZ08P5, 2-Input AND Logic Gate, 1.65 → 5.5 V, 5-Pin SC-70

Hirose HIF6 Series, 2.54mm Pitch 68 Way 2 Row Straight PCB Header, Solder Termination, 0.5A

Broad VCC Operating Range; 2V-6V ; Balanced Output Drive; 2 mA IOL, -2 mA IOH; Space saving SOT23 or SC70 5-lead package ; Balanced Propagation Delays ; Low Quiescent Power; ICC < 1 µA; Ultra small MicroPak™ Pb-Free leadless package; High Speed; tPD 3.5 ns typ; Specified for 3V operation

12.8A, 100V, RDS(on) = 180mΩ(Max.) @VGS = 10 V, ID = 6.4A; 100% avalanche tested; Low Crss ( Typ. 20pF); 175°C maximum junction temperature rating; Low gate charge ( Typ. 8.7nC)

Bushold data inputs eliminate the need for external pull-up resistors to hold unused inputs (74LVTH245), also available without bushold feature (74LVT245); ESD performance:Human-body model > 2000VMachine model > 200VCharged-device model > 1000V; Latch-up performance exceeds 500 mA; Outputs source/sink, -32 mA/+64 mA ; Power Up/Down high impedance provides glitch-free bus loading; Live insertion/extraction permitted; Input and output interface capability to systems at 5V VCC

Gate-Source Zener for ESD ruggedness (>6kV Human Body Model). ; P-Ch -0.14 A, -25 V, RDS(ON) = 10 Ω @ VGS= -4.5 V, RDS(ON) = 13 Ω @ VGS= -2.7 V. ; Very small package outline SC70-6. ; Very low level gate drive requirements allowing direct operation in 3 V circuits (VGS(th) < 1.5 V). ; N-Ch 0.22 A, 25 V, RDS(ON) = 4.0 Ω @ VGS= 4.5 V, RDS(ON) = 5.0 Ω @ VGS= 2.7 V.

Contact Features: Contact Mating Area Plating Material Gold Flash | Contact Underplating Material Nickel | Contact Size Size 20 | PCB Contact Termination Area Plating Material Gold Flash | Contact Base Material Copper Alloy | Contact Type Socket | Contact Current Rating (Max) 2 AMP | Mating Pin Diameter .04 INCH | Dimensions: Wire Size .2 – .6 MMSQ | Wire Size 24 – 20 AWG | Compatible Insulation Diameter Range .068 INCH | Identification Marking: Contact Color Code Red | Mechanical Attachment: Contact Re

Use the download button to access the HIF6-60PA-1.27DSA(71) schematic symbol, PCB footprint, and 3D model.

Hirose HIF6 Series, 2.54mm Pitch 60 Way 2 Row Right Angle PCB Header, Solder Termination, 0.5A

Use the download button to access the HIF6-50PA-1.27DS(71) schematic symbol, PCB footprint, and 3D model.

Use the download button to access the HIF3FC-40PA-2.54DSA(71) schematic symbol, PCB footprint, and 3D model.

Hirose FunctionMAX FX8 Series 0.6mm 80 Way 1 Row Vertical PCB Socket Surface Mount Board to Board

Use the download button to access the FX8-40S-SV(21) schematic symbol, PCB footprint, and 3D model.

Use the download button to access the FX8-40P-SV(91) schematic symbol, PCB footprint, and 3D model.

Use the download button to access the FX8-100S-SV(22) schematic symbol, PCB footprint, and 3D model.

Use the download button to access the FX30B-3S-7.62DSA schematic symbol, PCB footprint, and 3D model.

Use the download button to access the FX30B-3S-7.62DS schematic symbol, PCB footprint, and 3D model.