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ALS30, Aluminum, Aluminum Electrolytic, 470 uF, 20%, 500 VDC, -40/+85°C, 85°C, -40°C, 85°C, 18,000 Hrs, 194 mOhms, 4.62, 1,410 uA, 220 g, 51mm, 82mm, 156 Weeks

ROHS COMPLIANT, COMPACT PACKAGE-3

ROHS COMPLIANT, COMPACT PACKAGE-3

XC2S50-5PQG208C is a 2.5V 208 pins logic ic by XILINX. Key specs: 2.5V, 208 pins. From quote-based pricing, in stock with worldwide shipping for production sourcing.

SAMTEC - HTSW-106-08-T-S - HEADER, 2.54MM, VERTICAL THT, 6WAY

SC-79, 2 PIN

ROHS COMPLIANT, COMPACT PACKAGE-3

Samtec TSW Series Straight Through Hole Pin Header, 6-Contact, 2.54mm Pitch, 1-Row, Unshrouded

1.6 X 0.80 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, SMD, 2 PIN

Use the download button to access the 85513-5116 schematic symbol, PCB footprint, and 3D model.

Use the download button to access the BBS-106-G-A schematic symbol and PCB footprint.

YAGEO - RC0603FR-1022KL - RES, THICK FILM, 22K, 1%, 0.1W, 0603

SAMTEC - BBS-106-T-A - Board-To-Board Connector, 2.54 mm, 6 Contacts, Header, BBS Series, Solder, 1 Rows

Use the download button to access the HTSW-106-07-T-S schematic symbol, PCB footprint, and 3D model.

CONN HEADER, 2.54MM, THT VERT, 6 WAY

LDB, Film, Metallized PPS Stacked, General Purpose, 0.1 uF, 5%, 50 VDC, 125°C, -55°C, 125°C, 0.6 % , 3 GOhms, 0.267 g, 1812, 4.7mm, 3.3mm, 2mm, 3000, 104 Weeks

BOURNS - CR0603-FX-2202ELF - RES, THICK FILM, 22K, 1%, 0.1W, 0603

YAGEO (PHYCOMP) - RC0603FR-0722KL - RES, THICK FILM, 22K, 1%, 0.1W, 0603

LDB, Film, Metallized PPS Stacked, General Purpose, 0.1 uF, 2%, 50 VDC, 125°C, -55°C, 125°C, 0.6 % , 3 GOhms, 0.267 g, 1812, 4.7mm, 3.3mm, 2mm, 3000, 104 Weeks