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Gate Drivers 3.75 kV opto-driver replacement in PDIP8

Thick Film Resistors - SMD 10.2K 1%

TISON-8

CONN HEADER VERT 14POS 2.54MM

TLI4970-D050T4 is a Infineon integrated circuit component for OEM assemblies, repairs, and production sourcing. Key specs include SMALL package, 8 pins, 61A. Available through RFQ pricing, in-stock sourcing, and worldwide shipping support.

Use the download button to access the 0900BL18B100E schematic symbol, PCB footprint, and 3D model.

GREEN, PLASTIC PACKAGE-2

Thick Film Resistors - SMD 510K 1%

Thick Film Resistors - SMD 10.5K 1%

Piezo Buzzers & Audio Indicators 70DB 4.00KHZ 12.0MM

TDK 3-30 V dc PCB Mount High External Piezo Buzzer, Maximum of 4 kHz

NFZ2MSM_N10L Series EMI Suppression Filter 300Ω±25% at 100MHz 3.1A 0.024Ω (Typ.)

Use the download button to access the UX60SC-MB-5ST(80) schematic symbol, PCB footprint, and 3D model.

Use the download button to access the 690-005-299-043 schematic symbol, PCB footprint, and 3D model.

WT12-A-AI5 is a Class 2 Bluetooth 2.1+EDR module by Silicon Labs. Key specs: chip antenna and iWRAP 5.0 firmware. From quote-based pricing, in stock with worldwide shipping.

Slide Switches SPST 125VAC 11A

TLP281-4(GB-TP,J,F is a Toshiba integrated circuit component for OEM assemblies, repairs, and production sourcing. Key specs include Small package, 16 pins, 61A. Available through RFQ pricing, in-stock sourcing, and worldwide shipping support.

Body Features: Primary Product Color Blue | Primary Product Material Silicone Rubber | Dimensions: Wire Size .12 – .8 MMSQ | Compatible Insulation Diameter Range 1.27 – 2.11 MM | Compatible Insulation Diameter Range .05 – .083 INCH | Wire Size 18 – 26 AWG | Packaging Features: Packaging Quantity 1600 | Packaging Method Bag | Product Type Features: Connector Seal & Plug Type Gang Wire Seal | Usage Conditions: Operating Temperature (Max) 194 DEGF | Operating Temperature (Max) 90 DEGC | Operating Tempe

Body Features: Sleeve Material Copper | Sleeve Plating Material Tin | Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Mating Area Plating Material Thickness 30 MICM | Contact Current Rating (Max) 4 AMP | Contact Spring Plating Thickness .762 MICM | Contact Spring Plating Material Gold | Contact Spring Plating Thickness 30 MICIN | Contact Base Material Beryllium Copper | Contact Mating Area Plating Material Thickness 30 MICIN | Dimensions: Wire Size .081 â€

Body Features: Primary Product Material Silicone Rubber | Primary Product Color Blue | Dimensions: Compatible Insulation Diameter Range 1.27 – 2.11 MM | Compatible Insulation Diameter Range .05 – .083 INCH | Wire Size 18 – 26 AWG | Wire Size .12 – .8 MMSQ | Packaging Features: Packaging Method Bag | Packaging Quantity 1600 | Product Type Features: Connector Seal & Plug Type Gang Wire Seal | Usage Conditions: Operating Temperature Range -40 – 90 DEGC | Operating Temperature (Max) 90 DEGC | Operatin